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LC75850

Onsemi

LC75850 by Onsemi

LC75850 by Onsemi is a CMOS IC with 52 segments, operating from -40 to 85 °C. With 64 terminals in a flatpack package, it's ideal for industrial applications requiring segment display mode and low power consumption at 3/8V supply voltage.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

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Digiode

USA . 417 parts In-Stock

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Problanco Electronics

Mexico . 7,302 parts In-Stock

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TANS Electronics

Latvia . 6,901 parts In-Stock

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Kulean Microsystems

USA . 5,821 parts In-Stock

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SupplyDigital Components

Austria . 5,102 parts In-Stock

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UHIMA Technologies

Türkiye . 656 parts In-Stock

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Corphita

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Corohmni

South Africa . 86 parts In-Stock

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Overview

Elevate your products with the LC75850 by Onsemi, a high-quality Other Function Interface IC designed to provide seamless display control in various applications. With Onsemi's reputation for reliability and innovation, you can trust that this product delivers unmatched performance and durability. From consumer electronics to automotive displays, this versatile IC offers exceptional value and benefits, ensuring smooth operation and enhanced functionality for your devices. Upgrade your designs with the LC75850 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/epoxy material ensures durability and resistance to environmental factors, making this product suitable for a wide range of applications.

Display Mode: SEGMENT

Segment display mode provides clear and easy-to-read information, enhancing user experience and visibility.

Surface Mount: YES

Surface mount design allows for easy installation and integration into various electronic devices.

Power Supplies (V): 3/8

Support for multiple power supply voltages makes this product versatile and compatible with different systems.

No. of Terminals: 64

Ample number of terminals for connectivity and interfacing with other components, increasing flexibility in design and application.

Package Style (Meter): FLATPACK

Flatpack package style is space-saving and facilitates efficient PCB layout, making it ideal for compact electronic devices.

No. of Backplanes: 3-BP

Multiple backplanes provide redundancy and enhance reliability, ensuring continuous operation in critical applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows this product to operate in harsh environments without performance degradation.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures proper functionality even in extreme cold climates, increasing the product's usability.

Terminal Position: QUAD

Quad terminal position facilitates easy installation and maintenance, simplifying integration into electronic systems.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in industrial environments with fluctuating temperatures and harsh conditions.

Technology: CMOS

CMOS technology offers low power consumption and high reliability, making this product energy-efficient and durable.

Terminal Form: GULL WING

Gull wing terminal form provides secure connection and ease of soldering, ensuring robust electrical connections for long-term use.

Maximum Supply Current: 0.2 mA

Low maximum supply current consumption minimizes power usage, contributing to energy efficiency and prolonged battery life in portable devices.

No. of Segments: 52

With 52 segments, this product offers ample display capabilities for showing a wide range of information and data to users.

Technical Specifications

Other Function Interface ICs LC75850 attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Display Mode:

SEGMENT

No. of Backplanes:

3-BP

No. of Segments:

52

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64(UNSPEC)

Package Style (Meter):

FLATPACK

Power Supplies (V):

3/8

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.2 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

LC75850 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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