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LC75804E

Onsemi

LC75804E by Onsemi

LC75804E by Onsemi is a CMOS IC with 76 segments, operating at 5V. It features GULL WING terminals, flatpack style, and can handle temperatures from -40 to 85 °C. Ideal for industrial applications requiring segment display mode in a rectangular package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Digiode

USA . 356 parts In-Stock

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Vyrian

USA . 236 parts In-Stock

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Kulean Microsystems

USA . 6,576 parts In-Stock

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TANS Electronics

Latvia . 6,406 parts In-Stock

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Corphita

USA . 1,984 parts In-Stock

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Problanco Electronics

Mexico . 1,293 parts In-Stock

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UHIMA Technologies

Türkiye . 531 parts In-Stock

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SupplyDigital Components

Austria . 305 parts In-Stock

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Corohmni

South Africa . 149 parts In-Stock

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Overview

Elevate your electronics projects with the LC75804E by Onsemi, a high-quality Other Function Interface IC that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this IC is perfect for a wide range of applications. With its innovative design and cutting-edge technology, the LC75804E delivers exceptional value and benefits to customers, making it the ideal choice for your next project. Experience the advantages of seamless integration, superior functionality, and ease of use with the LC75804E from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for applications where weight and ruggedness are important factors.

Display Mode: SEGMENT

The segmented display mode allows for clear and precise information to be displayed, making it suitable for applications where readability is crucial.

Surface Mount: YES

The surface mount capability makes installation of the product easy and efficient, saving time and reducing the overall footprint of the device on a PCB.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of board space and easy integration into existing designs.

Power Supplies (V): 5

Operating at 5 volts makes the product compatible with a wide range of systems and ensures reliable performance.

No. of Terminals: 100

Having 100 terminals allows for versatile connectivity options, enabling the product to interface with various components and devices.

Package Style (Meter): FLATPACK

The flatpack package style offers high resistance to thermal and mechanical stress, ensuring stability and reliability in harsh operating conditions.

No. of Backplanes: 3/4-BP

The presence of 3/4 backplanes provides enhanced functionality and flexibility in system design and control.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows the product to operate effectively in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures reliable performance even in extreme cold conditions.

Terminal Position: QUAD

The quad terminal position enables efficient signal routing and connectivity, enhancing the overall functionality of the product.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can withstand harsh industrial environments without compromising performance.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, making it suitable for sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections during installation and operation, reducing the risk of signal interference or loss.

Maximum Supply Current: 0.54 mA

The low maximum supply current of 0.54 mA helps in reducing power consumption and keeping operating costs down.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5 volts ensures compatibility with standard power sources and simplifies integration into existing systems.

No. of Segments: 76

With 76 segments, the product can display a wide range of information and graphics, making it versatile for various applications.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635 mm allows for compact design and space-saving on the PCB, ideal for applications with limited board space.

Technical Specifications

Other Function Interface ICs LC75804E attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Display Mode:

SEGMENT

JESD-30 Code:

R-PQFP-G100

No. of Backplanes:

3/4-BP

No. of Segments:

76

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.54 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Trade Compliance

LC75804E Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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