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LC75814VS-MPB-E

Onsemi

LC75814VS-MPB-E by Onsemi

LC75814VS-MPB-E by Onsemi is a CMOS IC with 16 segments, suitable for industrial applications. It operates on 3/5V power supplies and has a max operating temperature of 85 °C. With a small outline package style and gull wing terminal form, it is ideal for segment display mode in various electronic devices.

Median Price

$1.440

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 877 parts In-Stock

1+ parts

-

100+ parts

$1.240

1k+ parts

$1.110

10k+ parts

$1.050

877

-

$1.240

$1.110

$1.050

DigiKey

USA . 877 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.640

10k+ parts

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877

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-

$1.640

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 981 parts In-Stock

1+ parts

$1.320

100+ parts

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981

$1.320

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Chip Stock

USA . 68,000 parts In-Stock

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68,000

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Vyrian

USA . 6,299 parts In-Stock

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6,299

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DigiKey Marketplace

USA . 877 parts In-Stock

1+ parts

-

100+ parts

$1.440

1k+ parts

-

10k+ parts

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877

-

$1.440

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 441 parts In-Stock

1+ parts

$1.190

100+ parts

-

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441

$1.190

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-

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Corphita

USA . 1,266 parts In-Stock

1+ parts

$1.251

100+ parts

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1,266

$1.251

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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TANS Electronics

Latvia . 7,611 parts In-Stock

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7,611

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Problanco Electronics

Mexico . 7,032 parts In-Stock

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7,032

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SupplyDigital Components

Austria . 3,339 parts In-Stock

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3,339

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Kulean Microsystems

USA . 1,437 parts In-Stock

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1,437

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Continental Prestige Electronics

USA . 877 parts In-Stock

1+ parts

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$1.190

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877

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$1.190

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Microchip USA

USA . 139 parts In-Stock

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139

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UHIMA Technologies

Türkiye . 135 parts In-Stock

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135

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Overview

Enhance your electronic designs with the LC75814VS-MPB-E by Onsemi, a top-quality Other Function Interface IC that promises reliability and performance. This versatile component is perfect for a variety of applications, offering ease of use and seamless integration. With Onsemi's reputation for excellence in the industry, you can trust that this product delivers on its promises. Upgrade your projects today with the LC75814VS-MPB-E and experience the value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Ensures durability and resistance to impact, making the product reliable for long-term use.

Display Mode: SEGMENT

Provides clear and precise display of information, enhancing user experience.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort.

Power Supplies (V): 3/5

Offers flexibility in power supply options, catering to different system requirements.

No. of Terminals: 30

Sufficient number of terminals for connecting various components, ensuring compatibility with different systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Provides reliable operation even in extreme cold environments.

Terminal Finish: TIN BISMUTH

Corrosion-resistant finish for long-term reliability and performance.

Temperature Grade: INDUSTRIAL

Designed to meet the stringent operating conditions of industrial environments.

Technology: CMOS

Low power consumption and high noise immunity for efficient and reliable operation.

Maximum Supply Current: 0.46 mA

Efficient power usage, reducing energy costs and enhancing overall system efficiency.

No. of Segments: 16

Provides ample display elements for presenting information clearly and accurately.

Technical Specifications

Other Function Interface ICs LC75814VS-MPB-E attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Display Mode:

SEGMENT

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

4

No. of Backplanes:

4-BP

No. of Segments:

16

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP30,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.46 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LC75814VS-MPB-E Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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