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LC75827E

Onsemi

LC75827E by Onsemi

LC75827E by Onsemi is a CMOS IC with 200 segments, suitable for industrial applications. It operates at temperatures ranging from -40 °C to 85°C and has a max supply current of 0.5mA. With a package style of flatpack and quad terminal position, it is designed for surface mount assembly in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 724 parts In-Stock

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Digiode

USA . 147 parts In-Stock

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TANS Electronics

Latvia . 7,630 parts In-Stock

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Problanco Electronics

Mexico . 5,683 parts In-Stock

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Kulean Microsystems

USA . 4,640 parts In-Stock

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SupplyDigital Components

Austria . 3,153 parts In-Stock

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Corphita

USA . 562 parts In-Stock

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Corohmni

South Africa . 475 parts In-Stock

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Kepictronics

USA . 331 parts In-Stock

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UHIMA Technologies

Türkiye . 63 parts In-Stock

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Overview

Unleash the power of innovation with the LC75827E by Onsemi. Crafted with precision and expertise, this cutting-edge product belongs to the category of Other Function Interface ICs, offering unparalleled quality and performance. Whether you're looking to enhance your display mode with seamless SEGMENT technology or streamline your operations with its 64 terminals and industrial-grade temperature grade, the LC75827E is the ultimate solution. Embrace the future of technology and elevate your projects with this versatile and reliable product from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the IC, ensuring a longer lifespan.

Display Mode: SEGMENT

Allows for segmented display of information, ideal for showing specific data in a clear manner.

Surface Mount: YES

Enables easy and secure mounting on circuit boards, saving space and simplifying assembly.

Power Supplies (V): 3/5

Compatibility with different power supply voltages makes this IC versatile for various applications.

No. of Terminals: 64

Sufficient number of terminals for connecting to other components and peripherals in a system.

Package Style (Meter): FLATPACK

Flatpack design saves space and allows for efficient placement on circuit boards.

No. of Backplanes: 4-BP

Multiple backplanes enhance the functionality and performance of the IC, allowing for more complex operations.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperatures, ensuring consistent performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC efficient and reliable.

Maximum Supply Current: 0.5 mA

Low maximum supply current requirement enhances energy efficiency and reduces power consumption.

No. of Segments: 200

Large number of segments for displaying detailed information or graphics, increasing the versatility of the IC.

Terminal Pitch: 0.8 mm

Compact terminal pitch enables high-density mounting and connectivity, suitable for space-constrained designs.

Technical Specifications

Other Function Interface ICs LC75827E attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Display Mode:

SEGMENT

JESD-30 Code:

S-PQFP-G64

No. of Backplanes:

4-BP

No. of Segments:

200

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.66SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.5 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Trade Compliance

LC75827E Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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