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TELECOM CIRCUIT Other Function Telecom Interface ICs 1,221

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Applications Battery Feed Battery Supply (V) Carrier Type-1 Carrier Type-2 Carrier Type-3 Companding Law Data Rate Filter Maximum Gain Tolerance Hybrid ISDN Access Rate Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Minimum Output High Voltage Maximum Output Low Current Maximum Output Low Voltage Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Reference Point Resolution (um) Screening Level Maximum Seated Height Standard Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
RI-STU-MRD1-30 by Texas Instruments

RI-STU-MRD1-30

Texas Instruments

RI-STU-MRD1-30 by Texas Instruments is a 30-terminal RECTANGULAR package MICROELECTRONIC ASSEMBLY with -20 to 50 °C operating temp range. It features DUAL terminals, TELECOM CIRCUIT type, and 5V supply voltage. Ideal for telecom interface applications requiring reliable performance in various temperature conditions.

R-XDMA-T30

1

30

50 Cel

-20 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

5 V

NO

TELECOM CIRCUIT

OTHER

THROUGH-HOLE

DUAL

MAX5935CAX by Maxim Integrated

MAX5935CAX

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR;

R-PDSO-G36

15.375 mm

1

36

70 Cel

0 Cel

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

NOT SPECIFIED

2.65 mm

YES

BICMOS

TELECOM CIRCUIT

COMMERCIAL

GULL WING

.8 mm

DUAL

NOT SPECIFIED

7.5 mm

PHY2078QT-BR by Maxim Integrated

PHY2078QT-BR

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N32

e3

5 mm

1

1

32

95 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

5 mm

CC2595RGTT by Texas Instruments

CC2595RGTT

Texas Instruments

CC2595RGTT by Texas Instruments is a telecom IC with 16 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features include 3V supply voltage, surface mount design, and nickel palladium gold terminal finish.

S-PQCC-N16

e4

3 mm

2

1

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

3 mm

AD8015AR by Analog Devices

AD8015AR

Analog Devices

AD8015AR by Analog Devices is a telecom interface IC with 8 terminals, operating b/w -40 to 85°C. It has a supply voltage of 5V and max current of 26mA. Ideal for industrial applications requiring small outline packages in telecom circuits.

R-PDSO-G8

e0

4.9 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

240

Not Qualified

1.75 mm

26 mA

5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

3.9 mm

BA4116FV-E2 by ROHM

BA4116FV-E2

ROHM

ROHM's BA4116FV-E2 is a 16-terminal telecom interface IC with a small outline, thin profile package. It operates b/w -30°C to 85°C and has a peak reflow temperature of 260°C. Ideal for telecom circuits, it has a nominal voltage of 5V and Gull Wing terminal form.

R-PDSO-G16

e3/e2

5 mm

1

16

85 Cel

-30 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

Not Qualified

1.2 mm

5 V

YES

TELECOM CIRCUIT

OTHER

TIN/TIN COPPER

GULL WING

.65 mm

DUAL

10

4.4 mm

MAX2510EEI by Maxim Integrated

MAX2510EEI

Maxim Integrated

MAX2510EEI by Maxim Integrated is a telecom IC with 28 terminals, operating at -40 to 85°C. It has a supply voltage of 3/5V and max current of 25mA. Ideal for telecom interface applications due to its small outline package and industrial temperature grade.

R-PDSO-G28

e0

9.89 mm

1

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

SSOP

SSOP28,.25

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

3/5

Not Qualified

1.75 mm

Other Telecom ICs

25 mA

3 V

YES

BIPOLAR

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.635 mm

DUAL

3.9 mm

TLK2541PFPG4 by Texas Instruments

TLK2541PFPG4

Texas Instruments

TLK2541PFPG4 by Texas Instruments is a telecom IC with 80 terminals, operating at -40 to 85°C. It has a supply voltage of 2.5V and terminal pitch of 0.5mm. Ideal for telecom circuits, it comes in a square package style with Gull Wing terminals and Nickel Palladium Gold finish.

