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KAI-02050-FBA-FD-BA

Onsemi

KAI-02050-FBA-FD-BA by Onsemi

KAI-02050-FBA-FD-BA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 1600 horizontal pixels, and 1200 vertical pixels. It operates b/w -50 to 70 °C and has a dynamic range of 64 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,273 parts In-Stock

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Digiode

USA . 2,100 parts In-Stock

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2,100

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Distributors (Availability)

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AZTECH Wire

Italy . 1,053 parts In-Stock

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$15.750

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$15.750

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TANS Electronics

Latvia . 6,984 parts In-Stock

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Problanco Electronics

Mexico . 6,944 parts In-Stock

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SupplyDigital Components

Austria . 6,649 parts In-Stock

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6,649

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Kulean Microsystems

USA . 6,465 parts In-Stock

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Corphita

USA . 1,666 parts In-Stock

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1,666

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UHIMA Technologies

Türkiye . 960 parts In-Stock

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960

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Corohmni

South Africa . 180 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the KAI-02050-FBA-FD-BA by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and performance in their image sensors. This innovative product is perfect for a range of applications, offering customers unparalleled value and benefits. Elevate your projects with the advanced features and advantages that the KAI-02050-FBA-FD-BA brings to the table. Trust Onsemi to deliver exceptional results every time.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

Small pixel size allows for high resolution images to be captured with fine details.

Maximum Supply Voltage: 15.5 V

Higher supply voltage provides more power for the sensor to operate efficiently.

Body Width: 18.29 inch

Wide body width allows for easier integration and mounting of the sensor in various devices.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors are known for their high-quality image capture and low noise performance.

Body Height: 2.94 mm

Low body height enables the sensor to be used in slim and compact devices.

Package Shape or Style: SQUARE

Square package shape offers uniformity in design and facilitates easier assembly.

Minimum Supply Voltage: 14.5 V

Lower minimum supply voltage helps in reducing power consumption and improving energy efficiency.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures the sensor can perform reliably even in challenging environments.

Horizontal Pixel: 1600

Higher horizontal pixel count results in sharper and more detailed images.

Minimum Operating Temperature: -50 °C

Wide range of operating temperatures allows the sensor to be used in extreme cold conditions.

Housing: CERAMIC

Ceramic housing provides durability and thermal stability to the sensor.

Dynamic Range: 64 dB

Wide dynamic range ensures that the sensor can capture both bright and dark areas accurately.

Vertical Pixel: 1200

Higher vertical pixel count contributes to better overall image quality and resolution.

Body Length/Diameter: 18.29 mm

Compact body length allows for flexible placement of the sensor in various devices.

Optical Format (inch): 2/3

2/3 inch optical format is commonly used in professional imaging applications for superior image quality.

Termination Type: SOLDER

Solder termination ensures secure and reliable electrical connections for the sensor.

Array Type: INTERLINE

Interline array type helps in reducing blooming effects and improving image quality.

Mounting Feature: SURFACE MOUNT

Surface mount capability enables easy installation of the sensor on circuit boards for efficient integration.

Technical Specifications

Image Sensors KAI-02050-FBA-FD-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 34 MICRO VOLT PER ELECTRON; ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

18.29 inch

Body Height:

2.94 mm

Body Length/Diameter:

18.29 mm

Dynamic Range:

64 dB

Horizontal Pixel:

1600

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

2/3

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1200

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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