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LC75828E

Onsemi

LC75828E by Onsemi

LC75828E by Onsemi is a CMOS IC with 80 terminals in a square flatpack package. It operates at -40 to 85 °C, drawing 0.6mA at 3/5V. Ideal for industrial applications requiring segment display mode and Gull Wing terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,374 parts In-Stock

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Digiode

USA . 678 parts In-Stock

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Problanco Electronics

Mexico . 4,364 parts In-Stock

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Kulean Microsystems

USA . 1,381 parts In-Stock

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TANS Electronics

Latvia . 1,194 parts In-Stock

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Corphita

USA . 864 parts In-Stock

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UHIMA Technologies

Türkiye . 790 parts In-Stock

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SupplyDigital Components

Austria . 639 parts In-Stock

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Corohmni

South Africa . 198 parts In-Stock

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Overview

Unlock the endless possibilities with the Onsemi LC75828E, a high-quality Other Function Interface IC designed to revolutionize your electronic projects. Manufactured by Onsemi, a trusted name in the industry known for their commitment to excellence, this product offers unparalleled value and benefits to customers. Ideal for a wide range of applications, this versatile IC boasts a segment display mode, surface mount capability, and a compact design perfect for space-constrained projects. Experience the advantage of reliable performance and innovative technology with the LC75828E from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the internal components of the IC, ensuring longevity and reliability.

Display Mode: SEGMENT

The segment display mode allows for clear and easy-to-read information output, making it user-friendly and suitable for various applications.

Surface Mount: YES

Being surface mountable enables easy and efficient installation onto circuit boards, saving space and simplifying the assembly process.

Power Supplies (V): 3/5

Support for multiple power supply options (3V/5V) provides flexibility in system design and compatibility with different voltage requirements.

No. of Terminals: 80

With a high number of terminals, this IC offers comprehensive connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact and space-saving design, ideal for applications where board space is limited.

No. of Backplanes: 10-BP

Having 10 backplanes allows for versatile configuration and integration with multi-level systems, enhancing the IC's adaptability and functionality.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environments and industrial applications, making this IC suitable for rugged use.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, resulting in efficient performance and improved reliability of the IC.

Terminal Form: GULL WING

The gull wing terminal form provides secure mechanical attachment and easy soldering, contributing to the durability and ease of assembly of the IC.

Technical Specifications

Other Function Interface ICs LC75828E attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Display Mode:

SEGMENT

JESD-30 Code:

S-PQFP-G80

No. of Backplanes:

10-BP

No. of Segments:

55

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.68SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.6 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Trade Compliance

LC75828E Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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