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HGT1S7N60A4DS9A

Onsemi

HGT1S7N60A4DS9A by Onsemi

HGT1S7N60A4DS9A by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 2.7V and a max IC of 34A. It is designed for power control applications, featuring a built-in diode and operating temperature range from -55 to 150 °C.

Median Price

$0.912

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 326 parts In-Stock

1+ parts

-

100+ parts

$0.912

1k+ parts

$0.757

10k+ parts

$0.675

326

-

$0.912

$0.757

$0.675

Distributors (In-Stock)

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Digiode

USA . 2,301 parts In-Stock

1+ parts

$0.711

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2,301

$0.711

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ComSIT Distribution GmbH

Germany . 243,600 parts In-Stock

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243,600

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R&J Components

USA . 3,269 parts In-Stock

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3,269

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Q Components

USA . 2,660 parts In-Stock

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2,660

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Vyrian

USA . 2,141 parts In-Stock

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Bristol Electronics

USA . 222 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,530 parts In-Stock

1+ parts

$0.673

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-

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2,530

$0.673

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Corohmni

South Africa . 466 parts In-Stock

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$0.748

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466

$0.748

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Andel Nordic

Denmark . 4,800 parts In-Stock

1+ parts

$6.179

100+ parts

-

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$5.932

10k+ parts

$5.932

4,800

$6.179

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$5.932

$5.932

Kepictronics

USA . 27,860 parts In-Stock

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27,860

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Kulean Microsystems

USA . 6,257 parts In-Stock

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TANS Electronics

Latvia . 5,031 parts In-Stock

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Assy Fe

Spain . 4,000 parts In-Stock

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Problanco Electronics

Mexico . 3,650 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,400 parts In-Stock

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Supply Digital

USA . 2,260 parts In-Stock

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SupplyDigital Components

Austria . 2,249 parts In-Stock

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Northwest PG Solutions

USA . 1,745 parts In-Stock

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Glotronic Ltd.

UK . 1,740 parts In-Stock

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1,740

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Alle Elektronik GmbH

Germany . 1,600 parts In-Stock

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1,600

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Native Components

USA . 918 parts In-Stock

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918

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UHIMA Technologies

Türkiye . 889 parts In-Stock

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889

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Overview

Discover the power of the HGT1S7N60A4DS9A by Onsemi, a top-quality Insulated Gate Bipolar Transistor that delivers unparalleled performance in power control applications. With a maximum VCEsat of 2.7V and a maximum collector-emitter voltage of 600V, this N-channel transistor offers reliable and efficient operation. Its single configuration with built-in diode ensures seamless integration, while its small outline package body material guarantees durability. Experience optimized power dissipation with a maximum of 125W and quick turn-on and turn-off times for enhanced efficiency. Upgrade your power control systems now with the HGT1S7N60A4DS9A for superior performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Allows for efficient power control and high performance in electronic circuits.

Maximum VCEsat: 2.7 V

Low saturation voltage helps in reducing power losses and improving overall efficiency.

Maximum Power Dissipation (Abs): 125 W

Can handle high power applications without overheating, making it suitable for demanding power control tasks.

Maximum Operating Temperature: 150 °C

Can operate efficiently even in high temperature environments, ensuring reliability under various conditions.

Maximum Collector-Emitter Voltage: 600 V

Can handle high voltage levels, making it suitable for applications that require high voltage switching.

Maximum Gate-Emitter Voltage: 20 V

Provides a safe operating range for the gate-emitter voltage, ensuring stable performance.

Maximum Collector Current (IC): 34 A

Can handle high current loads, making it suitable for power control applications that require high switching currents.

Nominal Turn On Time (ton): 17 ns

Fast turn-on time allows for quick switching speed, improving overall performance of the product.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) HGT1S7N60A4DS9A attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

85 ns

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

235 ns

Nominal Turn Off Time (toff):

205 ns

Nominal Turn On Time (ton):

17 ns

Maximum VCEsat:

2.7 V

Trade Compliance

HGT1S7N60A4DS9A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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