S-PQFP-G80

e4

12 mm

3

1

80

85 Cel

-40 Cel

PLASTIC/EPOXY

HTFQFP

TQFP80,.55SQ

SQUARE

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

260

2.5

Not Qualified

1.2 mm

Other Telecom ICs

2.5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

MAX2105CWI by Maxim Integrated

MAX2105CWI

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;

R-PDSO-G28

e0

17.9 mm

1

1

28

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

245

Not Qualified

2.65 mm

5 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

7.5 mm

MAX2511EEI by Maxim Integrated

MAX2511EEI

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;

R-PDSO-G28

e0

9.89 mm

1

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

SSOP

SSOP28,.25

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

3/5

Not Qualified

1.73 mm

Other Telecom ICs

.045 mA

3 V

YES

BIPOLAR

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.635 mm

DUAL

3.9 mm

L3845B by STMicroelectronics

L3845B

STMicroelectronics

L3845B by STMicroelectronics is a telecom interface IC designed for robust applications. It operates within a voltage range of 20V and withstands temperatures from -40 °C to 70°C. With an 8-terminal, through-hole design, it ensures reliable performance in various telecom circuits.

R-PDIP-T8

e3

1

8

70 Cel

-40 Cel

PLASTIC/EPOXY

DIP

DIP8,.3

RECTANGULAR

IN-LINE

20

Not Qualified

5.08 mm

Analog Transmission Interfaces

20 V

NO

TELECOM CIRCUIT

OTHER

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

MAX3267CSA by Maxim Integrated

MAX3267CSA

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

R-PDSO-G8

e0

4.9 mm

1

1

8

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

3/5

Not Qualified

1.75 mm

Other Telecom ICs

.05 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

3.9 mm

AD803-20BR by Analog Devices

AD803-20BR

Analog Devices

AD803-20BR by Analog Devices is a CMOS telecom IC with 20 terminals, operating b/w -40 to 85 °C. It has a supply voltage of 5V and low supply current of 0.06 mA. Ideal for telecom circuits, this IC comes in a small outline package suitable for industrial applications.

R-PDSO-G20

e0

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

SOP20,.4

RECTANGULAR

SMALL OUTLINE

5

Not Qualified

ATM/SONET/SDH ICs

.06 mA

5 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

SN75FC1000PJD by Texas Instruments

SN75FC1000PJD

Texas Instruments

SN75FC1000PJD by Texas Instruments is a telecom interface IC with 64 terminals, operating at 3.3V. It features BICMOS technology, GULL WING terminal form, and 0.5mm pitch. Ideal for telecom circuits, it has a temperature range of 0-70°C and low supply current of 0.25mA.

S-PQFP-G64

10 mm

1

64

70 Cel

0 Cel

PLASTIC/EPOXY

HTFQFP

TQFP64,.47SQ

SQUARE

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

NOT SPECIFIED

3.3

Not Qualified

1.2 mm

Other Telecom ICs

.25 mA

3.3 V

YES

BICMOS

TELECOM CIRCUIT

COMMERCIAL

GULL WING

.5 mm

QUAD

NOT SPECIFIED

10 mm

L3845D1013TR by STMicroelectronics

L3845D1013TR

STMicroelectronics

STMicroelectronics L3845D1013TR is a telecom interface IC with 8 terminals in a small outline package. It operates b/w -40 °C to 70°C, suitable for telecom circuits. The package is made of plastic/epoxy, surface mountable, and has a gull wing terminal form.

R-PDSO-G8

e0

4.9 mm

1

8

70 Cel

-40 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

Not Qualified

1.75 mm

YES

TELECOM CIRCUIT

OTHER

TIN LEAD

GULL WING

1.27 mm

DUAL

3.9 mm

CY7B923-SC by Cypress Semiconductor

CY7B923-SC

Cypress Semiconductor

CY7B923-SC by Cypress Semiconductor is a BICMOS technology Telecom IC with 28 terminals, operating at 5V. It has a small outline package style and can withstand temperatures from 0 to 70°C. Ideal for telecom circuits, it features GULL WING terminal form and tin/lead finish.

R-PDSO-G28

e0

17.905 mm

1

1

28

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

SOP28,.4

RECTANGULAR

SMALL OUTLINE

225

5

Not Qualified

2.67 mm

Other Telecom ICs

85 mA

5 V

YES

BICMOS

TELECOM CIRCUIT

COMMERCIAL

Tin/Lead (Sn/Pb)

GULL WING

1.27 mm

DUAL

30

7.5 mm

CY7B923-JC by Cypress Semiconductor

CY7B923-JC

Cypress Semiconductor

CY7B923-JC by Cypress Semiconductor is a 28-terminal BICMOS chip carrier with 5V supply, suitable for telecom circuits. It operates b/w 0-70°C, has a terminal pitch of 1.27mm, and consumes up to 85mA current.

