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TELECOM CIRCUIT Other Function Telecom Interface ICs 1,221

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Applications Battery Feed Battery Supply (V) Carrier Type-1 Carrier Type-2 Carrier Type-3 Companding Law Data Rate Filter Maximum Gain Tolerance Hybrid ISDN Access Rate Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Minimum Output High Voltage Maximum Output Low Current Maximum Output Low Voltage Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Reference Point Resolution (um) Screening Level Maximum Seated Height Standard Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
LMX5251SQX/NOPB by Texas Instruments

LMX5251SQX/NOPB

Texas Instruments

LMX5251SQX/NOPB by Texas Instruments is a 48-terminal IC with 3/3.3V power supplies, operating from -40 to 85°C. It features CMOS technology, matte tin finish, and 0.078mA max supply current. Ideal for telecom circuits, it comes in a square chip carrier package with a very thin profile for industrial applications.

S-XQCC-N48

e3

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.28SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3/3.3

Not Qualified

.8 mm

Other Telecom ICs

.078 mA

3.3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

7 mm

LMX5252LQX/NOPB by Texas Instruments

LMX5252LQX/NOPB

Texas Instruments

LMX5252LQX/NOPB by Texas Instruments is a CMOS telecom IC with 36 terminals in a square chip carrier package. Operating b/w -40 to 85 °C, it requires 2.75V supply voltage and draws 0.055mA current. Ideal for telecom circuits, this IC has a terminal pitch of 0.5mm and MSL level of 3 for industrial applications.

S-XQCC-N36

e3

6 mm

3

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC36,.25SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.75

Not Qualified

.8 mm

Other Telecom ICs

.055 mA

2.75 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

6 mm

ALM-GP002-TR1G by Broadcom

ALM-GP002-TR1G

Broadcom

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 12; Package Code: QCCN; Package Shape: RECTANGULAR;

R-XQCC-N12

4.5 mm

3

1

12

85 Cel

-40 Cel

UNSPECIFIED

QCCN

RECTANGULAR

CHIP CARRIER

260

1.05 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

QUAD

2.2 mm

TCA5013ZAHR by Texas Instruments

TCA5013ZAHR

Texas Instruments

TCA5013ZAHR by Texas Instruments is a 48-terminal, telecom interface IC with a supply voltage of 3.3V. It operates in industrial temperature range (-40 to 85°C) and has a peak reflow temperature of 260°C. This square-shaped IC is designed for telecom circuits, featuring a thin profile package body suitable for surface mount applications.

S-PBGA-B48

e1

5 mm

3

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.2 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

BQ500212ARGZT by Texas Instruments

BQ500212ARGZT

Texas Instruments

Texas Instruments BQ500212ARGZT is a telecom interface IC with 48 terminals in a square chip carrier package. Operating b/w -40 to 110°C, it has a nominal voltage of 3.3V and terminal pitch of 0.5mm. Ideal for industrial applications requiring no-lead terminal form and MSL level 3 moisture sensitivity.

S-PQCC-N48

e4

7 mm

3

1

48

110 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

7 mm

HPA02286ARLL by Texas Instruments

HPA02286ARLL

Texas Instruments

Texas Instruments' HPA02286ARLL is a 24-terminal telecom interface IC in a square chip carrier package. With a supply voltage of 3.3V, it operates b/w 0-85°C and has a terminal pitch of 0.5mm. Ideal for telecom circuits, this IC is surface-mountable and features nickel palladium gold terminal finish.

S-PQCC-N24

e4

3 mm

2

1

24

85 Cel

0 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

3 mm

ADN2915ACPZ by Analog Devices

ADN2915ACPZ

Analog Devices

ADN2915ACPZ by Analog Devices is a telecom IC with 24 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and consumes 0.3774mA current. This CMOS technology chip carrier is suitable for telecom circuit applications due to its compact square shape and low power consumption.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.2,1.8/3.3,3.3

Not Qualified

1 mm

ATM/SONET/SDH ICs

.3774 mA

3.3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

4 mm

BLUENRGQTR by STMicroelectronics

BLUENRGQTR

STMicroelectronics

BLUENRGQTR by STMicroelectronics is a 32-terminal telecom IC with 3V supply voltage. It operates b/w -40 to 85 °C, in industrial settings. This square-shaped chip carrier is surface-mountable and has a very thin profile, suitable for telecom circuit applications.

