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PGA5807RGCT

Texas Instruments

PGA5807RGCT by Texas Instruments

PGA5807RGCT by Texas Instruments is a 64-terminal telecom IC with a 3.3V supply voltage, operating b/w -40 to 85°C. It features a square chip carrier package style, nickel palladium gold terminal finish, and no-lead terminal form. Ideal for industrial applications requiring very thin profile packages in surface mount configurations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,481 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,481

-

-

-

-

Vyrian

USA . 2,833 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,833

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,310 parts In-Stock

1+ parts

$5.834

100+ parts

-

1k+ parts

$6.619

10k+ parts

-

2,310

$5.834

-

$6.619

-

ChromeModa Solutions

Germany . 6,068 parts In-Stock

1+ parts

$6.555

100+ parts

$5.375

1k+ parts

-

10k+ parts

-

6,068

$6.555

$5.375

-

-

IDEA Electronic Components Group

UK . 1,998 parts In-Stock

1+ parts

$6.555

100+ parts

-

1k+ parts

$5.900

10k+ parts

-

1,998

$6.555

-

$5.900

-

AZTECH Wire

Italy . 316 parts In-Stock

1+ parts

$7.921

100+ parts

-

1k+ parts

-

10k+ parts

-

316

$7.921

-

-

-

One Stop Electronics

USA . 234 parts In-Stock

1+ parts

$857.000

100+ parts

-

1k+ parts

-

10k+ parts

-

234

$857.000

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-

-

Corphita

USA . 1,415 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,415

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-

-

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Microchip USA

USA . 1,102 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,102

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-

-

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DigiPath Technology Company

USA . 77 parts In-Stock

1+ parts

-

100+ parts

$5.910

1k+ parts

-

10k+ parts

-

77

-

$5.910

-

-

Overview

Unlock the power of seamless telecom interface integration with the PGA5807RGCT by Texas Instruments. Crafted with precision and expertise, this chip carrier boasts a very thin profile, ensuring top-notch performance in industrial settings. With a nominal supply voltage of 3.3V and a temperature grade of industrial, this telecom circuit is designed to exceed expectations. Experience unparalleled quality and reliability in your applications with the PGA5807RGCT. Elevate your projects to new heights with Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection for the internal components of the IC, ensuring reliability in various operating conditions.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient integration onto circuit boards, saving space and simplifying manufacturing processes.

Package Shape: SQUARE

The square package shape offers a standardized form factor, making it convenient for PCB layout and ensuring compatibility with a wide range of equipment.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V, this IC is suitable for telecom applications where low power consumption is desired.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can withstand elevated temperatures common in industrial environments, ensuring reliable performance.

Technical Specifications

Other Function Telecom Interface ICs PGA5807RGCT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

PGA5807RGCT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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