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LC75842E

Onsemi

LC75842E by Onsemi

LC75842E by Onsemi is a CMOS IC with 27 segments, operating at -40 to 85 °C. It has a supply voltage of 5V and max current of 2mA. Ideal for industrial applications requiring segment display mode in a square flatpack package.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Digiode

USA . 1,546 parts In-Stock

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Vyrian

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ACDS - Activité Composants Distribution Service

France . 180 parts In-Stock

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TANS Electronics

Latvia . 7,472 parts In-Stock

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Problanco Electronics

Mexico . 6,633 parts In-Stock

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Kulean Microsystems

USA . 3,624 parts In-Stock

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SupplyDigital Components

Austria . 1,864 parts In-Stock

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UHIMA Technologies

Türkiye . 856 parts In-Stock

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Corphita

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Perfect Parts

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Corohmni

South Africa . 266 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 180 parts In-Stock

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Overview

Unlock the power of seamless interface integration with the LC75842E from Onsemi. As a leader in the industry, Onsemi delivers top-notch quality and reliability, ensuring that your devices operate at their peak performance. This versatile IC is perfect for a wide range of applications, offering unmatched value and benefits to customers looking for a cutting-edge solution. Experience the advantage of superior technology with the LC75842E and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the internal components of the IC, making it suitable for various industrial applications.

Display Mode: SEGMENT

Segment display mode allows for clear and easy-to-read output, making it ideal for applications where precise information display is crucial.

Surface Mount: YES

Surface mount capability enables easy and secure installation on PCBs, saving space and simplifying assembly process.

Power Supplies (V): 5

Operating at 5V supply voltage ensures compatibility with standard power sources, making it versatile for a wide range of applications.

No. of Terminals: 36

Having 36 terminals allows for flexibility in connections and interfacing with other components, increasing the functionality of the IC.

Package Style (Meter): FLATPACK

Flatpack package style provides compact and reliable packaging, suitable for applications where space is limited and thermal performance is critical.

No. of Backplanes: 2-BP

Having 2 backplanes enhances the IC's performance and functionality by allowing for multi-layered signal processing and control.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the IC can withstand high temperature environments, ensuring reliable operation in various conditions.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C makes the IC suitable for use in harsh environments or extreme temperature conditions, providing versatility and reliability.

Terminal Position: QUAD

Quad terminal position allows for efficient routing and connection of signals, enhancing the IC's performance and ease of use.

Temperature Grade: INDUSTRIAL

Industrial grade temperature range ensures reliable operation in demanding industrial applications, making the IC a dependable choice for critical functions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy efficient and reliable in various operating conditions.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections, minimizing the risk of signal loss or interruption, ensuring stable performance.

Maximum Supply Current: 2 mA

Low maximum supply current of 2 mA ensures efficient power consumption, making the IC suitable for battery-powered or energy-efficient applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making the IC easy to integrate into existing systems.

No. of Segments: 27

Having 27 segments allows for versatile display options and information output, making the IC suitable for applications that require complex data visualization.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635mm enables compact and efficient PCB layout design, allowing for dense integration of components in limited space.

Technical Specifications

Other Function Interface ICs LC75842E attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Display Mode:

SEGMENT

JESD-30 Code:

S-PQFP-G36

No. of Backplanes:

2-BP

No. of Segments:

27

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP36,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

2 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Trade Compliance

LC75842E Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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