S-PQCC-J28

e0

11.53 mm

3

1

28

70 Cel

0 Cel

PLASTIC/EPOXY

QCCJ

LDCC28,.5SQ

SQUARE

CHIP CARRIER

5

Not Qualified

4.57 mm

Other Telecom ICs

85 mA

5 V

YES

BICMOS

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

J BEND

1.27 mm

QUAD

11.53 mm

MAX3120CSA by Maxim Integrated

MAX3120CSA

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

R-PDSO-G8

e0

4.9 mm

1

1

8

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

Not Qualified

1.75 mm

3.3 V

YES

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

3.9 mm

MAX3120CUA by Maxim Integrated

MAX3120CUA

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;

S-PDSO-G8

e0

3 mm

1

1

8

70 Cel

0 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.1 mm

3.3 V

YES

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.65 mm

DUAL

3 mm

MAX3120ESA by Maxim Integrated

MAX3120ESA

Maxim Integrated

MAX3120ESA by Maxim Integrated is an 8-terminal telecom IC with a supply voltage of 3.3V. It operates b/w -40 to 85°C, in industrial settings. This small outline package has a gull wing terminal form and is ideal for telecom circuit applications.

R-PDSO-G8

e0

4.9 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

Not Qualified

1.75 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

3.9 mm

MAX3120EUA by Maxim Integrated

MAX3120EUA

Maxim Integrated

MAX3120EUA by Maxim Integrated is an 8-terminal IC with a supply voltage of 3.3V, operating b/w -40 to 85°C. It features a small outline package style and gull wing terminal form, suitable for telecom circuit applications requiring surface mount technology.

S-PDSO-G8

e0

3 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.65 mm

DUAL

3 mm

ADL5354ACPZ-R2 by Analog Devices

ADL5354ACPZ-R2

Analog Devices

ADL5354ACPZ-R2 by Analog Devices is a BICMOS telecom IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial applications. With a nominal voltage of 5V, it is designed for telecom circuit interfaces.

S-XQCC-N36

e3

6 mm

1

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

1 mm

5 V

YES

BICMOS

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

6 mm

CC2430F64RTCRG3 by Texas Instruments

CC2430F64RTCRG3

Texas Instruments

The Texas Instruments CC2430F64RTCRG3 is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40°C to 85°C, with a supply voltage of 3V. This CMOS technology IC is ideal for telecom circuit applications due to its compact size and industrial temperature grade suitability.

S-XQCC-N48

e4

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

.9 mm

3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

7 mm

CC2430ZF128RTCG3 by Texas Instruments

CC2430ZF128RTCG3

Texas Instruments

Texas Instruments CC2430ZF128RTCG3 is a telecom IC with CMOS tech. It operates b/w -40 to 85°C, has 48 terminals in a square chip carrier package style. With a nominal voltage of 3V, it's ideal for telecom circuit applications requiring surface mount compatibility and a low profile design.

S-XQCC-N48

e4

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

.9 mm

3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

7 mm

CC2430ZF128RTCRG3 by Texas Instruments

CC2430ZF128RTCRG3

Texas Instruments

Texas Instruments CC2430ZF128RTCRG3 is a 48-terminal IC with CMOS technology. It operates b/w -40 to 85°C, suitable for industrial telecom applications. With a nominal voltage of 3V and terminal pitch of 0.5mm, it's ideal for compact designs requiring low power consumption.

S-XQCC-N48

e4

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

.9 mm

3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

7 mm

MAX2472EUT-T by Maxim Integrated

MAX2472EUT-T

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G6

e0

2.9 mm

1

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

1.45 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.95 mm

DUAL

1.625 mm

MAX2473EUT-T by Maxim Integrated

MAX2473EUT-T

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G6

e0

2.9 mm

1

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

1.45 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.95 mm

DUAL

1.625 mm

CMX992Q3 by Cml Microcircuits

CMX992Q3

Cml Microcircuits

CMX992Q3 by Cml Microcircuits is a 48-terminal telecom IC with 3.3V supply voltage, operating from -40 to 85°C. Its square chip carrier package suits industrial applications, featuring a 0.5mm terminal pitch and no-lead form for compact designs in telecom interfaces.

S-XQCC-N48

7 mm

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

7 mm

LM3290TME/NOPB by Texas Instruments

LM3290TME/NOPB

Texas Instruments

LM3290TME/NOPB by Texas Instruments is a 30-terminal GRID ARRAY IC with TIN SILVER COPPER finish. It operates b/w -30 to 85 °C, with peak reflow temp of 260C for telecom circuits. Its 0.4mm pitch and 0.675mm height make it suitable for compact telecom interface applications.

