Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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BGM1032N7E6327XUSA1 by Infineon is a telecom IC with 6 terminals, operating from -40 to 85°C. It has a small outline package style and nominal voltage of 2.7V, suitable for industrial applications requiring a very thin profile and surface mount capability.
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The use of plastic/epoxy material ensures durability and reliability of the product, making it suitable for long-term use in various applications.
Being surface mount compatible allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.
The rectangular package shape provides a compact form factor, optimizing space utilization on the circuit board.
Having 6 terminals allows for versatile connection options, enabling the product to interface with multiple devices or components.
The small outline, heat sink/slug, and very thin profile package style helps in efficient heat dissipation and space-saving on the PCB layout.
With a high maximum operating temperature of 85°C, the product can withstand challenging environmental conditions, ensuring reliable performance.
The low minimum operating temperature of -40°C makes the product suitable for use in extreme cold environments without compromising functionality.
Having dual terminal positions provides flexibility in connection orientation, making it easier to integrate the product into different circuit layouts.
The narrow width of 1.7 mm helps in achieving a compact and space-efficient design for the product, ideal for applications with size constraints.
The short length of 2.3 mm contributes to the overall compactness of the product, allowing for efficient placement on the PCB.
The industrial temperature grade ensures that the product can operate reliably in harsh industrial environments, providing long-term durability.
The no lead terminal form eliminates the risk of lead-related issues, making the product environmentally friendly and compliant with regulations.
Being a telecom circuit type IC, the product is specifically designed for telecom applications, guaranteeing optimized performance in telecommunications systems.
The nominal supply voltage of 2.7 V ensures compatibility with standard power sources, making the product easy to integrate into existing systems.
The small terminal pitch of 0.54 mm provides precise and secure connections, enhancing the overall reliability of the product in operation.
Other Function Telecom Interface ICs BGM1032N7E6327XUSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies
JESD-30 Code:
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BGM1032N7E6327XUSA1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
1N4148WS
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1N4148
Rochester Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
C0805C104K5RACTU
KEMET Corporation
KEMET C0805C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and reliable performance.
SS14
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM7805CT
Integrated Circuit Technology
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Position: SINGLE; Operating Temperature (TJ-Min): 0 Cel;
SMBJ18CA
Leshan Radio
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
MMBT3904LT1G
Onsemi
MMBT3904LT1G by Onsemi is a NPN BJT with max. collector-emitter voltage of 40V, hFE of 30, and fT of 300MHz. Ideal for small signal applications in electronics due to its compact size, high transition frequency, and low power dissipation capabilities.
LM555CM
Texas Instruments
LM555CM by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V and max operating temperature of 70°C. It comes in a small outline package, suitable for applications requiring pulse generation or rectangular waveform outputs. With surface mount capability and low supply current of 15mA, it is ideal for commercial-grade electronic circuits.
Silicon Standard
1554216002
Molex
WIRE AND CABLE;
Rugao Dachang Electronic
Compensated Devices
RECTIFIER DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
BSS138DW-7-F
Diodes Incorporated
BSS138DW-7-F by Diodes Incorporated is a N-channel small signal FET with a min DS breakdown voltage of 50V. It is used for switching applications and operates in enhancement mode. This surface mount transistor has a max drain current of 0.2A and a max power dissipation of 0.2W.
Transys Electronics
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRCW040210K0FKED
Vishay Intertechnology
Vishay Intertechnology's CRCW040210K0FKED is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.063 W power dissipation. Ideal for surface mount applications in electronics due to its compact SMT package style and high operating temperature range of -55 to 155 °C.
M39029/56351
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/56351 is a CRIMP contact type backshell accessory compliant with MIL-DTL-38999. It features FEMALE gender contacts, compatible with M39029/58363 mating contacts. The insertion and removal tools required are M81969/14-10 and M22520/2-10 respectively, making it ideal for military connector applications.