S-XQCC-N32

5 mm

1

32

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

1 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

5 mm

SST12LF02-QXCE by Microchip Technology

SST12LF02-QXCE

Microchip Technology

SST12LF02-QXCE by Microchip: Telecom IC with 16 terminals, 3.3V supply voltage, -20 to 85°C operating temp. Ideal for telecom circuits, surface mountable in a square chip carrier package with 0.5mm terminal pitch.

S-XQCC-N16

e3

3 mm

1

16

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

3.3 V

YES

TELECOM CIRCUIT

OTHER

MATTE TIN

NO LEAD

.5 mm

QUAD

3 mm

STS1TXQTR by STMicroelectronics

STS1TXQTR

STMicroelectronics

STS1TXQTR by STMicroelectronics is a telecom IC with 20 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 3V and terminal pitch of 0.5mm, it's ideal for telecom interface applications.

S-XQCC-N20

4 mm

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

1 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

4 mm

WL1801MODGBMOCR by Texas Instruments

WL1801MODGBMOCR

Texas Instruments

WL1801MODGBMOCR by Texas Instruments is a telecom IC with 100 terminals, operating at 3.7V. It offers a data rate of 100 Mbps and can withstand temperatures from -20 to 70°C. Ideal for telecom applications requiring high-speed data transmission in commercial-grade environments.

100 Mbps

R-PBGA-B100

e4

13.4 mm

3

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

260

2.9/4.8

Not Qualified

2 mm

Other Telecom ICs

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NICKEL PALLADIUM GOLD

BUTT

.7 mm

BOTTOM

30

13.3 mm

WL1805MODGBMOCR by Texas Instruments

WL1805MODGBMOCR

Texas Instruments

Texas Instruments' WL1805MODGBMOCR is a Telecom Interface IC with 100 terminals in a grid array package. Operating at -20 to 70°C, it supports data rates up to 100 Mbps at 3.7V supply voltage. Ideal for telecom circuits, this surface-mount IC has a compact rectangular shape and nickel palladium gold finish.

100 Mbps

R-PBGA-B100

e4

13.4 mm

3

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

260

2.9/4.8

Not Qualified

2 mm

Other Telecom ICs

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NICKEL PALLADIUM GOLD

BUTT

.7 mm

BOTTOM

30

13.3 mm

WL1805MODGBMOCT by Texas Instruments

WL1805MODGBMOCT

Texas Instruments

WL1805MODGBMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a rectangular grid array package. Operating at -20 to 70°C, it supports data rates up to 100 Mbps at 3.7V supply voltage. Ideal for commercial applications requiring high-speed telecommunications functionality.

100 Mbps

R-PBGA-B100

e4

13.4 mm

3

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

260

2.9/4.8

Not Qualified

2 mm

Other Telecom ICs

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NICKEL PALLADIUM GOLD

BUTT

.7 mm

BOTTOM

30

13.3 mm

WL1831MODGBMOCT by Texas Instruments

WL1831MODGBMOCT

Texas Instruments

WL1831MODGBMOCT by Texas Instruments is a telecom IC with 100 terminals in a grid array package. It operates at -20 to 70°C, with a data rate of 100 Mbps and nominal voltage of 3.7V. Ideal for telecom circuits, it features surface mount capability and measures 13.4mm x 13.3mm in size.

100 Mbps

R-PBGA-B100

e4

13.4 mm

3

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

260

2.9/4.8

Not Qualified

2 mm

Other Telecom ICs

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NICKEL PALLADIUM GOLD

BUTT

.7 mm

BOTTOM

30

13.3 mm

XWL1801MODGAMOCT by Texas Instruments

XWL1801MODGAMOCT

Texas Instruments

XWL1801MODGAMOCT by Texas Instruments is a telecom IC with 100 terminals in a rectangular grid array package. It operates b/w -20°C to 70°C, with a compact size of 13.3mm x 13.4mm and terminal pitch of 0.7mm. Ideal for telecom interface applications requiring surface mount technology.