R-XBGA-B30

e1

1

1

30

85 Cel

-30 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

LM3290TMX/NOPB by Texas Instruments

LM3290TMX/NOPB

Texas Instruments

LM3290TMX/NOPB by Texas Instruments is a telecom IC with 30 terminals in a grid array package. It operates b/w -30°C to 85°C, with peak reflow temperature of 260°C for 30 seconds. With a very thin profile and fine pitch, it's ideal for telecom circuit applications.

R-XBGA-B30

e1

1

1

30

85 Cel

-30 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

LM3291TME/NOPB by Texas Instruments

LM3291TME/NOPB

Texas Instruments

LM3291TME/NOPB by Texas Instruments is a 12-terminal IC with a rectangular package style. It operates b/w -30 to 85°C, with peak reflow temperature of 260°C for 30s. Ideal for telecom circuits due to its thin profile and fine pitch grid array package design.

R-XBGA-B12

e1

1

1

12

85 Cel

-30 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

LM3291TMX/NOPB by Texas Instruments

LM3291TMX/NOPB

Texas Instruments

LM3291TMX/NOPB by Texas Instruments is a telecom interface IC with 12 terminals in a grid array package. It operates b/w -30°C to 85°C, with peak reflow temperature of 260°C for 30s. This very thin profile IC is ideal for telecom circuit applications due to its fine pitch and ball terminal form.

R-XBGA-B12

e1

1

1

12

85 Cel

-30 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

ADN2917ACPZ-RL7 by Analog Devices

ADN2917ACPZ-RL7

Analog Devices

ADN2917ACPZ-RL7 by Analog Devices is a telecom IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use with a supply voltage of 3.3V. The IC has a terminal pitch of 0.5mm and matte tin finish, ideal for telecom interface applications.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

4 mm

ADN2917ACPZ by Analog Devices

ADN2917ACPZ

Analog Devices

ADN2917ACPZ by Analog Devices is a telecom interface IC with 24 terminals in a square chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial use. With a nominal voltage of 3.3V, it is ideal for telecom circuit applications requiring a very thin profile design.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

4 mm

BGS12SL6E6327XTSA1 by Infineon Technologies

BGS12SL6E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 6; Package Code: BCC; Package Shape: RECTANGULAR;

R-XBCC-B6

1.1 mm

1

6

85 Cel

-40 Cel

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

NOT SPECIFIED

.32 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BUTT

.4 mm

BOTTOM

NOT SPECIFIED

.7 mm

MAX3750CEE by Maxim Integrated

MAX3750CEE

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: HSSOP; Package Shape: RECTANGULAR;

R-PDSO-G16

e0

4.9 mm

1

1

16

70 Cel

0 Cel

PLASTIC/EPOXY

HSSOP

SSOP16,.25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

3.3

Not Qualified

1.75 mm

Other Telecom ICs

.084 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.635 mm

DUAL

3.9 mm

MAX3751CEE by Maxim Integrated

MAX3751CEE

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: HSSOP; Package Shape: RECTANGULAR;

R-PDSO-G16

e0

4.89 mm

1

1

16

70 Cel

0 Cel

PLASTIC/EPOXY

HSSOP

SSOP16,.25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

3.3

Not Qualified

1.75 mm

Other Telecom ICs

.078 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.635 mm

DUAL

3.9 mm

P5DF081HN/T1AD2060 by NXP Semiconductors

P5DF081HN/T1AD2060

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HQCCN; Package Shape: SQUARE;

S-PQCC-N32

e4

1

32

85 Cel

-25 Cel

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

3 V

YES

TELECOM CIRCUIT

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

QUAD

BQ51010BYFPT by Texas Instruments

BQ51010BYFPT

Texas Instruments

BQ51010BYFPT by Texas Instruments is a RECTANGULAR GRID ARRAY IC with 28 terminals, operating from -40 to 85 °C. It features TIN SILVER COPPER finish, 0.5 mm seated height, and 0.4 mm terminal pitch. Ideal for TELECOM CIRCUITS in INDUSTRIAL settings due to its fine pitch and thin profile package style.