TDK5110FHTMA1
Infineon Technologies
Infineon's TDK5110FHTMA1 is a telecom IC with 10 terminals, operating at -40 to 125°C. It has a supply voltage of 3V and consumes 0.021mA current. This small outline IC in plastic package is ideal for automotive telecom applications.
SX8651ICSTRT
Semtech
Semtech's SX8651ICSTRT is a 12-terminal IC with nickel palladium gold finish. It operates b/w -40 to 85°C, ideal for industrial telecom circuits at 1.8V supply voltage. The package style is grid array, very thin profile, fine pitch, suitable for surface mount applications.
MAX3799ETJ+T
Maxim Integrated
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
TMS3705A1DRG4
TMS3705A1DRG4 by Texas Instruments is a 16-terminal telecom IC with 5V supply voltage. It operates b/w -40 to 105°C, suitable for industrial use. The package is small outline, surface mountable, with Gull Wing terminals ideal for telecom circuit applications.
NEO-M9N-00B
U-blox Ag
NEO-M9N-00B by U-blox Ag is a GNSS Module with 24 terminals, operating at -40 to 85°C. It has a data rate of 12 Mbps and operates at 3V supply voltage. This surface-mount module in rectangular shape is ideal for telecom applications requiring precise positioning.
BT840XE
Fanstel
Fanstel's BT840XE is a surface mount telecom IC with 61 terminals, operating b/w -40 to 85°C. With a nominal voltage of 3.3V, it offers a data rate of 2 Mbps. Ideal for applications requiring high-speed telecommunications in compact spaces.
L76-M33
Quectel Wireless Solutions
Quectel Wireless Solutions' L76-M33 is a surface mount telecom IC with 18 terminals. Operating temperature range from -40 to 85°C, ideal for industrial applications. Compact package size of 10.1mm x 9.7mm x 2.5mm makes it suitable for various telecom interface functions.
XB3-24ARM-J
Digi International
The Digi International XB3-24ARM-J is a TELECOM CIRCUIT IC with 1 Mbps data rate. Operating temperature range: -40 to 85°C. RECTANGULAR package shape for telecom interfaces, ideal for various telecommunications applications.
WL1831MODGBMOCT
WL1831MODGBMOCT by Texas Instruments is a telecom IC with 100 terminals in a grid array package. It operates at -20 to 70°C, with a data rate of 100 Mbps and nominal voltage of 3.7V. Ideal for telecom circuits, it features surface mount capability and measures 13.4mm x 13.3mm in size.
NRF24L01P-R7
Nordic Semiconductor Asa
NRF24L01P-R7 by Nordic Semiconductor Asa is a 20-terminal IC with 3V supply voltage, operating from -40 to 85°C. It's a telecom circuit type with quad terminals in a square chip carrier package. Ideal for industrial applications requiring low-profile surface-mount components.
450-0178C
Ls Research
TELECOM CIRCUIT;
BT121-A-V2
Silicon Labs
BT121-A-V2 by Silicon Labs is a telecom IC with 33 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 1mm. This surface-mount IC is ideal for industrial applications requiring compact MICROELECTRONIC ASSEMBLY packages.
BGT24MR2E6327XUMA1
BGT24MR2E6327XUMA1 by Infineon is a Telecom IC with 32 terminals in a rectangular chip carrier package. Operating temperature ranges from -40 to 105°C, suitable for industrial use. It operates at 3.3V and features a thin profile design for telecom circuit applications.
XB3-24Z8UM
The Digi International XB3-24Z8UM is a surface mount telecom IC with 34 terminals. Operating temperature ranges from -40°C to 85°C, suitable for industrial applications. With a compact size of 13mm x 19mm, it's ideal for telecom circuit integration in various devices.
RN4871-I/RM130
Microchip Technology
RN4871-I/RM130 by Microchip Technology is a surface mount telecom interface IC with 16 terminals. It operates in an industrial temperature range of -40 to 85 °C and has a data rate of 0.01 Mbps. This IC is commonly used in telecom circuits for various applications.