R-PBGA-N100

13.4 mm

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

RECTANGULAR

GRID ARRAY

2 mm

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.7 mm

BOTTOM

13.3 mm

XWL1805MODGAMOCT by Texas Instruments

XWL1805MODGAMOCT

Texas Instruments

XWL1805MODGAMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a rectangular grid array package. It operates b/w -20°C to 70°C, with a compact size of 13.3mm width and 13.4mm length. Ideal for telecom circuits, this IC is surface mountable and has a terminal pitch of 0.7mm for various applications.

R-PBGA-N100

13.4 mm

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

RECTANGULAR

GRID ARRAY

2 mm

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.7 mm

BOTTOM

13.3 mm

XWL1831MODGAMOCT by Texas Instruments

XWL1831MODGAMOCT

Texas Instruments

XWL1831MODGAMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a grid array package. It operates b/w -20°C to 70°C, making it suitable for various telecom circuit applications. The compact rectangular design with bottom terminals and no-lead form factor ensures easy surface mount installation.

R-PBGA-N100

13.4 mm

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

RECTANGULAR

GRID ARRAY

2 mm

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.7 mm

BOTTOM

13.3 mm

XWL1835MODGAMOCT by Texas Instruments

XWL1835MODGAMOCT

Texas Instruments

XWL1835MODGAMOCT by Texas Instruments is a telecom IC with 100 terminals in a rectangular grid array package. It operates b/w -20°C to 70°C, with a nominal voltage of 3.7V. This IC is designed for telecom circuit applications requiring surface mount installation and has a compact size of 13.3mm x 13.4mm x 2mm.

R-PBGA-N100

13.4 mm

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

RECTANGULAR

GRID ARRAY

2 mm

3.7 V

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.7 mm

BOTTOM

13.3 mm

CC2538NF11RTQT by Texas Instruments

CC2538NF11RTQT

Texas Instruments

CC2538NF11RTQT by Texas Instruments is a telecom IC with 12 Mbps data rate, suitable for automotive applications. It operates at -40 to 125°C, has 56 terminals in a square chip carrier package, and supports a 3V supply voltage. The IC is surface mountable and features nickel palladium gold terminal finish.

12 Mbps

S-PQCC-N56

e4

8 mm

3

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

8 mm

CC2538NF23RTQT by Texas Instruments

CC2538NF23RTQT

Texas Instruments

CC2538NF23RTQT by Texas Instruments is a telecom IC with 12 Mbps data rate, suitable for automotive applications. It operates b/w -40 to 125°C, has 56 terminals in a square chip carrier package, and supports a 3V supply voltage. The IC is surface mountable with nickel palladium gold finish and very thin profile.

12 Mbps

S-PQCC-N56

e4

8 mm

3

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

8 mm

CC2538NF53RTQT by Texas Instruments

CC2538NF53RTQT

Texas Instruments

CC2538NF53RTQT by Texas Instruments is a telecom IC with 12 Mbps data rate, suitable for automotive applications. It operates b/w -40 to 125°C, has 56 terminals in a square chip carrier package, and supports a 3V supply voltage. The IC is surface mountable and features nickel palladium gold terminal finish.

12 Mbps

S-PQCC-N56

e4

8 mm

3

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

8 mm

CC2538SF23RTQT by Texas Instruments

CC2538SF23RTQT

Texas Instruments

CC2538SF23RTQT by Texas Instruments is a telecom IC with 12 Mbps data rate, suitable for automotive applications. It operates at -40 to 125°C, has 56 terminals in a square package style, and supports a nominal voltage of 3V. This surface-mount IC features nickel palladium gold terminal finish and very thin profile packaging.

12 Mbps

S-PQCC-N56

e4

8 mm

3

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

8 mm

CC2560BRVMR by Texas Instruments

CC2560BRVMR

Texas Instruments

CC2560BRVMR by Texas Instruments is a telecom IC with 76 terminals, operating at -40 to 85°C. It has a data rate of 4 Mbps and nominal voltage of 3.6V, suitable for telecom circuit applications. The package style is chip carrier with matte tin finish, measuring 7.73mm in width and 8mm in length.

