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ISO7220ADRG4

Texas Instruments

ISO7220ADRG4 by Texas Instruments

ISO7220ADRG4 by Texas Instruments is a dual-channel interface IC with CMOS technology. It operates b/w -40 to 125°C, suitable for automotive applications. With a supply voltage range of 3.3V to 5V and small outline package style, it offers reliable performance in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 16,647 parts In-Stock

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Vyrian

USA . 8,856 parts In-Stock

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Digiode

USA . 1,234 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 658 parts In-Stock

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$2.042

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658

$2.042

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Parana Technologies

USA . 1,971 parts In-Stock

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$9.899

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$10.468

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1,971

$9.899

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$10.468

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ChromeModa Solutions

Germany . 4,583 parts In-Stock

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$11.123

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$9.121

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$11.123

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IDEA Electronic Components Group

UK . 1,454 parts In-Stock

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$11.123

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$10.567

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$10.011

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$10.011

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AZTECH Wire

Italy . 517 parts In-Stock

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$13.037

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Advanced Electronics

New Zealand . 79 parts In-Stock

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$15.341

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$14.574

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$14.574

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$14.574

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Ampacity Inc.

Singapore . 1,373 parts In-Stock

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$15.500

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Semicontronic

India . 1,566 parts In-Stock

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$24.500

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$23.888

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$23.765

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One Stop Electronics

USA . 1,085 parts In-Stock

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$38.500

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Perfect Parts

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Continental Prestige Electronics

USA . 5,426 parts In-Stock

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GreenTree Electronics

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DigiPath Technology Company

USA . 1,094 parts In-Stock

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$10.028

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Bastille Electronics

Australia . 700 parts In-Stock

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Corphita

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Argo Parts USA

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Overview

Experience unparalleled quality and reliability with the ISO7220ADRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments brings you a cutting-edge interface circuit that is perfect for a wide range of applications. This small outline IC offers dual-channel functionality, ensuring seamless performance in automotive-grade environments. With a maximum supply voltage of 5V and a minimum operating temperature of -40°C, this IC provides unmatched value and benefits to customers looking for top-notch technology solutions. Trust Texas Instruments to deliver excellence with the ISO7220ADRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the internal components of the interface IC, ensuring long-term reliability.

Surface Mount: YES

The surface mount feature makes it easy to integrate this interface IC into PCBs, saving space and making the assembly process more efficient.

Maximum Supply Voltage: 5 V

With a maximum supply voltage of 5 V, this interface IC is compatible with a wide range of power sources, offering flexibility in various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and alignment on the PCB, simplifying the design and layout process.

No. of Terminals: 8

Having 8 terminals provides enough connectivity options for the interface IC to interface with other components or devices effectively.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in minimizing the overall footprint of the interface IC on the PCB, ideal for space-constrained applications.

Minimum Supply Voltage: 3.3 V

The minimum supply voltage of 3.3 V ensures compatibility with lower voltage systems, expanding the range of applications where this interface IC can be used.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows this interface IC to function reliably in harsh environments or applications where temperature fluctuations are common.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity, corrosion resistance, and durability, ensuring stable connections and long-term performance of the interface IC.

Terminal Position: DUAL

Having dual terminal positions offers flexibility in PCB layout and allows for easier routing of traces, making the connection process more straightforward and efficient.

Maximum Seated Height: 1.75 mm

The low maximum seated height of 1.75 mm saves vertical space on the PCB and reduces the overall profile of the interface IC assembly, making it suitable for compact designs.

Width: 3.895 mm

The narrow width of 3.895 mm helps in conserving space on the PCB and allows for efficient placement of the interface IC alongside other components.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures safe and reliable soldering of the interface IC during the assembly process, preventing damage due to overheating.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for robust solder joints to be formed, ensuring a strong and reliable connection between the interface IC and the PCB.

Length: 4.905 mm

The compact length of 4.905 mm contributes to the overall space-saving design of the interface IC, making it suitable for applications where board space is limited.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates that this interface IC is designed to withstand the demanding conditions of automotive environments, ensuring reliability and performance in such applications.

No. of Channels: 2

Featuring 2 channels, this interface IC can handle multiple data streams or communication pathways simultaneously, enhancing its versatility in various signal processing applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltage levels, making this interface IC suitable for diverse electronic applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and inspection during the assembly process, ensuring reliable connections and making maintenance or rework tasks simpler.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5 V simplifies the integration of this interface IC into systems that operate on a standard 5 V power supply, offering seamless compatibility.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise and secure connections on the PCB, minimizing the risk of short circuits and ensuring stable signal transmission throughout the system.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit type, this IC facilitates the communication and data exchange between different components or subsystems, enabling seamless integration and efficient operation of the overall system.

Technical Specifications

Other Function Interface ICs ISO7220ADRG4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

ISO7220ADRG4 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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