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LC75834W

Onsemi

LC75834W by Onsemi

LC75834W by Onsemi is a 48-terminal IC with 136 segments, operating at -40 to 85 °C. It has a power supply of 3/5V and consumes 0.46mA max current. Ideal for industrial applications requiring segment display in a square package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 536 parts In-Stock

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Digiode

USA . 301 parts In-Stock

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301

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TANS Electronics

Latvia . 4,519 parts In-Stock

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Problanco Electronics

Mexico . 3,794 parts In-Stock

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Kulean Microsystems

USA . 2,130 parts In-Stock

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SupplyDigital Components

Austria . 1,688 parts In-Stock

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UHIMA Technologies

Türkiye . 763 parts In-Stock

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Corohmni

South Africa . 335 parts In-Stock

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Corphita

USA . 157 parts In-Stock

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Overview

Enhance your electronic designs with the high-quality LC75834W by Onsemi. As a leading manufacturer in the industry, Onsemi delivers reliable and innovative solutions for various applications. The LC75834W offers unparalleled value with its seamless integration, efficient power supplies, and durable package body material. With 136 segments and 48 terminals, this product is perfect for creating stunning displays with ease. Elevate your projects with the LC75834W and experience the benefits of top-notch performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the integrated circuits, ensuring a longer lifespan for the product.

Display Mode: SEGMENT

Segment display mode allows for clear and easy-to-read information display, making it user-friendly.

Surface Mount: YES

Surface mount technology enables easy integration onto circuit boards, saving space and simplifying assembly.

Power Supplies (V): 3/5

This product supports both 3V and 5V power supplies, offering flexibility in different circuit configurations.

No. of Terminals: 48

Having a sufficient number of terminals allows for versatile connections and functionalities in the circuit design.

Package Style (Meter): FLATPACK

The flatpack package style provides a compact and efficient design, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without compromising performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Other Function Interface ICs LC75834W attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Display Mode:

SEGMENT

JESD-30 Code:

S-PQFP-G48

No. of Backplanes:

4-BP

No. of Segments:

136

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.46 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC75834W Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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