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2SA2099

Onsemi

2SA2099 by Onsemi

Onsemi's 2SA2099 is a PNP BJT transistor with max. Vce of 50V and max. Ic of 10A. With hFE of 200, it's ideal for switching applications at a frequency of 130MHz. Its through-hole terminals make it suitable for flange mount packages in isolated cases.

Median Price

$0.806

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 111 parts In-Stock

1+ parts

-

100+ parts

$0.806

1k+ parts

$0.669

10k+ parts

$0.596

111

-

$0.806

$0.669

$0.596

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,499 parts In-Stock

1+ parts

$0.628

100+ parts

-

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1,499

$0.628

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Chip Stock

USA . 78,000 parts In-Stock

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78,000

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Vyrian

USA . 8,307 parts In-Stock

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8,307

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 913 parts In-Stock

1+ parts

$0.595

100+ parts

-

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913

$0.595

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-

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Corohmni

South Africa . 206 parts In-Stock

1+ parts

$0.661

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206

$0.661

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Component Stockers USA

USA . 102 parts In-Stock

1+ parts

$0.680

100+ parts

$0.640

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102

$0.680

$0.640

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Native Components

USA . 307 parts In-Stock

1+ parts

$34.350

100+ parts

-

1k+ parts

-

10k+ parts

$32.976

307

$34.350

-

-

$32.976

Northwest PG Solutions

USA . 796 parts In-Stock

1+ parts

$37.785

100+ parts

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796

$37.785

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SupplyDigital Components

Austria . 7,242 parts In-Stock

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TANS Electronics

Latvia . 6,257 parts In-Stock

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Kulean Microsystems

USA . 5,817 parts In-Stock

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Problanco Electronics

Mexico . 4,855 parts In-Stock

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4,855

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Kepictronics

USA . 970 parts In-Stock

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970

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UHIMA Technologies

Türkiye . 12 parts In-Stock

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Overview

Upgrade your power systems with the 2SA2099 from Onsemi, a leading manufacturer in the industry. This Power BJT transistor is designed for high-performance switching applications, offering reliable and efficient operation. With a maximum collector current of 10A and a minimum DC current gain of 200, this PNP transistor delivers superior performance. Whether you're working on industrial automation or power supply designs, the 2SA2099 provides the value and quality you need to take your projects to the next level. Trust Onsemi to deliver top-notch products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring long-term reliability in various working conditions.

Polarity or Channel Type: PNP

Suitable for applications requiring PNP transistors, offering compatibility for specific circuit requirements.

Configuration: SINGLE

Simplified circuit design and ease of integration, making it a straightforward choice for various switching applications.

Transistor Application: SWITCHING

Optimized for switching tasks, ensuring efficient operation and minimal power loss during switching processes.

Package Shape: RECTANGULAR

Facilitates easy mounting and installation, enhancing convenience in product assembly and maintenance.

Terminal Form: THROUGH-HOLE

Enables secure and reliable connections, reducing the risk of disconnections or signal interruptions in the circuit.

No. of Terminals: 3

Simplifies circuit layout and reduces complexity, aiding in efficient circuit design and assembly.

Package Style (Meter): FLANGE MOUNT

Provides stable mounting and secure attachment, ensuring the transistor stays in place during operation.

Minimum DC Current Gain (hFE): 200

High hFE value indicates strong current amplification capabilities, allowing for reliable and effective signal amplification in circuits.

Maximum Collector-Emitter Voltage: 50 V

Suitable for low to medium voltage applications, providing the necessary voltage handling capacity for diverse circuit requirements.

Transistor Element Material: SILICON

Silicon offers excellent performance characteristics, ensuring stable and efficient transistor operation in various conditions.

Maximum Collector Current (IC): 10 A

High IC rating allows for handling larger currents, making the transistor suitable for high-power switching applications.

Terminal Finish: Tin/Copper/Silver/Nickel (Sn/Cu/Ag/Ni)

Diverse terminal finish options provide flexibility in soldering and connection methods, catering to different assembly requirements.

Terminal Position: SINGLE

Simplified terminal layout enhances ease of connection and reduces the risk of wiring errors during installation.

Case Connection: ISOLATED

Isolated case connection prevents electrical interference and ensures proper insulation, safeguarding the transistor and surrounding components.

Nominal Transition Frequency (fT): 130 MHz

High fT value indicates fast switching capabilities, allowing for quick and efficient operation in high-frequency applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) 2SA2099 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Configuration:

Minimum DC Current Gain (hFE):

200

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

PNP

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

Tin/Copper/Silver/Nickel (Sn/Cu/Ag/Ni)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

2SA2099 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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