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ADL5240ACPZ-R7

Analog Devices

ADL5240ACPZ-R7 by Analog Devices

ADL5240ACPZ-R7 by Analog Devices is a telecom IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 5V, it is designed for telecom circuit applications.

Median Price

$10.554

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Nova Conductors

Japan . 90 parts In-Stock

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$8.670

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Digiode

USA . 601 parts In-Stock

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IBS Electronics

USA . 399 parts In-Stock

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Chip Stock

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Vyrian

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VNN

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Next Level Components, LLC

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Ack Elektronik San.Tic.Ltd.Sti

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AZTECH Wire

Italy . 893 parts In-Stock

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$7.643

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Netroflash

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,854 parts In-Stock

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Parana Technologies

USA . 1,224 parts In-Stock

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$9.331

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$8.678

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Ampacity Inc.

Singapore . 778 parts In-Stock

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$9.440

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Corphita

USA . 701 parts In-Stock

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IDEA Electronic Components Group

UK . 1,921 parts In-Stock

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$10.033

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$9.531

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DigiPath Technology Company

USA . 2,151 parts In-Stock

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$15.651

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Infinite Electronics LLP (Excess)

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

USA . 8,337 parts In-Stock

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RC Electronics

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Kepictronics

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A-Z Elektronik GmbH

Germany . 1,269 parts In-Stock

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Metaverse IC Inc.

Canada . 1,074 parts In-Stock

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Argo Parts USA

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Overview

Experience the cutting-edge technology of the ADL5240ACPZ-R7 by Analog Devices, a leading manufacturer known for superior quality and innovation in the field of Telecom Interface ICs. This versatile product offers a wide range of applications, providing customers with unmatched performance and reliability. With its surface mount design and industrial temperature grade, this telecom circuit delivers exceptional value and benefits to users looking for high-quality solutions. Trust Analog Devices to deliver top-of-the-line products that meet your needs and exceed your expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy integration into electronic assemblies, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape provides a compact design, ideal for applications where space is limited.

No. of Terminals: 32

With 32 terminals, this product offers a high level of connectivity options for telecom interfaces, increasing versatility.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in a variety of environmental conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good conductivity, ensuring a stable connection for reliable telecom interface functionality.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V is a common industry standard, making this product compatible with a wide range of systems.

Technical Specifications

Other Function Telecom Interface ICs ADL5240ACPZ-R7 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5 mm

Trade Compliance

ADL5240ACPZ-R7 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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