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LC7584N

Onsemi

LC7584N by Onsemi

LC7584N by Onsemi is an 80-terminal CMOS IC with a nominal voltage of 5V and max operating temperature of 85 °C. It features a segment display mode, Gull Wing terminal form, and is ideal for industrial applications requiring a flatpack package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,672 parts In-Stock

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Digiode

USA . 1,136 parts In-Stock

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SupplyDigital Components

Austria . 8,353 parts In-Stock

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TANS Electronics

Latvia . 6,207 parts In-Stock

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Kulean Microsystems

USA . 5,071 parts In-Stock

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Problanco Electronics

Mexico . 2,957 parts In-Stock

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Corphita

USA . 512 parts In-Stock

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UHIMA Technologies

Türkiye . 206 parts In-Stock

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Corohmni

South Africa . 51 parts In-Stock

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Overview

Unleash the power of innovation with the LC7584N by Onsemi. This cutting-edge product delivers unmatched quality and reliability, backed by the trusted reputation of its manufacturer. Ideal for a wide range of applications in the category of Other Function Interface ICs, this product offers unparalleled value and benefits to customers. Its advanced technology, high performance, and ease of use make it a game-changer in the industry. Upgrade your projects with the LC7584N and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable, lightweight, and cost-effective, making the product suitable for a variety of applications.

Display Mode: SEGMENT

Segment display is easy to read and offers a clear indication of information, making it user-friendly.

Surface Mount: YES

Surface mount technology allows for easy installation and compact design, making the product space-efficient.

Power Supplies (V): 5

Operating at 5V ensures compatibility with standard power sources, making integration more straightforward.

No. of Terminals: 80

Having a high number of terminals provides flexibility for connecting to various external components and peripherals.

Package Style (Meter): FLATPACK

Flatpack packaging offers a slim profile, saving space and allowing for compact system designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can function reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Capable of operating in very low temperatures, making the product suitable for outdoor or industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall performance and efficiency.

Technical Specifications

Other Function Interface ICs LC7584N attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Display Mode:

SEGMENT

JESD-30 Code:

R-PQFP-G80

No. of Backplanes:

0-BP

No. of Segments:

48

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.75X1,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

4 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Trade Compliance

LC7584N Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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