NEO-M8U-0
NEO-M8U-0 by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. Its AEC-Q100 screening level and TS 16949 certification make it ideal for industrial applications requiring a 3V supply voltage. With a compact rectangular package style, this IC is suitable for various telecom circuit functions.
CC2520RHDT
CC2520RHDT by Texas Instruments is a telecom IC with 28 terminals in a square chip carrier package. It operates b/w -40 to 125°C, suitable for automotive applications. With a data rate of 0.25 Mbps and nominal voltage of 3V, it's ideal for telecom circuits requiring high reliability.
PN7160A1EV/C100K
NXP Semiconductors
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
XB3-24Z8UT
The Digi International XB3-24Z8UT is an industrial-grade telecom circuit with 20 terminals in a through-hole package. It operates b/w -40°C to 85°C, making it suitable for various telecom interface applications. This MICROELECTRONIC ASSEMBLY offers reliable performance in harsh environments.
AS3933-BQFT
Sciosense Bv
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
BGM111A256V21R
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 31; Package Shape: RECTANGULAR; Length: 15 mm;
BGM13P22F512GE-V2
BGM111A256V2R
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 31; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;
BGM13P22F512GA-V2R
BGM113A256V2R
BGM113A256V2R by Silicon Labs is a telecom IC with 36 terminals, operating temperature range of -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 0.8mm. This surface-mount IC is ideal for industrial applications requiring compact microelectronic assemblies.
BGM11S22F256GA-V2
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e4; Terminal Finish: NICKEL GOLD;
BGM111A256V21
BGM111A256V21 by Silicon Labs is a telecom IC with 31 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 1.2mm. This rectangular surface-mount package is ideal for industrial telecom circuit applications due to its compact size and temperature range.
BGM111A256V2
BGM111A256V2 by Silicon Labs is a telecom IC with 31 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 1.2mm. This rectangular surface-mount package is ideal for industrial applications requiring reliable telecom circuit interfaces.
BGM13P22F512GA-V2
BGM113A256V21R
BGM113A256V21R by Silicon Labs is a telecom IC with 36 terminals, operating temperature range of -40 to 85°C, and nominal voltage of 3.3V. It is designed for industrial applications requiring a surface mount rectangular package style with a seated height of 2mm.
BGM113A256V2
BGM113A256V2 by Silicon Labs is a telecom IC with 36 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 0.8mm. This rectangular microelectronic assembly is ideal for industrial applications requiring telecom circuit interfaces.
BGM123A256V2R
BGM123A256V2R by Silicon Labs is a telecom IC with 56 terminals, operating temperature range of -40 to 85°C, and nominal voltage of 3.3V. It is designed for telecom circuit applications in industrial settings due to its compact square package style and surface mount capability.
BGM113A256V21
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Shape: RECTANGULAR; Length: 15.73 mm;
BGM121A256V2R
BGM121A256V2R by Silicon Labs is a surface mount telecom interface IC with 1 function. It has a square package shape, 56 terminals, and a max seated height of 1.4mm. This industrial-grade IC operates at temperatures ranging from -40 to 85°C and has a nominal voltage of 3.3V.
BGM15MA12E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 12; Package Code: VQCCN; Package Shape: RECTANGULAR;
BGM121A256V2
Silicon Labs' BGM121A256V2 is a telecom IC with 56 terminals, operating from -40 to 85°C. It has a nominal voltage of 3.3V and is designed for industrial-grade applications. The surface-mountable square package measures 6.5mm x 6.5mm x 1.4mm, making it suitable for compact telecom interface solutions.
BGM15HA12E6327XTSA1
BGM15LA12E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 12; Package Code: BCC; Package Shape: RECTANGULAR;
BGM13P22F512GE-V2R
BGM123A256V2
Silicon Labs BGM123A256V2 is a telecom IC with 56 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and MSL level of 3. Suitable for industrial applications, it comes in a square package style measuring 6.5mm x 6.5mm x 1.4mm, making it ideal for surface mount assembly processes up to 260°C peak reflow temperature within 40 seconds.
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