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MAX3268CUB

Maxim Integrated

MAX3268CUB by Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: HTSSOP; Package Shape: SQUARE;

Median Price

$4.980

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,538 parts In-Stock

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-

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$4.980

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$4.450

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$4.190

2,538

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$4.980

$4.450

$4.190

Distributors (In-Stock)

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Digiode

USA . 1,319 parts In-Stock

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$5.272

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Anansix

USA . 2,664 parts In-Stock

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Vyrian

USA . 774 parts In-Stock

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Legend Electronics Inc.

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Sogenti Electronics

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Prism Electronics

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Distributors (Availability)

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Semicontronic

India . 2,139 parts In-Stock

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$4.720

100+ parts

$4.602

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$4.578

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Corphita

USA . 2,239 parts In-Stock

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$4.995

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Vigor

Singapore . 2,538 parts In-Stock

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$5.320

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AZTECH Wire

Italy . 605 parts In-Stock

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$8.480

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MARBEL Systems

Belgium . 219 parts In-Stock

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$14.161

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Texas Native Microelectronics

USA . 3,524 parts In-Stock

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$15.138

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$14.324

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Kenton Components

USA . 2,759 parts In-Stock

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$19.532

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$17.189

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Qasali Group International

UK . 5,662 parts In-Stock

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$43.948

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QUARKTWIN TECHNOLOGY LTD

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Kepictronics

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Metaverse IC Inc.

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Perfect Parts

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Microchip USA

USA . 248 parts In-Stock

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Technical Specifications

Other Function Telecom Interface ICs MAX3268CUB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Maxim Integrated

Specs

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

240

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

ATM/SONET/SDH ICs

Maximum Supply Current:

.062 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

3 mm

Trade Compliance

MAX3268CUB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Maxim Integrated

Maxim Integrated is a leading provider of analog and mixed-signal integrated circuits for a range of industries, including automotive, industrial, communications, consumer, and computing. Founded in 1983 with headquarters in San Jose, California, Maxim has grown to become one of the world’s largest producers of integrated circuits due to its innovative solutions that solve customers’ toughest design challenges. Maxim's broad portfolio includes products such as power management solutions, high-voltage solutions, motor driver solutions, amplifiers and comparators, data converters and interface ICs. For over 35 years, Maxim has continued to push the boundaries of analog integration by providing innovative integrated circuit products that offer the industry’s highest performance and best quality. The company’s commitment to delivering cutting-edge technology enables customers to stay current with changing demands in the market. From automotive check engine lights to fitness trackers worn on the wrist – Maxim enables customers across multiple industries to create groundbreaking products through their advanced IC designs. Maxim Integrated is now officially part of Analog Devices.

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Management team

President & CEO

Tunc Doluca

Senior VP & CFO

Brian C. White

Senior VP, Technology & Manufacturing Group

Vivek Jain

Manufacturer fab locations 3

Fab name Location Fab Initiation Wafer Capacity

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Fabrication

Fab Initiation

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Philippines

Cavite

Wafer Capacity

489,000

-

489,000

-

Fabrication

Fab Initiation

-

USA

Beaverton

Wafer Capacity

312,000

-

312,000

-

Fabrication

Fab Initiation

-

Thailand

Chon Buri

Wafer Capacity

194,000

-

194,000

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