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LC75816W

Onsemi

LC75816W by Onsemi

LC75816W by Onsemi is a CMOS IC with 65 segments, operating at 5V. It has a max supply current of 1mA and operates in industrial temperature range (-40 to 85 °C). This IC is used for segment display applications in various industries.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,283 parts In-Stock

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2,283

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Vyrian

USA . 1,564 parts In-Stock

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1,564

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,428 parts In-Stock

1+ parts

$76.644

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2,428

$76.644

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Kulean Microsystems

USA . 5,532 parts In-Stock

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5,532

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SupplyDigital Components

Austria . 3,070 parts In-Stock

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3,070

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Corphita

USA . 2,340 parts In-Stock

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2,340

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TANS Electronics

Latvia . 2,321 parts In-Stock

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2,321

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UHIMA Technologies

Türkiye . 845 parts In-Stock

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845

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Problanco Electronics

Mexico . 69 parts In-Stock

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Overview

Unlock a world of possibilities with the LC75816W by Onsemi. Designed with precision and reliability in mind, this product offers seamless integration and exceptional performance in various applications. From industrial automation to consumer electronics, this IC is the perfect solution for your needs. Experience the value and benefits of Onsemi's cutting-edge technology, providing you with the competitive edge you need to succeed. Elevate your projects with the LC75816W and discover the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and cost-effective, making the product easy to handle and affordable.

Display Mode: SEGMENT

Segment display provides clear and easy-to-read information, enhancing user experience.

Surface Mount: YES

Surface mount technology allows for easy installation and saves space on PCB.

Package Shape: SQUARE

Square shape is compact and ensures efficient use of board space.

Power Supplies (V): 5

Operating at 5V provides compatibility with common power sources and ensures stable performance.

No. of Terminals: 100

Having a high number of terminals allows for versatile connectivity options and functions.

Package Style (Meter): FLATPACK

Flatpack design is space-saving and suitable for applications where compact size is crucial.

No. of Backplanes: 10-BP

Having 10 backplanes allows for intricate and complex circuit designs.

Maximum Operating Temperature: 85 °C

Operational at high temperatures makes the product suitable for industrial applications with varying environmental conditions.

Minimum Operating Temperature: -40 °C

Capable of operating at low temperatures ensures reliable performance in harsh environments.

Terminal Position: QUAD

Quad position terminals provide stability and robust connectivity.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures durability and reliability in tough working conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall performance.

Terminal Form: GULL WING

Gull wing terminals are suitable for surface mount technology, ensuring secure connections and ease of installation.

Maximum Supply Current: 1 mA

Low supply current consumption helps in energy efficiency and prolongs battery life.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources.

No. of Segments: 65

Having 65 segments allows for displaying a wide range of information and data.

Terminal Pitch: 0.5 mm

Having a small terminal pitch of 0.5mm allows for high-density mounting and compact design.

Technical Specifications

Other Function Interface ICs LC75816W attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Display Mode:

SEGMENT

JESD-30 Code:

S-PQFP-G100

No. of Backplanes:

10-BP

No. of Segments:

65

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

1 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC75816W Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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