4 Mbps

R-PQCC-N76

e3

8 mm

3

1

76

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.6 mm

QUAD

30

7.73 mm

CC2560BRVMT by Texas Instruments

CC2560BRVMT

Texas Instruments

Texas Instruments CC2560BRVMT is a 76-terminal telecom IC with matte tin finish. Operating b/w -40 to 85°C, it has a nominal voltage of 3.6V and terminal pitch of 0.6mm. Ideal for telecom circuits, this chip carrier is surface mountable and features an industrial temperature grade.

S-PQCC-N76

e3

8 mm

3

1

76

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.6 mm

QUAD

30

8 mm

CC2564BRVMT by Texas Instruments

CC2564BRVMT

Texas Instruments

Texas Instruments CC2564BRVMT is a 76-terminal telecom IC with a 3.6V supply voltage, operating b/w -40 to 85°C. It features matte tin finish, quad terminal position, and chip carrier package style for industrial applications requiring thin profile and surface mount compatibility.

R-PQCC-N76

e3

8 mm

3

1

76

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.6 mm

QUAD

30

7.73 mm

SN65DSI86ZQER by Texas Instruments

SN65DSI86ZQER

Texas Instruments

SN65DSI86ZQER by Texas Instruments is a 64-terminal, telecom interface IC with a data rate of 5400 Mbps. It operates b/w -40 to 85°C and has a supply voltage of 1.2V, making it suitable for industrial applications requiring high-speed data transmission in compact spaces. The package style is grid array with very thin profile and fine pitch, ideal for surface mount assembly processes.

5400 Mbps

S-PBGA-B64

e1

5 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.2 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

PGA5807ARGCR by Texas Instruments

PGA5807ARGCR

Texas Instruments

PGA5807ARGCR by Texas Instruments is a 64-terminal telecom IC with a supply voltage of 3.3V. It operates in industrial temperature range (-40 to 85°C) and has a package style of chip carrier. Suitable for telecom circuits, it features nickel palladium gold terminal finish and is surface mountable.

S-PQCC-N64

e4

9 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

9 mm

PGA5807ARGCT by Texas Instruments

PGA5807ARGCT

Texas Instruments

PGA5807ARGCT by Texas Instruments is a 64-terminal telecom interface IC in a square chip carrier package. With a supply voltage of 3.3V, it operates b/w -40 to 85°C and has a peak reflow temperature of 260°C. Ideal for industrial applications requiring very thin profile components.

S-PQCC-N64

e4

9 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

9 mm

TCC-106A-RT by Onsemi

TCC-106A-RT

Onsemi

TCC-106A-RT by Onsemi is a Telecom Circuit IC with 20 terminals in a very thin profile grid array package. Operating temperature ranges from -30 to 85 °C, suitable for telecom interface applications. It has a nominal voltage of 3.3V and terminal pitch of 0.4mm, making it ideal for compact electronic devices.

R-PBGA-B20

2.58 mm

1

20

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.65 mm

3.3 V

YES

TELECOM CIRCUIT

OTHER

BALL

.4 mm

BOTTOM

2.23 mm

TCP-3027N-QT by Onsemi

TCP-3027N-QT

Onsemi

TCP-3027N-QT by Onsemi is a RECTANGULAR CHIP CARRIER with 6 terminals, suitable for TELECOM CIRCUIT applications. It operates b/w -30 °C to 85°C, with a compact size of 1.2mm width and 1.6mm length. Ideal for surface mount installations due to its very thin profile design.

R-XQCC-N6

1.6 mm

1

6

85 Cel

-30 Cel

UNSPECIFIED

VQCCN

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE

1 mm

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

1.2 mm

TLK10022CTR by Texas Instruments

TLK10022CTR

Texas Instruments

TLK10022CTR by Texas Instruments is a 144-terminal, telecom interface IC with data rate of 10 Gbps. It operates b/w -40 to 85°C and has a supply voltage of 1V. Ideal for industrial applications requiring high-speed telecommunications circuitry in compact form factor.

