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LC75804W

Onsemi

LC75804W by Onsemi

LC75804W by Onsemi is a CMOS interface IC with 76 segments, operating at 5V. It features GULL WING terminals, flatpack style, and operates in industrial temperature range (-40 to 85 °C). Ideal for applications requiring segment display mode in industrial settings.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

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Vyrian

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Problanco Electronics

Mexico . 4,716 parts In-Stock

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TANS Electronics

Latvia . 3,937 parts In-Stock

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Kulean Microsystems

USA . 3,003 parts In-Stock

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SupplyDigital Components

Austria . 1,371 parts In-Stock

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UHIMA Technologies

Türkiye . 809 parts In-Stock

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Corohmni

South Africa . 483 parts In-Stock

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Corphita

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Overview

Upgrade your electronic devices with the LC75804W by Onsemi, a high-quality Other Function Interface IC designed to enhance display performance. Onsemi's reputation for excellence ensures reliability and innovation in every product. This segment display mode allows for seamless integration into various applications, providing customers with unparalleled value and efficiency. Improve your technology with the LC75804W and experience the advantages of cutting-edge design and superior functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY as the package body material makes the product lightweight and durable.

Display Mode: SEGMENT

The SEGMENT display mode ensures clear and precise display of information.

Surface Mount: YES

Being surface mountable, this product is easy to integrate into a circuit board assembly.

Package Shape: SQUARE

The SQUARE package shape provides efficient use of space on the circuit board.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes it compatible with most electronic devices.

No. of Terminals: 100

Having 100 terminals allows for versatile connectivity options.

Package Style (Meter): FLATPACK

The FLATPACK package style offers convenience in installation and maintenance.

No. of Backplanes: 3/4-BP

Having 3/4 backplanes offers redundancy and robustness in operation.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product can withstand high temperature environments.

Minimum Operating Temperature: -40 °C

The product can also operate in extremely low temperature conditions down to -40 °C.

Terminal Position: QUAD

The QUAD terminal position simplifies installation and ensures accurate connection.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can perform reliably in demanding environments.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity.

Terminal Form: GULL WING

The GULL WING terminal form offers easy soldering and mechanical strength.

Maximum Supply Current: 0.54 mA

Consuming a maximum supply current of 0.54 mA, this product is energy-efficient.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources.

No. of Segments: 76

With 76 segments, this product can display a wide range of information with precision.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for high density mounting on a circuit board.

Technical Specifications

Other Function Interface ICs LC75804W attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Display Mode:

SEGMENT

JESD-30 Code:

S-PQFP-G100

No. of Backplanes:

3/4-BP

No. of Segments:

76

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.54 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC75804W Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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