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ISO7731FDW

Texas Instruments

ISO7731FDW by Texas Instruments

ISO7731FDW by Texas Instruments is a 16-terminal IC with 3 functions, operating b/w -55 to 125°C. It features CMOS technology, GULL WING terminals, and MILITARY-grade temperature rating. Ideal for interface circuits, it has a supply voltage range of 2.25-5.5V and compact dimensions of 10.3x7.5x2.65mm for surface mount applications.

Median Price

$3.221

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,035 parts In-Stock

1+ parts

$2.822

100+ parts

$2.331

1k+ parts

$1.260

10k+ parts

-

4,035

$2.822

$2.331

$1.260

-

DigiKey

USA . 7,901 parts In-Stock

1+ parts

$3.620

100+ parts

$2.405

1k+ parts

$2.007

10k+ parts

$1.909

7,901

$3.620

$2.405

$2.007

$1.909

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$1.910

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$1.910

-

-

-

Digiode

USA . 382 parts In-Stock

1+ parts

$2.252

100+ parts

-

1k+ parts

-

10k+ parts

-

382

$2.252

-

-

-

Vyrian

USA . 6,013 parts In-Stock

1+ parts

-

100+ parts

-

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6,013

-

-

-

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Cyclops Electronics Ltd

UK . 200 parts In-Stock

1+ parts

-

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200

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,617 parts In-Stock

1+ parts

$1.910

100+ parts

-

1k+ parts

-

10k+ parts

$1.872

4,617

$1.910

-

-

$1.872

Argo Parts USA

USA . 1,685 parts In-Stock

1+ parts

$1.910

100+ parts

-

1k+ parts

-

10k+ parts

-

1,685

$1.910

-

-

-

Ampacity Inc.

Singapore . 5,654 parts In-Stock

1+ parts

$2.010

100+ parts

-

1k+ parts

-

10k+ parts

-

5,654

$2.010

-

-

-

Semicontronic

India . 5,588 parts In-Stock

1+ parts

$2.010

100+ parts

$1.960

1k+ parts

$1.950

10k+ parts

-

5,588

$2.010

$1.960

$1.950

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Corphita

USA . 882 parts In-Stock

1+ parts

$2.133

100+ parts

-

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882

$2.133

-

-

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Advanced Electronics

New Zealand . 750 parts In-Stock

1+ parts

$7.429

100+ parts

$7.058

1k+ parts

$7.058

10k+ parts

-

750

$7.429

$7.058

$7.058

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Corohmni

South Africa . 44 parts In-Stock

1+ parts

$8.188

100+ parts

-

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44

$8.188

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Parana Technologies

USA . 1,396 parts In-Stock

1+ parts

$8.224

100+ parts

-

1k+ parts

$8.838

10k+ parts

-

1,396

$8.224

-

$8.838

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DigiPath Technology Company

USA . 853 parts In-Stock

1+ parts

$9.056

100+ parts

$8.332

1k+ parts

-

10k+ parts

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853

$9.056

$8.332

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ChromeModa Solutions

Germany . 4,086 parts In-Stock

1+ parts

$9.241

100+ parts

$7.578

1k+ parts

-

10k+ parts

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4,086

$9.241

$7.578

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-

IDEA Electronic Components Group

UK . 697 parts In-Stock

1+ parts

$9.241

100+ parts

$8.779

1k+ parts

$8.317

10k+ parts

-

697

$9.241

$8.779

$8.317

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Lixinc

USA . 15,736 parts In-Stock

1+ parts

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15,736

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iodParts Technologies Inc.

India . 298 parts In-Stock

1+ parts

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298

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Overview

Upgrade your electronic devices with the high-quality ISO7731FDW by Texas Instruments. This innovative product, part of the Other Function Interface ICs category, offers customers unmatched reliability and performance. With its advanced technology and military-grade temperature grade, this interface circuit ensures seamless operation in a wide range of applications. Trust Texas Instruments to deliver cutting-edge solutions that elevate your projects to the next level. Experience the value and benefits of the ISO7731FDW today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the product, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in manufacturing processes.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage of 5.5V, this product can operate reliably in various power supply conditions.

No. of Functions: 3

Having 3 functions in one interface IC simplifies the design and integration process, saving space and cost in the overall system.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy PCB layout and efficient use of space, making it suitable for compact designs.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options, enabling the product to interface with multiple external components.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it ideal for compact electronic devices.

Minimum Supply Voltage: 2.25 V

With a low minimum supply voltage of 2.25V, the product can operate efficiently in low power conditions, increasing its versatility.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C ensures reliability and stability in harsh environmental conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature of -55°C allows for reliable performance in extreme cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability of the product.

Terminal Position: DUAL

Dual terminal position offers multiple mounting options, increasing flexibility in the PCB layout and design.

Maximum Seated Height: 2.65 mm

Low maximum seated height of 2.65mm allows for compact integration into electronic devices with tight space constraints.

Width: 7.5 mm

Narrow width of 7.5mm saves space on the PCB, making it suitable for miniaturized electronic designs.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, the product can withstand soldering processes without damage, ensuring robust assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures reliable solder joints and long-term durability during manufacturing processes.

Length: 10.3 mm

Compact length of 10.3mm allows for efficient space utilization on the PCB, ideal for small form factor electronic devices.

Temperature Grade: MILITARY

Military-grade temperature grade ensures high reliability and performance in extreme temperature conditions, making it suitable for rugged applications.

No. of Channels: 3

Having 3 channels allows for multiple data or signal processing capabilities, increasing the versatility and functionality of the product.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ensuring efficient and reliable operation of the product.

Terminal Form: GULL WING

Gull wing terminal form offers strong mechanical stability and ease of soldering, ensuring robust connections and assembly.

Nominal Supply Voltage: 2.5 V

Having a nominal supply voltage of 2.5V simplifies power management and compatibility with standard power sources.

Terminal Pitch: 1.27 mm

With a small terminal pitch of 1.27mm, the product allows for high-density mounting on the PCB, suitable for compact designs.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level of 2 indicates a low risk of moisture-related damage during storage and handling, ensuring product reliability.

Interface IC Type: INTERFACE CIRCUIT

Specialized interface circuit type offers seamless connectivity and communication between different electronic components, enhancing system performance.

Technical Specifications

Other Function Interface ICs ISO7731FDW attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

3

No. of Functions:

3

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO7731FDW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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