10000 Mbps

S-PBGA-B144

e1

13.05 mm

4

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

3.25 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

13.05 mm

SA606DK/03,118 by NXP Semiconductors

SA606DK/03,118

NXP Semiconductors

SA606DK/03,118 by NXP Semiconductors is a telecom interface IC designed for industrial applications. It features a dual terminal configuration with a max operating temp of 85 °C and operates at a nominal voltage of 3V. Its compact size (4.4mm x 6.5mm) ensures efficient integration in various devices.

R-PDSO-G20

6.5 mm

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

1.5 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

4.4 mm

TLK2711HFG/EM by Texas Instruments

TLK2711HFG/EM

Texas Instruments

TLK2711HFG/EM by Texas Instruments is a telecom IC with 68 terminals in a square package. It operates at 2.5V and has a terminal pitch of 0.64mm. This IC is suitable for telecom circuit applications due to its compact flatpack design and metal-sealed co-fired body material.

S-CQFP-F68

13.97 mm

1

68

CERAMIC, METAL-SEALED COFIRED

GQFF

SQUARE

FLATPACK, GUARD RING

NOT SPECIFIED

2.68 mm

2.5 V

YES

TELECOM CIRCUIT

FLAT

.64 mm

QUAD

NOT SPECIFIED

13.97 mm

BGA711N7E6327XTSA1 by Infineon Technologies

BGA711N7E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: HVSON; Package Shape: RECTANGULAR;

R-PDSO-N6

e3

2 mm

1

1

6

85 Cel

-30 Cel

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

2.8 V

YES

BIPOLAR

TELECOM CIRCUIT

OTHER

TIN

NO LEAD

.5 mm

DUAL

1.3 mm

BGM1034N7E6327XUSA1 by Infineon Technologies

BGM1034N7E6327XUSA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 7; Package Code: HVSON; Package Shape: RECTANGULAR;

R-PDSO-N7

2.3 mm

1

7

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.77 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.54 mm

DUAL

NOT SPECIFIED

1.7 mm

BGS15AN16E6327XTSA1 by Infineon Technologies

BGS15AN16E6327XTSA1

Infineon Technologies

BGS15AN16E6327XTSA1 by Infineon is a telecom interface IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -30 to 85°C, with a nominal voltage of 3.5V. This IC is designed for telecom circuits, featuring a very thin profile and tin terminal finish for surface mount applications.

S-PQCC-N16

e3

2.3 mm

1

1

16

85 Cel

-30 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.77 mm

3.5 V

YES

TELECOM CIRCUIT

OTHER

TIN

NO LEAD

.5 mm

QUAD

2.3 mm

TDA5252XUMA1 by Infineon Technologies

TDA5252XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 38; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G38

9.7 mm

3

1

38

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1.2 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.5 mm

DUAL

4.4 mm

TDA5251XUMA1 by Infineon Technologies

TDA5251XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 38; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G38

9.7 mm

1

38

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NOT SPECIFIED

1.2 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.5 mm

DUAL

NOT SPECIFIED

4.4 mm

TDA5255XUMA1 by Infineon Technologies

TDA5255XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 38; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G38

9.7 mm

3

1

38

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1.2 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.5 mm

DUAL

4.4 mm

HTMS1101FTB/AF,115 by NXP Semiconductors

HTMS1101FTB/AF,115

NXP Semiconductors

HTMS1101FTB/AF,115 by NXP Semiconductors is a compact telecom interface IC designed for industrial applications. It features a dual terminal design with a max operating temp of 85 °C and operates in extreme conditions from -40 °C. Its small outline and no-lead form factor make it ideal for space-constrained environments.

R-PDSO-N3

1.45 mm

1

3

85 Cel

-40 Cel

PLASTIC/EPOXY

VSON

LCC3(UNSPEC)

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

Not Qualified

.5 mm

Other Telecom ICs

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

DUAL

1 mm

HTMS1201FUG/AM,005 by NXP Semiconductors

HTMS1201FUG/AM,005

NXP Semiconductors

HTMS1201FUG/AM,005 by NXP Semiconductors is a robust telecom interface IC designed for industrial applications. It operates in extreme temperatures from -40 °C to 85 °C and features a no-lead terminal form in a square package. Ideal for surface mount technology, it ensures reliable performance in demanding environments.

