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ADL5380ACPZ-R2

Analog Devices

ADL5380ACPZ-R2 by Analog Devices

ADL5380ACPZ-R2 by Analog Devices is a 24-terminal IC with 5V supply, operating from -40 to 85°C. It features bipolar technology, matte tin finish, and quad terminal position. This chip carrier package is ideal for telecom interfaces in industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,619 parts In-Stock

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Digiode

USA . 328 parts In-Stock

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328

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Parana Technologies

USA . 1,390 parts In-Stock

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$8.627

100+ parts

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$8.023

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1,390

$8.627

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$8.023

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IDEA Electronic Components Group

UK . 1,399 parts In-Stock

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$9.276

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$8.812

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$9.276

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$8.812

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DigiPath Technology Company

USA . 532 parts In-Stock

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$14.471

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$13.892

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$13.892

532

$14.471

$13.892

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$13.892

AZTECH Wire

Italy . 855 parts In-Stock

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$19.271

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855

$19.271

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One Stop Electronics

USA . 629 parts In-Stock

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$487.000

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629

$487.000

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Semicontronic

India . 1,083 parts In-Stock

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$643.000

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$626.925

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$623.710

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1,083

$643.000

$626.925

$623.710

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Corphita

USA . 816 parts In-Stock

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Native Components

USA . 757 parts In-Stock

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Northwest PG Solutions

USA . 41 parts In-Stock

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Overview

Unlock the power of seamless connectivity with the ADL5380ACPZ-R2 by Analog Devices. Designed with precision and expertise, this telecom interface IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product delivers unmatched performance and efficiency. Experience the value and benefits of Analog Devices' cutting-edge technology, bringing you innovative solutions that redefine connectivity. Trust in Analog Devices to provide you with the tools you need to succeed in the fast-paced world of telecommunications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the IC, making it suitable for industrial applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly.

Package Shape: SQUARE

Square package shape makes it easier to align and place the IC on the circuit board accurately.

Power Supplies (V): 5

Operating at a standard 5V power supply makes it compatible with a wide range of existing systems and applications.

No. of Terminals: 24

Multiple terminals provide flexibility for connections and interfaces with other components in the telecom system.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers a compact and efficient design for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can perform reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

Operational at temperatures as low as -40°C, ensuring functionality in extreme cold environments.

Terminal Finish: Matte Tin (Sn)

Matte Tin terminal finish provides good electrical conductivity and resistance to environmental factors, maintaining signal integrity.

Terminal Position: QUAD

Quad terminal positioning allows for efficient routing and connection of multiple signals within a compact space.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable performance in harsh industrial environments.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and low power consumption, suitable for telecom interface applications.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and compliant with RoHS regulations.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and systems.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5mm allows for precise connections and high-density mounting on the circuit board.

Technical Specifications

Other Function Telecom Interface ICs ADL5380ACPZ-R2 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e3

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

ADL5380ACPZ-R2 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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