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LC75828T

Onsemi

LC75828T by Onsemi

LC75828T by Onsemi is an 80-terminal CMOS IC with a max supply current of 0.6mA. It operates in industrial temperature range (-40 to 85 °C) and has 55 segments for segment display applications. The package style is flatpack, making it suitable for surface mount applications.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

< 1k

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Vyrian

USA . 204 parts In-Stock

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Digiode

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TANS Electronics

Latvia . 3,612 parts In-Stock

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Kulean Microsystems

USA . 3,487 parts In-Stock

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SupplyDigital Components

Austria . 1,887 parts In-Stock

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Corphita

USA . 1,051 parts In-Stock

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UHIMA Technologies

Türkiye . 437 parts In-Stock

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Corohmni

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Problanco Electronics

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Overview

Elevate your product designs with the LC75828T by Onsemi, a cutting-edge Other Function Interface IC that sets new standards for quality and performance. With Onsemi's reputation for excellence in semiconductor manufacturing, this product delivers unmatched reliability and durability. Ideal for a variety of applications, the LC75828T offers customers incredible value with its advanced features and benefits. Experience seamless integration, enhanced functionality, and improved efficiency with this innovative solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Display Mode: SEGMENT

Segment display mode allows for clear and easy-to-read information display, making it user-friendly.

Surface Mount: YES

Surface mount capability enables easy and efficient installation on PCBs, reducing assembly time and costs.

Power Supplies (V): 3/5

Support for multiple power supply voltages (3V and 5V) increases compatibility with various systems and components.

No. of Terminals: 80

High number of terminals provide flexibility in connecting to other components and peripherals, expanding functionality.

Package Style (Meter): FLATPACK

Flatpack package style offers space-saving design, ideal for compact electronics and applications with limited space.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold environments without compromising functionality.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing overall performance and efficiency.

Maximum Supply Current: 0.6 mA

Low maximum supply current consumption helps in reducing power usage, making the product energy-efficient.

No. of Segments: 55

With 55 segments, the product offers versatility in displaying various types of data and information.

Terminal Pitch: 0.5 mm

Small terminal pitch enables high-density mounting, allowing for more compact and efficient PCB designs.

Technical Specifications

Other Function Interface ICs LC75828T attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Display Mode:

SEGMENT

JESD-30 Code:

S-PQFP-G80

No. of Backplanes:

10-BP

No. of Segments:

55

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.6 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC75828T Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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