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ISO7742FQDBQRQ1

Texas Instruments

ISO7742FQDBQRQ1 by Texas Instruments

ISO7742FQDBQRQ1 by Texas Instruments is a 16-terminal IC with 4 functions, operating b/w -40 to 125 °C. It has a CMOS technology and is AEC-Q100 compliant for automotive applications. The package style is small outline, shrink pitch, with nickel/palladium/gold terminal finish.

Median Price

$2.434

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,599 parts In-Stock

1+ parts

$1.669

100+ parts

$1.378

1k+ parts

$0.745

10k+ parts

-

13,599

$1.669

$1.378

$0.745

-

DigiKey

USA . 2,781 parts In-Stock

1+ parts

$3.200

100+ parts

$1.979

1k+ parts

$1.845

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-

2,781

$3.200

$1.979

$1.845

-

Mouser Electronics

USA . 536 parts In-Stock

1+ parts

$3.200

100+ parts

$1.980

1k+ parts

$1.800

10k+ parts

$1.700

536

$3.200

$1.980

$1.800

$1.700

Arrow

USA . 7,500 parts In-Stock

1+ parts

-

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-

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10k+ parts

$1.349

7,500

-

-

-

$1.349

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,706 parts In-Stock

1+ parts

$1.586

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1,706

$1.586

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Vyrian

USA . 7,290 parts In-Stock

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7,290

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Chip Stock

USA . 2,836 parts In-Stock

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2,836

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Nova Conductors

Japan . 82 parts In-Stock

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82

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Distributors (Availability)

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Ampacity Inc.

Singapore . 7,647 parts In-Stock

1+ parts

$1.150

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-

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7,647

$1.150

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Semicontronic

India . 7,328 parts In-Stock

1+ parts

$1.150

100+ parts

$1.121

1k+ parts

$1.116

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7,328

$1.150

$1.121

$1.116

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Corphita

USA . 411 parts In-Stock

1+ parts

$1.502

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411

$1.502

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Corohmni

South Africa . 151 parts In-Stock

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$11.161

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151

$11.161

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Parana Technologies

USA . 535 parts In-Stock

1+ parts

$12.610

100+ parts

-

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$13.065

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535

$12.610

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$13.065

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Advanced Electronics

New Zealand . 1,662 parts In-Stock

1+ parts

$13.073

100+ parts

$12.942

1k+ parts

$12.419

10k+ parts

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1,662

$13.073

$12.942

$12.419

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ChromeModa Solutions

Germany . 5,036 parts In-Stock

1+ parts

$14.168

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$11.618

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5,036

$14.168

$11.618

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IDEA Electronic Components Group

UK . 416 parts In-Stock

1+ parts

$14.168

100+ parts

$13.460

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$12.751

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416

$14.168

$13.460

$12.751

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Lixinc

USA . 17,308 parts In-Stock

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Continental Prestige Electronics

USA . 2,265 parts In-Stock

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2,265

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Argo Parts USA

USA . 1,644 parts In-Stock

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1,644

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DigiPath Technology Company

USA . 1,239 parts In-Stock

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$12.774

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1,239

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$12.774

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Elevate your automotive electronics with the Texas Instruments ISO7742FQDBQRQ1. Designed with precision and reliability in mind, this small outline interface circuit offers four functions in a compact package, making it perfect for a wide range of applications. With a temperature grade suitable for automotive use, advanced CMOS technology, and a moisture sensitivity level of 2, this IC is built to perform under challenging conditions. Trust Texas Instruments for quality and innovation that delivers exceptional value to customers seeking top-notch performance in their designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto a PCB.

Maximum Supply Voltage: 5.5 V

Higher maximum supply voltage provides flexibility in powering the device.

No. of Functions: 4

Having 4 functions in one IC simplifies circuit design and saves space on the board.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality, making it suitable for automotive applications.

Package Shape: RECTANGULAR

Rectangular package shape is space-efficient and easy to incorporate into designs.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and functionalities within the IC.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style saves space and allows for denser PCB layouts.

Minimum Supply Voltage: 2.25 V

Lower minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 125 °C

High maximum operating temperature makes it suitable for harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position allows for flexibility in PCB layout and routing.

Maximum Seated Height: 1.75 mm

Low seated height is beneficial for applications with limited vertical space.

Width: 3.895 mm

Compact width enables efficient use of board space.

Maximum Time At Peak Reflow Temperature (s): 30

Being able to withstand peak reflow temperature for 30 seconds ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures reliable solder joints and assembly process.

Length: 4.905 mm

Short length contributes to a compact and space-saving design.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliability and performance in automotive environments.

No. of Channels: 4

Having 4 channels allows for multiple input/output functionalities within the IC.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy surface mounting and soldering onto PCBs.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage provides consistent performance and operation.

Terminal Pitch: 0.635 mm

Narrow terminal pitch allows for higher density integration on the PCB.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates good moisture resistance, important for reliability in various environments.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically as an interface circuit, ensuring optimal performance and functionality in interfacing applications.

Technical Specifications

Other Function Interface ICs ISO7742FQDBQRQ1 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED (VCC2) 2.25-5.5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

ISO7742FQDBQRQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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