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CC2560BRVMR

Texas Instruments

CC2560BRVMR by Texas Instruments

CC2560BRVMR by Texas Instruments is a telecom IC with 76 terminals, operating at -40 to 85°C. It has a data rate of 4 Mbps and nominal voltage of 3.6V, suitable for telecom circuit applications. The package style is chip carrier with matte tin finish, measuring 7.73mm in width and 8mm in length.

Median Price

$3.644

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 116,966 parts In-Stock

1+ parts

$3.644

100+ parts

$3.193

1k+ parts

$1.804

10k+ parts

-

116,966

$3.644

$3.193

$1.804

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,968 parts In-Stock

1+ parts

$3.462

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1,968

$3.462

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Chip Stock

USA . 19,900 parts In-Stock

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19,900

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Vyrian

USA . 1,940 parts In-Stock

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1,940

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Distributors (Availability)

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Native Components

USA . 215 parts In-Stock

1+ parts

$0.091

100+ parts

-

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$0.087

215

$0.091

-

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$0.087

Northwest PG Solutions

USA . 16 parts In-Stock

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$0.100

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-

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$0.088

16

$0.100

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$0.088

Corphita

USA . 4,107 parts In-Stock

1+ parts

$3.280

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4,107

$3.280

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Parana Technologies

USA . 578 parts In-Stock

1+ parts

$15.546

100+ parts

-

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$15.920

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578

$15.546

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$15.920

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DigiPath Technology Company

USA . 462 parts In-Stock

1+ parts

$17.118

100+ parts

$15.748

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462

$17.118

$15.748

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ChromeModa Solutions

Germany . 5,916 parts In-Stock

1+ parts

$17.467

100+ parts

$14.323

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5,916

$17.467

$14.323

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IDEA Electronic Components Group

UK . 41 parts In-Stock

1+ parts

$17.467

100+ parts

$16.594

1k+ parts

$15.720

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41

$17.467

$16.594

$15.720

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AZTECH Wire

Italy . 624 parts In-Stock

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$18.090

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624

$18.090

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S.R.D Solutions

India . 27,000 parts In-Stock

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Lixinc

USA . 13,338 parts In-Stock

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Perfect Parts

USA . 8,400 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,604 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,736 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Overview

Experience seamless connectivity and superior performance with the Texas Instruments CC2560BRVMR. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality in all their products. The CC2560BRVMR falls under the category of Other Function Telecom Interface ICs, offering a wide range of applications. From telecom circuits to various interface functions, this product is versatile and reliable. With advanced features and a durable package body material, customers can trust in the value and benefits that the CC2560BRVMR brings to their projects. Trust Texas Instruments for your telecom interface needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to harsh conditions, making this product a robust choice for telecom applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto circuit boards, saving space and enhancing overall design flexibility.

No. of Terminals: 76

With a high number of terminals, this product offers extensive connectivity options for various telecom interfaces and components.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding industrial environments.

Nominal Supply Voltage: 3.6 V

With a nominal supply voltage of 3.6V, this product is compatible with standard power sources, offering ease of integration into existing setups.

Technical Specifications

Other Function Telecom Interface ICs CC2560BRVMR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

4 Mbps

JESD-30 Code:

R-PQCC-N76

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

76

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.6 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.73 mm

Trade Compliance

CC2560BRVMR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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