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ISO7231MDWRG4

Texas Instruments

ISO7231MDWRG4 by Texas Instruments

ISO7231MDWRG4 by Texas Instruments is a small outline interface IC with 3 functions. It operates at a supply voltage range of 3.3V to 5V and has a temperature grade suitable for automotive applications. Its compact size, high operating temperature, and moisture sensitivity level make it ideal for various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,891 parts In-Stock

1+ parts

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7,891

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Chip Stock

USA . 3,275 parts In-Stock

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3,275

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Digiode

USA . 2,334 parts In-Stock

1+ parts

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2,334

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Component Sense

UK . 746 parts In-Stock

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746

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$5.426

100+ parts

$5.155

1k+ parts

$5.155

10k+ parts

-

60

$5.426

$5.155

$5.155

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AZTECH Wire

Italy . 884 parts In-Stock

1+ parts

$7.362

100+ parts

-

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884

$7.362

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Parana Technologies

USA . 2,270 parts In-Stock

1+ parts

$11.060

100+ parts

-

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$11.522

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2,270

$11.060

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$11.522

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Corohmni

South Africa . 327 parts In-Stock

1+ parts

$11.254

100+ parts

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327

$11.254

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ChromeModa Solutions

Germany . 6,342 parts In-Stock

1+ parts

$12.427

100+ parts

$10.190

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6,342

$12.427

$10.190

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IDEA Electronic Components Group

UK . 695 parts In-Stock

1+ parts

$12.427

100+ parts

$11.806

1k+ parts

$11.184

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695

$12.427

$11.806

$11.184

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One Stop Electronics

USA . 1,510 parts In-Stock

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$19.500

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1,510

$19.500

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Semicontronic

India . 418 parts In-Stock

1+ parts

$30.500

100+ parts

$29.738

1k+ parts

$29.585

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418

$30.500

$29.738

$29.585

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Ampacity Inc.

Singapore . 1,535 parts In-Stock

1+ parts

$49.500

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1,535

$49.500

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Continental Prestige Electronics

USA . 5,087 parts In-Stock

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5,087

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Corphita

USA . 3,013 parts In-Stock

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3,013

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Argo Parts USA

USA . 2,618 parts In-Stock

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2,618

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DigiPath Technology Company

USA . 2,173 parts In-Stock

1+ parts

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100+ parts

$11.204

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2,173

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$11.204

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Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

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100

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Overview

Experience the next level of performance and reliability with the ISO7231MDWRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional quality and cutting-edge technology in their products. The ISO7231MDWRG4 falls under the category of Other Function Interface ICs, offering versatility for a wide range of applications. With its compact size and surface mount capability, this IC is designed to seamlessly integrate into various electronic systems. Whether you're working on automotive projects or other high-demand applications, the ISO7231MDWRG4 provides unmatched value, benefits, and advantages. Trust Texas Instruments to deliver the solutions you need for your most demanding projects.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This product is made of durable plastic/epoxy material, ensuring its reliability and longevity.

Surface Mount:

YES - The surface mount feature allows for easy and efficient installation onto circuit boards or other components.

Maximum Supply Voltage:

5 V - With a maximum supply voltage of 5 V, this product can operate effectively even with high power requirements.

No. of Functions:

3 - The inclusion of three different functions in a single package offers versatility and cost-efficiency.

Package Shape:

RECTANGULAR - The rectangular package shape makes it convenient to fit into various devices and circuit layouts.

No. of Terminals:

16 - With 16 terminals, there are ample connection points for interfacing with other components or systems.

Package Style (Meter):

SMALL OUTLINE - The small outline package style saves space and is suitable for compact applications.

Minimum Supply Voltage:

3.3 V - This product can operate efficiently even with lower supply voltages, making it adaptable to various power sources.

Maximum Operating Temperature:

125 °C - The high maximum operating temperature allows for reliable operation in demanding environments.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature ensures the product can function effectively in extreme cold conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - The use of nickel palladium gold terminal finish enhances the product's conductivity and corrosion resistance.

Terminal Position:

DUAL - The dual terminal position enables flexible component placement and connection options.

Maximum Seated Height:

2.65 mm - The compact maximum seated height makes this product compatible with thin form factors and space-constrained designs.

Width:

7.5 mm - The narrow width allows for easy integration into tight spaces without sacrificing functionality.

Maximum Time At Peak Reflow Temperature (s):

30 - The product can withstand the peak reflow temperature for up to 30 seconds, making it suitable for high-temperature assembly processes.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature tolerance ensures reliable soldering during manufacturing.

Length:

10.3 mm - The moderate length of the product enables easy integration into various system designs.

Temperature Grade:

AUTOMOTIVE - This product is designed to meet automotive-grade temperature requirements, ensuring its durability in automotive applications.

No. of Channels:

3 - With three channels, this product can handle multiple input or output signals simultaneously.

Technology:

CMOS - The use of CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of systems.

Terminal Form:

GULL WING - The gull wing terminal form offers reliable contact and secure solder joints, enhancing the product's overall performance.

Nominal Supply Voltage:

3.3 V - The nominal supply voltage of 3.3 V provides a standard operating range for the product, making it compatible with many systems.

Terminal Pitch:

1.27 mm - The tight terminal pitch allows for a higher density of connections, maximizing functionality in limited space.

Moisture Sensitivity Level (MSL):

2 - This product has a moisture sensitivity level of 2, indicating it can withstand moderate exposure to moisture without compromising performance.

Interface IC Type:

INTERFACE CIRCUIT - This product's interface circuit type ensures seamless communication and compatibility between different components or systems.

Technical Specifications

Other Function Interface ICs ISO7231MDWRG4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 5 V FOR NORMAL OPERATION

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

3

No. of Functions:

3

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO7231MDWRG4 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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