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ISO7421FEDR

Texas Instruments

ISO7421FEDR by Texas Instruments

ISO7421FEDR by Texas Instruments is a dual-function interface IC with 2 channels. It operates b/w -40 to 125°C, suitable for automotive applications. With a small outline package style and nickel palladium gold terminal finish, it supports surface mount installation up to 260°C peak reflow temperature.

Median Price

$8.510

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 17,478 parts In-Stock

1+ parts

$2.468

100+ parts

$2.163

1k+ parts

$1.222

10k+ parts

-

17,478

$2.468

$2.163

$1.222

-

Mouser Electronics

USA . 5,870 parts In-Stock

1+ parts

$8.510

100+ parts

$5.590

1k+ parts

$5.060

10k+ parts

$4.790

5,870

$8.510

$5.590

$5.060

$4.790

DigiKey

USA . 16,663 parts In-Stock

1+ parts

$8.520

100+ parts

$5.597

1k+ parts

$5.470

10k+ parts

-

16,663

$8.520

$5.597

$5.470

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ozdisan Elektronik

Türkiye . 697 parts In-Stock

1+ parts

$1.610

100+ parts

-

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697

$1.610

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Nova Conductors

Japan . 48 parts In-Stock

1+ parts

$1.830

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-

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48

$1.830

-

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Digiode

USA . 4,625 parts In-Stock

1+ parts

$2.345

100+ parts

-

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4,625

$2.345

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Chip Stock

USA . 27,895 parts In-Stock

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-

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27,895

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Vyrian

USA . 14,497 parts In-Stock

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14,497

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NAC Semi

USA . 534 parts In-Stock

1+ parts

-

100+ parts

$4.980

1k+ parts

$4.600

10k+ parts

-

534

-

$4.980

$4.600

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,604 parts In-Stock

1+ parts

$1.830

100+ parts

-

1k+ parts

-

10k+ parts

$1.793

3,604

$1.830

-

-

$1.793

Argo Parts USA

USA . 381 parts In-Stock

1+ parts

$1.830

100+ parts

-

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-

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381

$1.830

-

-

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Netroflash

USA . 50 parts In-Stock

1+ parts

$1.830

100+ parts

-

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-

10k+ parts

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50

$1.830

-

-

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Corohmni

South Africa . 179 parts In-Stock

1+ parts

$1.880

100+ parts

-

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179

$1.880

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$1.936

100+ parts

$1.840

1k+ parts

$1.840

10k+ parts

-

50

$1.936

$1.840

$1.840

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Semicontronic

India . 14,643 parts In-Stock

1+ parts

$2.100

100+ parts

$2.048

1k+ parts

$2.037

10k+ parts

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14,643

$2.100

$2.048

$2.037

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Ampacity Inc.

Singapore . 14,498 parts In-Stock

1+ parts

$2.100

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14,498

$2.100

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Corphita

USA . 3,519 parts In-Stock

1+ parts

$2.221

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3,519

$2.221

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Parana Technologies

USA . 1,448 parts In-Stock

1+ parts

$5.105

100+ parts

-

1k+ parts

$5.690

10k+ parts

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1,448

$5.105

-

$5.690

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DigiPath Technology Company

USA . 2,272 parts In-Stock

1+ parts

$5.621

100+ parts

$5.172

1k+ parts

-

10k+ parts

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2,272

$5.621

$5.172

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ChromeModa Solutions

Germany . 3,759 parts In-Stock

1+ parts

$5.736

100+ parts

$4.704

1k+ parts

-

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3,759

$5.736

$4.704

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IDEA Electronic Components Group

UK . 223 parts In-Stock

1+ parts

$5.736

100+ parts

-

1k+ parts

$5.162

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223

$5.736

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$5.162

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Lixinc

USA . 17,617 parts In-Stock

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17,617

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Perfect Parts

USA . 10,080 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,573 parts In-Stock

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Futuretech Components

Singapore . 4,000 parts In-Stock

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4,000

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Authorized Procurement Solutions

USA . 1,969 parts In-Stock

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1,969

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GreenTree Electronics

Israel . 1,520 parts In-Stock

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1,520

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Overview

Elevate your projects with the Texas Instruments ISO7421FEDR, a high-quality Interface IC designed to exceed expectations. With a reputation for excellence in manufacturing, Texas Instruments delivers innovative solutions that set industry standards. Perfect for a variety of applications, this product offers unmatched value, reliability, and performance. Say goodbye to compromise and hello to seamless integration with the ISO7421FEDR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for its durability and cost-effectiveness, making this product a reliable and affordable choice.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on PCBs, saving time and space in the manufacturing process.

Maximum Supply Voltage: 5 V

This higher voltage tolerance allows for compatibility with a wider range of systems and applications.

No. of Functions: 2

With multiple functions in one IC, this product offers more versatility and functionality for different uses.

Package Shape: RECTANGULAR

Rectangular shape is a standard design that simplifies PCB layout and integration into existing systems.

No. of Terminals: 8

Having 8 terminals provides flexibility in connections and supports various configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and enables compact designs for electronic devices.

Minimum Supply Voltage: 3.3 V

This lower voltage requirement can help reduce power consumption and extend the product's lifespan.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliability and performance in harsh environments or industrial applications.

Minimum Operating Temperature: -40 °C

Wide temperature range allows this product to function in extreme cold conditions without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity, corrosion resistance, and solderability for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for different mounting orientations, offering flexibility in PCB layout and design.

Maximum Seated Height: 1.75 mm

Low seated height enables a slim profile and compact size for the end product.

Width: 3.895 mm

Narrow width saves space on the PCB and supports miniaturization of electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time helps prevent overheating and solder joint damage during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and strong mechanical bonds for reliable connections.

Length: 4.905 mm

Compact length contributes to a smaller footprint on the PCB, ideal for space-constrained designs.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade means this product is designed to withstand the temperature fluctuations and demands of automotive environments.

No. of Channels: 2

Having 2 channels provides a multi-functional solution for simultaneous operations or dual functions.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering and inspection processes during manufacturing.

Nominal Supply Voltage: 3.3 V

Having a consistent nominal supply voltage ensures stable performance and compatibility with 3.3V systems.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy PCB layout and assembly, making it compatible with common manufacturing processes.

Interface IC Type: INTERFACE CIRCUIT

An interface circuit type IC provides essential communication and connectivity functions for seamless integration into electronic systems.

Technical Specifications

Other Function Interface ICs ISO7421FEDR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V NOM

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

ISO7421FEDR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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