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2SA2013

Onsemi

2SA2013 by Onsemi

Onsemi's 2SA2013 is a PNP BJT with max. power dissipation of 3.5W, hFE of 200, and max. collector current of 4A. Ideal for applications requiring high current amplification in a single configuration, such as power supplies or audio amplifiers operating up to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 1,524 parts In-Stock

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Cyclops Electronics Ltd

UK . 409 parts In-Stock

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Digiode

USA . 245 parts In-Stock

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Kepictronics

USA . 39,000 parts In-Stock

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Metaverse IC Inc.

Canada . 33,000 parts In-Stock

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SupplyDigital Components

Austria . 2,889 parts In-Stock

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TANS Electronics

Latvia . 2,231 parts In-Stock

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Problanco Electronics

Mexico . 1,696 parts In-Stock

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Corphita

USA . 1,617 parts In-Stock

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Northwest PG Solutions

USA . 955 parts In-Stock

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Native Components

USA . 588 parts In-Stock

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UHIMA Technologies

Türkiye . 499 parts In-Stock

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Corohmni

South Africa . 127 parts In-Stock

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Kulean Microsystems

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Overview

Elevate your electronic projects with the reliable 2SA2013 Power Bipolar Junction Transistor from Onsemi. As a PNP transistor with a single configuration, this surface mount device offers a maximum power dissipation of 3.5W and a minimum DC current gain of 200. Ideal for a wide range of applications, including amplification and switching circuits, this transistor guarantees high performance and efficiency. Trust in Onsemi's reputation for quality and innovation, and experience the unmatched value and benefits that the 2SA2013 brings to your projects.

Feature Benefit Bullets

Polarity or Channel Type: PNP

The PNP polarity allows for easy compatibility with other PNP components in a circuit.

Configuration: SINGLE

The single configuration simplifies circuit design and integration, making it easier to implement in various applications.

Surface Mount: YES

The surface mount option enables easy installation on PCBs, saving space and facilitating automated assembly processes.

Maximum Power Dissipation (Abs): 3.5 W

With a high power dissipation capability of 3.5 W, this transistor can handle moderate to high power applications reliably.

Minimum DC Current Gain (hFE): 200

The high minimum DC current gain ensures amplification of input signals with minimal distortion, enhancing overall performance.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C allows for operation in a wide range of environments without risking thermal damage.

Maximum Collector Current (IC): 4 A

The high maximum collector current rating of 4 A enables the transistor to handle high current loads, making it suitable for power applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) 2SA2013 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

4 A

Configuration:

Minimum DC Current Gain (hFE):

200

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Trade Compliance

2SA2013 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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