S-XUUC-N

1

85 Cel

-40 Cel

UNSPECIFIED

DIE

WAFER

SQUARE

UNCASED CHIP

Not Qualified

Other Telecom ICs

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

HTMS1201FTB/AF,115 by NXP Semiconductors

HTMS1201FTB/AF,115

NXP Semiconductors

HTMS1201FTB/AF,115 by NXP Semiconductors is a compact telecom interface IC designed for industrial applications. It features a dual terminal design with a max operating temp of 85 °C and operates in extreme conditions from -40 °C. Its small outline and no-lead form factor make it ideal for space-constrained environments.

R-PDSO-N3

1.45 mm

1

3

85 Cel

-40 Cel

PLASTIC/EPOXY

VSON

LCC3(UNSPEC)

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

Not Qualified

.5 mm

Other Telecom ICs

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

DUAL

1 mm

ADRF6820ACPZ-R7 by Analog Devices

ADRF6820ACPZ-R7

Analog Devices

Analog Devices' ADRF6820ACPZ-R7 is a 40-terminal telecom IC with a 3.3V supply voltage, operating b/w -40 to 85°C. It features a square chip carrier package style, 0.5mm terminal pitch, and is ideal for telecom circuit applications due to its industrial temperature grade suitability.

S-XQCC-N40

6 mm

1

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.8 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

6 mm

BGM1032N7E6327XUSA1 by Infineon Technologies

BGM1032N7E6327XUSA1

Infineon Technologies

BGM1032N7E6327XUSA1 by Infineon is a telecom IC with 6 terminals, operating from -40 to 85°C. It has a small outline package style and nominal voltage of 2.7V, suitable for industrial applications requiring a very thin profile and surface mount capability.

R-PDSO-N6

2.3 mm

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.77 mm

2.7 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.54 mm

DUAL

NOT SPECIFIED

1.7 mm

BGM1043N7E6327XUSA1 by Infineon Technologies

BGM1043N7E6327XUSA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: HVSON; Package Shape: RECTANGULAR;

R-PDSO-N6

2.3 mm

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.77 mm

2.7 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.54 mm

DUAL

NOT SPECIFIED

1.7 mm

BGS12AL74E6327XTSA1 by Infineon Technologies

BGS12AL74E6327XTSA1

Infineon Technologies

Infineon's BGS12AL74E6327XTSA1 is a telecom IC with 6 terminals in a rectangular chip carrier package. Operating b/w -30°C to 85°C, it has a nominal voltage of 2.8V. Ideal for telecom interfaces, this surface-mount IC features gold terminal finish and 0.55mm pitch.

R-XBCC-B6

e4

2.3 mm

1

1

6

85 Cel

-30 Cel

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

.5 mm

2.8 V

YES

TELECOM CIRCUIT

OTHER

GOLD

BUTT

.55 mm

BOTTOM

1.5 mm

BGS12AL76E6327XTMA1 by Infineon Technologies

BGS12AL76E6327XTMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 6; Package Code: BCC; Package Shape: RECTANGULAR;

R-XBCC-B6

e4

1.26 mm

1

1

6

85 Cel

-30 Cel

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

.4 mm

2.8 V

YES

TELECOM CIRCUIT

OTHER

GOLD

BUTT

.48 mm

BOTTOM

1.4 mm

SKY13453-385LF by Skyworks Solutions

SKY13453-385LF

Skyworks Solutions

SKY13453-385LF by Skyworks Solutions is a telecom IC with 6 terminals in a square chip carrier package. Operating temperature ranges from -40 to 90°C, suitable for industrial use. Nominal voltage of 2.8V makes it ideal for telecom circuit applications.

S-XQCC-N6

1 mm

1

1

6

90 Cel

-40 Cel

UNSPECIFIED

QCCN

SQUARE

CHIP CARRIER

260

.5 mm

2.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

QUAD

1 mm