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PGA5807ARGCR

Texas Instruments

PGA5807ARGCR by Texas Instruments

PGA5807ARGCR by Texas Instruments is a 64-terminal telecom IC with a supply voltage of 3.3V. It operates in industrial temperature range (-40 to 85°C) and has a package style of chip carrier. Suitable for telecom circuits, it features nickel palladium gold terminal finish and is surface mountable.

Median Price

$34.064

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,750 parts In-Stock

1+ parts

$34.064

100+ parts

$30.279

1k+ parts

$22.264

10k+ parts

-

1,750

$34.064

$30.279

$22.264

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 39 parts In-Stock

1+ parts

$22.264

100+ parts

-

1k+ parts

-

10k+ parts

-

39

$22.264

-

-

-

Digiode

USA . 4,647 parts In-Stock

1+ parts

$32.361

100+ parts

-

1k+ parts

-

10k+ parts

-

4,647

$32.361

-

-

-

Vyrian

USA . 7,020 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,020

-

-

-

-

Chip Stock

USA . 887 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

887

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 371 parts In-Stock

1+ parts

$12.024

100+ parts

-

1k+ parts

-

10k+ parts

-

371

$12.024

-

-

-

Parana Technologies

USA . 1,022 parts In-Stock

1+ parts

$13.019

100+ parts

$1,209.004

1k+ parts

$11.717

10k+ parts

-

1,022

$13.019

$1,209.004

$11.717

-

DigiPath Technology Company

USA . 265 parts In-Stock

1+ parts

$14.335

100+ parts

-

1k+ parts

-

10k+ parts

-

265

$14.335

-

-

-

ChromeModa Solutions

Germany . 2,709 parts In-Stock

1+ parts

$14.628

100+ parts

$11.995

1k+ parts

-

10k+ parts

-

2,709

$14.628

$11.995

-

-

IDEA Electronic Components Group

UK . 600 parts In-Stock

1+ parts

$14.628

100+ parts

$13.897

1k+ parts

$13.165

10k+ parts

-

600

$14.628

$13.897

$13.165

-

AZTECH Wire

Italy . 1,041 parts In-Stock

1+ parts

$17.210

100+ parts

-

1k+ parts

-

10k+ parts

-

1,041

$17.210

-

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

$21.819

100+ parts

-

1k+ parts

$20.946

10k+ parts

-

100

$21.819

-

$20.946

-

Continental Prestige Electronics

USA . 6,034 parts In-Stock

1+ parts

$22.264

100+ parts

-

1k+ parts

-

10k+ parts

$21.819

6,034

$22.264

-

-

$21.819

Ampacity Inc.

Singapore . 1,328 parts In-Stock

1+ parts

$28.950

100+ parts

-

1k+ parts

-

10k+ parts

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1,328

$28.950

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-

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Corphita

USA . 4,937 parts In-Stock

1+ parts

$30.658

100+ parts

-

1k+ parts

-

10k+ parts

-

4,937

$30.658

-

-

-

Semicontronic

India . 1,275 parts In-Stock

1+ parts

$63.020

100+ parts

$61.444

1k+ parts

$61.129

10k+ parts

-

1,275

$63.020

$61.444

$61.129

-

Microchip USA

USA . 3,753 parts In-Stock

1+ parts

$68.110

100+ parts

$66.920

1k+ parts

$66.330

10k+ parts

$65.740

3,753

$68.110

$66.920

$66.330

$65.740

Argo Parts USA

USA . 1,626 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,626

-

-

-

-

Overview

Elevate your telecom interface systems with the PGA5807ARGCR by Texas Instruments. Crafted with precision and quality, this innovative IC offers unparalleled performance and reliability. Whether you're in need of advanced telecom circuitry or cutting-edge interface solutions, this product delivers. With a temperature range of -40°C to 85°C and a sleek square chip carrier design, it's designed to exceed your expectations. Trust Texas Instruments to provide top-of-the-line technology that maximizes efficiency and productivity in your applications. Upgrade to the PGA5807ARGCR and experience superior quality and value like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and reliability to the product.

Surface Mount: YES

The ability to be surface mounted offers ease of installation and space-saving benefits.

Package Shape: SQUARE

The square package shape allows for efficient use of board space.

No. of Terminals: 64

With 64 terminals, this product offers extensive connectivity options.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design enhances thermal performance and saves space.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures stable performance even in demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation in a wide range of conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent conductivity and corrosion resistance.

Terminal Position: QUAD

The quad terminal position simplifies circuit connections and routing.

Maximum Seated Height: 1 mm

The low maximum seated height enables compact device designs.

Width: 9 mm

The 9mm width offers compatibility with various board layouts.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures optimal soldering results.

Peak Reflow Temperature °C: 260

The high peak reflow temperature supports efficient soldering processes.

Length: 9 mm

The 9mm length allows for flexible placement on the PCB.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes this product suitable for rugged applications.

Terminal Form: NO LEAD

The no lead terminal form is environmentally friendly and meets industry standards.

Telecom IC Type: TELECOM CIRCUIT

This product is specifically designed for telecom applications, ensuring compatibility and high performance.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is ideal for telecom systems and reduces power consumption.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for fine-pitch connections in compact designs.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the level of protection against moisture, enhancing product reliability.

Technical Specifications

Other Function Telecom Interface ICs PGA5807ARGCR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

PGA5807ARGCR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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