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BUH150AJ

Onsemi

BUH150AJ by Onsemi

BUH150AJ by Onsemi is a NPN BJT transistor with max. collector-emitter voltage of 400V, ideal for switching applications. Featuring a max. collector current of 15A and min. DC current gain of 4, it operates at up to 150 °C. Its package style is flange mount with through-hole terminals, made of silicon material for high performance in power electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,975 parts In-Stock

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Vyrian

USA . 664 parts In-Stock

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Kulean Microsystems

USA . 4,389 parts In-Stock

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TANS Electronics

Latvia . 3,772 parts In-Stock

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Problanco Electronics

Mexico . 3,404 parts In-Stock

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Northwest PG Solutions

USA . 772 parts In-Stock

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Corphita

USA . 514 parts In-Stock

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SupplyDigital Components

Austria . 319 parts In-Stock

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Corohmni

South Africa . 277 parts In-Stock

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UHIMA Technologies

Türkiye . 268 parts In-Stock

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Native Components

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Overview

Elevate your power management solutions with the BUH150AJ by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality Power Bipolar Junction Transistors (BJT) like this NPN transistor designed for switching applications. With a maximum collector-emitter voltage of 400V and a nominal transition frequency of 23 MHz, this product offers unparalleled reliability and performance. Whether you're looking to optimize your power circuit designs or enhance your electronic projects, the BUH150AJ provides the value, benefits, and advantages you need for success. Experience the difference with Onsemi's cutting-edge technology and elevate your power control capabilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the transistor, making it suitable for various environments and applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification and switching circuits, offering good performance and reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance and reliability in such circuits.

Maximum Collector-Emitter Voltage: 400V

Can handle high voltage levels, suitable for applications where higher voltage requirements are needed.

Maximum Collector Current (IC): 15A

Capable of handling high current levels, making it suitable for applications that require higher power handling capabilities.

Nominal Transition Frequency (fT): 23 MHz

Provides high frequency response, making it suitable for applications requiring fast switching speeds or high-frequency operation.

Technical Specifications

Power Bipolar Junction Transistors (BJT) BUH150AJ attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

400 V

Configuration:

Minimum DC Current Gain (hFE):

4

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BUH150AJ Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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