R-XBGA-B28

e1

3 mm

1

1

28

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.5 mm

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

1.88 mm

AD8015AR-REEL7 by Analog Devices

AD8015AR-REEL7

Analog Devices

AD8015AR-REEL7 by Analog Devices is a telecom IC with 8 terminals, operating b/w -40 to 85°C. It has a supply current of 26mA at 5V, suitable for industrial applications requiring small outline packages and gull wing terminal form.

R-PDSO-G8

e0

4.9 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

240

Not Qualified

1.75 mm

26 mA

5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

3.9 mm

AD9816JSRL by Analog Devices

AD9816JSRL

Analog Devices

AD9816JSRL by Analog Devices is a 44-terminal IC with CMOS technology, operating at 0-70°C. It features a 5V supply voltage, GULL WING terminals, and is ideal for TELECOM CIRCUIT applications. The package is SQUARE in shape, made of PLASTIC/EPOXY material, and has a FLATPACK style with 0.8mm terminal pitch.

S-PQFP-G44

e0

10 mm

1

44

70 Cel

0 Cel

PLASTIC/EPOXY

QFP

SQUARE

FLATPACK

Not Qualified

2.45 mm

5 V

YES

CMOS

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.8 mm

QUAD

10 mm

AD9832BRU-REEL7 by Analog Devices

AD9832BRU-REEL7

Analog Devices

AD9832BRU-REEL7 by Analog Devices is a Telecom IC with 16 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.3V and consumes up to 5mA current. This CMOS technology-based IC is ideal for telecom circuits due to its small outline package and dual terminal position.

R-PDSO-G16

e0

5 mm

1

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

240

Not Qualified

1.1 mm

5 mA

3.3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.65 mm

DUAL

4.4 mm

MAX3265CUB by Maxim Integrated

MAX3265CUB

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: HTSSOP; Package Shape: SQUARE;

S-PDSO-G10

e0

3 mm

1

1

10

70 Cel

0 Cel

PLASTIC/EPOXY

HTSSOP

TSSOP10,.19,20

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

240

3.3/5

Not Qualified

1.1 mm

ATM/SONET/SDH ICs

.076 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.5 mm

DUAL

20

3 mm

MAX3265CUE by Maxim Integrated

MAX3265CUE

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: HTSSOP; Package Shape: RECTANGULAR;

R-PDSO-G16

e0

5 mm

1

1

16

70 Cel

0 Cel

PLASTIC/EPOXY

HTSSOP

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

3.3/5

Not Qualified

1.1 mm

ATM/SONET/SDH ICs

.076 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.65 mm

DUAL

4.4 mm

MAX3268CUB by Maxim Integrated

MAX3268CUB

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: HTSSOP; Package Shape: SQUARE;

S-PDSO-G10

e0

3 mm

1

1

10

70 Cel

0 Cel

PLASTIC/EPOXY

HTSSOP

TSSOP10,.19,20

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

240

3.3/5

Not Qualified

1.1 mm

ATM/SONET/SDH ICs

.062 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.5 mm

DUAL

20

3 mm

MAX3269CUB by Maxim Integrated

MAX3269CUB

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: HTSSOP; Package Shape: SQUARE;

S-PDSO-G10

e0

3 mm

1

1

10

70 Cel

0 Cel

PLASTIC/EPOXY

HTSSOP

TSSOP10,.19,20

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

240

3.3/5

Not Qualified

1.1 mm

ATM/SONET/SDH ICs

.078 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

Tin/Lead (Sn85Pb15)

GULL WING

.5 mm

DUAL

20

3 mm

ABBTM-NVC-MDCS42A by Abracon

ABBTM-NVC-MDCS42A

Abracon

ABBTM-NVC-MDCS42A by Abracon is a 32-terminal telecom IC with 3.3V supply voltage, suitable for industrial use at temperatures ranging from -40 to 85°C. It features a rectangular package style, surface mount capability, and no-lead terminal form, making it ideal for telecom circuit applications.

R-XXMA-N32

25.8 mm

3

1

32

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.2 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.2 mm

UNSPECIFIED

13.4 mm

AD974AN by Analog Devices

AD974AN

Analog Devices

Analog Devices' AD974AN is a BICMOS technology telecom IC with 28 terminals in an IN-LINE package. It operates b/w -40 to 85°C, ideal for industrial applications. With a nominal voltage of 5V, it's commonly used in telecom circuits for various functions.

R-PDIP-T28

e0

36.687 mm

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

Not Qualified

5.33 mm

5 V

NO

BICMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm