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LC75811W

Onsemi

LC75811W by Onsemi

LC75811W by Onsemi is a CMOS IC with 80 terminals, operating b/w -40 °C to 85°C. It features 60 segments for segment display mode and requires a 5V power supply. This IC is ideal for industrial applications requiring a flatpack package style and gull wing terminal form in a square package body material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,091 parts In-Stock

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2,091

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Vyrian

USA . 1,862 parts In-Stock

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1,862

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Pegasus Components GmbH

Germany . 28 parts In-Stock

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28

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 901 parts In-Stock

1+ parts

$9.303

100+ parts

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901

$9.303

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GreenTree Electronics

Israel . 8,390 parts In-Stock

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8,390

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Kulean Microsystems

USA . 8,068 parts In-Stock

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8,068

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TANS Electronics

Latvia . 7,851 parts In-Stock

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7,851

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SupplyDigital Components

Austria . 4,199 parts In-Stock

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4,199

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Corphita

USA . 2,455 parts In-Stock

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2,455

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Problanco Electronics

Mexico . 1,346 parts In-Stock

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1,346

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UHIMA Technologies

Türkiye . 173 parts In-Stock

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173

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Overview

Upgrade your electronics with the LC75811W by Onsemi, a high-quality Other Function Interface IC that offers unmatched performance and reliability. With Onsemi's solid reputation for manufacturing excellence, you can trust that this product will meet your expectations. Ideal for a wide range of applications, this IC provides seamless integration and exceptional functionality. Experience the value and benefits of the LC75811W, ensuring your projects run smoothly and efficiently. Trust Onsemi to deliver top-notch solutions for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy body material provides durability and protection for the integrated circuits inside, ensuring longevity and reliability.

Display Mode: SEGMENT

Segment display mode allows for clear and easy-to-read visual output, making the product user-friendly.

Surface Mount: YES

Surface mount capability enables easy and secure installation on circuit boards, saving space and simplifying assembly.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in a variety of environments, increasing the product's versatility.

Nominal Supply Voltage: 5 V

Stable supply voltage of 5V ensures consistent power delivery to the integrated circuits, preventing damage and ensuring proper functionality.

No. of Segments: 60

Having 60 segments provides ample display options for showcasing information or data, enhancing the product's versatility and capabilities.

Technical Specifications

Other Function Interface ICs LC75811W attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Display Mode:

SEGMENT

JESD-30 Code:

S-PQFP-G80

No. of Backplanes:

8/10-BP

No. of Segments:

60

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC75811W Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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