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ADL5354ACPZ-R2

Analog Devices

ADL5354ACPZ-R2 by Analog Devices

ADL5354ACPZ-R2 by Analog Devices is a BICMOS telecom IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial applications. With a nominal voltage of 5V, it is designed for telecom circuit interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,375 parts In-Stock

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6,375

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Digiode

USA . 815 parts In-Stock

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815

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Distributors (Availability)

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Native Components

USA . 412 parts In-Stock

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$11.150

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412

$11.150

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Northwest PG Solutions

USA . 1,645 parts In-Stock

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$12.265

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$11.038

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$12.265

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Parana Technologies

USA . 4,141 parts In-Stock

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$13.798

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$12.833

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4,141

$13.798

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$12.833

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IDEA Electronic Components Group

UK . 1,773 parts In-Stock

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$14.837

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$14.095

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$14.095

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1,773

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$14.095

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AZTECH Wire

Italy . 514 parts In-Stock

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$17.345

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514

$17.345

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DigiPath Technology Company

USA . 4,141 parts In-Stock

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$23.146

100+ parts

$22.220

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$22.220

4,141

$23.146

$22.220

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$22.220

Component Stockers USA

USA . 242 parts In-Stock

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$99.990

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242

$99.990

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Semicontronic

India . 496 parts In-Stock

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$725.000

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$706.875

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$703.250

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496

$725.000

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$703.250

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One Stop Electronics

USA . 253 parts In-Stock

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$732.000

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$732.000

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QUARKTWIN TECHNOLOGY LTD

USA . 27,158 parts In-Stock

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Corphita

USA . 148 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the Analog Devices ADL5354ACPZ-R2. Crafted by a renowned manufacturer, this telecom interface IC offers unparalleled quality and reliability. Perfect for a wide range of applications, this product provides customers with exceptional value and benefits. Experience seamless integration, superior performance, and innovative features that set this product apart from the rest. Upgrade your telecommunications system today with the ADL5354ACPZ-R2 and discover the difference it can make for your business.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy assembly and integration into circuit boards, saving time and effort during manufacturing.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of these package styles ensures efficient heat dissipation and a compact design, making it suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments where heat may be a concern.

Nominal Supply Voltage: 5 V

Operates at a standard supply voltage, allowing for compatibility with common power sources and reducing the need for additional components.

Technology: BICMOS

Utilizes a combination of bipolar and CMOS technologies, offering the advantages of high speed and low power consumption, making it an efficient choice for telecom applications.

Technical Specifications

Other Function Telecom Interface ICs ADL5354ACPZ-R2 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

ADL5354ACPZ-R2 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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