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LC75827W

Onsemi

LC75827W by Onsemi

LC75827W by Onsemi is a CMOS IC with 200 segments, operating at -40 to 85 °C. It has 64 terminals in a flatpack package and requires 3/5V power supply. Ideal for industrial applications requiring segment display mode and quad terminal position.

Median Price

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Lifecycle Status

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In-Stock Inventory

1k+

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Vyrian

USA . 1,746 parts In-Stock

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Digiode

USA . 1,468 parts In-Stock

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TANS Electronics

Latvia . 5,181 parts In-Stock

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Problanco Electronics

Mexico . 4,453 parts In-Stock

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SupplyDigital Components

Austria . 2,521 parts In-Stock

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UHIMA Technologies

Türkiye . 969 parts In-Stock

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Corphita

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Kulean Microsystems

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Corohmni

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Overview

Unlock the potential of your next project with the LC75827W by Onsemi, a cutting-edge Other Function Interface IC designed to meet the highest standards of quality and reliability. Onsemi's reputation for excellence ensures that this product delivers exceptional performance in a variety of applications. From automotive displays to consumer electronics, the LC75827W offers unparalleled value, benefits, and advantages to customers seeking innovative solutions. Experience the difference with Onsemi and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications.

Display Mode: SEGMENT

Segment display mode allows for clear and precise information display, enhancing user experience.

Surface Mount: YES

Surface mount technology enables easy and efficient installation on circuit boards.

Power Supplies (V): 3/5

Support for multiple power supply voltages allows for flexibility in system design and compatibility.

No. of Terminals: 64

Having a higher number of terminals provides more connectivity options and functionality.

Package Style (Meter): FLATPACK

Flatpack design ensures space-saving and efficient utilization of circuit board real estate.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for usage in a wide range of environments, including cold conditions.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures robustness and durability in harsh industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall efficiency.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and ease of soldering during installation.

No. of Segments: 200

High number of segments allows for detailed and complex visual displays and information presentation.

Terminal Pitch: 0.5 mm

Small terminal pitch enables high-density packaging and compact design, saving space on the circuit board.

Technical Specifications

Other Function Interface ICs LC75827W attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Display Mode:

SEGMENT

JESD-30 Code:

S-PQFP-G64

No. of Backplanes:

4-BP

No. of Segments:

200

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.5 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC75827W Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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