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ISO7760FDBQ

Texas Instruments

ISO7760FDBQ by Texas Instruments

ISO7760FDBQ by Texas Instruments is a 16-terminal IC with 6 functions, operating b/w -55 to 125°C. It has a supply voltage range of 2.25-5.5V and uses CMOS technology. Ideal for military applications, it features a small outline package with dual terminals and Gull Wing form factor.

Median Price

$4.400

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,524 parts In-Stock

1+ parts

$3.588

100+ parts

$3.144

1k+ parts

$1.776

10k+ parts

-

1,524

$3.588

$3.144

$1.776

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Mouser Electronics

USA . 663 parts In-Stock

1+ parts

$4.400

100+ parts

$2.710

1k+ parts

$2.550

10k+ parts

$2.540

663

$4.400

$2.710

$2.550

$2.540

DigiKey

USA . 564 parts In-Stock

1+ parts

$4.930

100+ parts

$3.187

1k+ parts

$2.876

10k+ parts

-

564

$4.930

$3.187

$2.876

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$2.664

100+ parts

-

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100

$2.664

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Digiode

USA . 3,496 parts In-Stock

1+ parts

$3.409

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3,496

$3.409

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Chip Stock

USA . 6,500 parts In-Stock

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6,500

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Vyrian

USA . 692 parts In-Stock

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692

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Elcom Components

USA . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,735 parts In-Stock

1+ parts

$2.664

100+ parts

-

1k+ parts

-

10k+ parts

$2.611

4,735

$2.664

-

-

$2.611

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$2.664

100+ parts

-

1k+ parts

$2.531

10k+ parts

$2.478

1,000

$2.664

-

$2.531

$2.478

Argo Parts USA

USA . 10 parts In-Stock

1+ parts

$2.664

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-

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10

$2.664

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Ampacity Inc.

Singapore . 659 parts In-Stock

1+ parts

$3.050

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$3.050

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Corphita

USA . 2,007 parts In-Stock

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$3.229

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2,007

$3.229

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Corohmni

South Africa . 310 parts In-Stock

1+ parts

$3.768

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310

$3.768

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$5.037

100+ parts

$4.785

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$4.785

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100

$5.037

$4.785

$4.785

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Semicontronic

India . 855 parts In-Stock

1+ parts

$6.640

100+ parts

$6.474

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$6.441

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855

$6.640

$6.474

$6.441

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Parana Technologies

USA . 171 parts In-Stock

1+ parts

$7.716

100+ parts

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$8.249

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171

$7.716

-

$8.249

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DigiPath Technology Company

USA . 69 parts In-Stock

1+ parts

$8.497

100+ parts

$7.817

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69

$8.497

$7.817

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ChromeModa Solutions

Germany . 5,319 parts In-Stock

1+ parts

$8.670

100+ parts

$7.109

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5,319

$8.670

$7.109

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IDEA Electronic Components Group

UK . 797 parts In-Stock

1+ parts

$8.670

100+ parts

$8.236

1k+ parts

$7.803

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797

$8.670

$8.236

$7.803

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Authorized Procurement Solutions

USA . 3,600 parts In-Stock

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3,600

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Alle Elektronik GmbH

Germany . 3,155 parts In-Stock

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3,155

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Lixinc

USA . 337 parts In-Stock

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337

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Overview

Enhance your electronics projects with the Texas Instruments ISO7760FDBQ. This high-quality interface IC offers reliability and performance that you can trust. With its versatile applications in various industries, this product provides seamless integration and efficient functionality. Trust Texas Instruments to deliver top-notch products that exceed expectations. Elevate your projects with the ISO7760FDBQ and experience the value and benefits it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

This feature allows for easy integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle a wide range of power inputs.

No. of Functions: 6

The multiple functions offered by this product provide versatility and efficiency in various applications.

Package Shape: RECTANGULAR

The rectangular shape of the package ensures compatibility with standard PCB layouts.

No. of Terminals: 16

The ample number of terminals allows for seamless connections and enhanced functionality.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design optimizes space usage on circuit boards.

Minimum Supply Voltage: 2.25 V

With a low minimum supply voltage, this product is energy efficient and suitable for battery-powered applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in various environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature extends the product's usability in harsh conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit design and installation options.

Maximum Seated Height: 1.75 mm

The low seated height minimizes profile height for compact designs.

Width: 3.895 mm

The narrow width of the product saves space on the PCB for efficient layout designs.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time requirement simplifies the manufacturing process and reduces production time.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for secure solder joints and reliable connections.

Length: 4.905 mm

The compact length of the product ensures compatibility with various board sizes.

Temperature Grade: MILITARY

The military-grade temperature rating signifies robust performance and durability in extreme conditions.

No. of Channels: 6

The six channels offer ample connectivity options for diverse system requirements.

Technology: CMOS

The CMOS technology ensures low power consumption and high-speed operation for efficient performance.

Terminal Form: GULL WING

The gull-wing terminal form enables easy soldering and secure connections during assembly.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage provides a stable operating range for consistent performance.

Terminal Pitch: 0.635 mm

The fine terminal pitch allows for densely populated PCB layouts and compact designs.

Moisture Sensitivity Level (MSL): 2

The MSL rating indicates the product's tolerance to moisture exposure during handling and storage.

Interface IC Type: INTERFACE CIRCUIT

This product serves as an efficient interface circuit for seamless communication between various components.

Technical Specifications

Other Function Interface ICs ISO7760FDBQ attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

6

No. of Functions:

6

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

ISO7760FDBQ Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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