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KAI-16000-FXA-JD-B2

Onsemi

KAI-16000-FXA-JD-B2 by Onsemi

KAI-16000-FXA-JD-B2 by Onsemi is an image sensor with 7.4x7.4 um pixel size, 4872 horizontal pixels, and 3248 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 65 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,013 parts In-Stock

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Digiode

USA . 685 parts In-Stock

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685

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AZTECH Wire

Italy . 579 parts In-Stock

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$11.320

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579

$11.320

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TANS Electronics

Latvia . 7,897 parts In-Stock

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Kulean Microsystems

USA . 5,796 parts In-Stock

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SupplyDigital Components

Austria . 4,343 parts In-Stock

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Corphita

USA . 2,433 parts In-Stock

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Problanco Electronics

Mexico . 1,446 parts In-Stock

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UHIMA Technologies

Türkiye . 509 parts In-Stock

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Corohmni

South Africa . 147 parts In-Stock

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Overview

Looking to capture stunning, high-quality images with unparalleled precision? Look no further than the KAI-16000-FXA-JD-B2 by Onsemi. As a leading manufacturer in the industry, Onsemi's image sensors are trusted for their superior performance and reliability. The KAI-16000-FXA-JD-B2 boasts a wide range of applications, from industrial imaging to scientific research. With its advanced features and cutting-edge technology, this product offers customers unmatched value, benefits, and advantages. Upgrade your imaging capabilities today with the KAI-16000-FXA-JD-B2 and experience the difference for yourself.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

The small pixel size allows for detailed and high-resolution images to be captured.

Maximum Supply Voltage: 15.5 V

Higher supply voltage allows for greater versatility and performance in various applications.

Body Width: 44.45 inch

Compact body width makes it easier to integrate this image sensor into different devices and systems.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD image sensors are known for their high-quality imaging capabilities, making this product a reliable choice for capturing clear images.

Package Shape or Style: RECTANGULAR

Rectangular shape provides easy mounting and integration options for the image sensor.

Minimum Supply Voltage: 14.5 V

Lower minimum supply voltage helps in reducing power consumption and improving efficiency.

Maximum Operating Temperature: 70 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -50 °C

Wide temperature range allows for use in extreme cold conditions without sacrificing performance.

Dynamic Range: 65 dB

High dynamic range provides better contrast and detail in captured images.

Data Rate: 30 Mbps

High data rate allows for fast and efficient transmission of image data.

Array Type: INTERLINE

Interline array type offers improved image quality and sensitivity, making this image sensor suitable for a wide range of applications.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature provides secure and reliable attachment to circuit boards or other surfaces.

Technical Specifications

Image Sensors KAI-16000-FXA-JD-B2 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 30 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT HAS 1.37 INCH OPTICAL FORMAT

Array Type:

INTERLINE

Body Width:

44.45 inch

Body Height:

4.88 mm

Body Length/Diameter:

45.34 mm

Data Rate:

30 Mbps

Dynamic Range:

65 dB

Horizontal Pixel:

4872

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

3248

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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