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MAX3266CSA+T

Analog Devices

MAX3266CSA+T by Analog Devices

Analog Devices' MAX3266CSA+T is a small outline, surface-mount telecom IC with 8 terminals. Operating b/w 0-70 °C, it has a nominal voltage of 3.3V and terminal pitch of 1.27mm. Ideal for telecom circuits, this IC is designed for commercial-grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,788 parts In-Stock

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Anansix

USA . 1,833 parts In-Stock

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Digiode

USA . 1,039 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 860 parts In-Stock

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$8.826

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$8.826

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MARBEL Systems

Belgium . 5,386 parts In-Stock

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$12.270

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Texas Native Microelectronics

USA . 833 parts In-Stock

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$14.104

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$13.540

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$13.117

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$12.412

833

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$12.412

Kenton Components

USA . 4,106 parts In-Stock

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$16.925

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$14.894

4,106

$16.925

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$14.894

Qasali Group International

UK . 2,489 parts In-Stock

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$38.081

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$35.415

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$33.511

2,489

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Semicontronic

India . 692 parts In-Stock

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$73.000

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$71.175

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$70.810

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One Stop Electronics

USA . 1,901 parts In-Stock

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$567.000

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Corphita

USA . 3,330 parts In-Stock

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Overview

Elevate your telecom interface systems with the MAX3266CSA+T by Analog Devices. Designed with precision and quality in mind, this small outline package offers exceptional performance and reliability for a wide range of applications. From telecommunications to networking, this versatile IC delivers superior connectivity and efficiency. Trust Analog Devices, a leading manufacturer in the industry, to provide you with cutting-edge solutions that exceed expectations. Upgrade your systems today with the MAX3266CSA+T and experience unparalleled value and benefits like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy material makes this product lightweight and durable, ideal for applications that require portability and reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto circuit boards, saving time and effort during manufacturing.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easily integrated into various electronic devices, providing flexibility in design.

No. of Terminals: 8

Having 8 terminals allows for multiple connections and functionalities, expanding the potential applications of this product.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board, making it suitable for compact devices and applications with limited room for components.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance even in challenging environments with elevated temperatures.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for usage in a wide range of environments, from cold climates to room temperature settings.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good electrical conductivity and corrosion resistance, ensuring stable connections and prolonging the product's lifespan.

Terminal Position: DUAL

Dual terminal position enhances connectivity options and allows for increased versatility in circuit design and configurations.

Maximum Seated Height: 1.75 mm

Low maximum seated height minimizes the overall profile of the product, contributing to a sleek design and space-saving integration.

Width: 3.9 mm

Narrow width enables efficient placement and arrangement on the circuit board, optimizing the use of available space and facilitating neat layouts.

Length: 4.9 mm

Compact length ensures the product can fit into tight spaces or alongside other components without occupying excess room on the board.

Temperature Grade: COMMERCIAL

Commercial temperature grade makes this product suitable for standard operating conditions in typical commercial applications, ensuring compatibility with a wide range of devices.

Terminal Form: GULL WING

Gull wing terminal form offers secure attachment to the circuit board and facilitates easy soldering, simplifying the assembly process.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this product provides reliable and efficient performance in telecommunications applications, meeting industry standards for quality and functionality.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3 V ensures consistent power delivery to the device, supporting its overall performance and functionality.

Terminal Pitch: 1.27 mm

Close terminal pitch of 1.27 mm facilitates compact design and precise connections, allowing for densely packed circuits without sacrificing quality or reliability.

Technical Specifications

Other Function Telecom Interface ICs MAX3266CSA+T attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MAX3266CSA+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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