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MAX3750CEE

Maxim Integrated

MAX3750CEE by Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: HSSOP; Package Shape: RECTANGULAR;

Median Price

$5.910

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,976 parts In-Stock

1+ parts

-

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$5.910

1k+ parts

$5.290

10k+ parts

$4.980

7,976

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$5.910

$5.290

$4.980

Distributors (In-Stock)

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Bristol Electronics

USA . 1,500 parts In-Stock

1+ parts

$4.104

100+ parts

$1.929

1k+ parts

$1.765

10k+ parts

-

1,500

$4.104

$1.929

$1.765

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Digiode

USA . 297 parts In-Stock

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$6.260

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Vyrian

USA . 4,060 parts In-Stock

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Prism Electronics

USA . 1,862 parts In-Stock

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Anansix

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Electronics Depot

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PC Components Company LLC

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Resion

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Semicontronic

India . 7,539 parts In-Stock

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$5.600

100+ parts

$5.460

1k+ parts

$5.432

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Corphita

USA . 2,353 parts In-Stock

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$5.931

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Vigor

Singapore . 7,976 parts In-Stock

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$6.320

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AZTECH Wire

Italy . 272 parts In-Stock

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$8.410

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MARBEL Systems

Belgium . 355 parts In-Stock

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$14.868

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$14.868

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Texas Native Microelectronics

USA . 450 parts In-Stock

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$17.090

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$15.894

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$15.039

450

$17.090

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$15.894

$15.039

Kenton Components

USA . 996 parts In-Stock

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$20.508

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$18.047

996

$20.508

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$18.047

Qasali Group International

UK . 1,433 parts In-Stock

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$46.143

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Perfect Parts

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Glotronic Ltd.

UK . 2,117 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,950 parts In-Stock

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Assy Fe

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Microchip USA

USA . 313 parts In-Stock

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Kepictronics

USA . 60 parts In-Stock

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Technical Specifications

Other Function Telecom Interface ICs MAX3750CEE attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Maxim Integrated

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.084 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MAX3750CEE Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Maxim Integrated

Maxim Integrated is a leading provider of analog and mixed-signal integrated circuits for a range of industries, including automotive, industrial, communications, consumer, and computing. Founded in 1983 with headquarters in San Jose, California, Maxim has grown to become one of the world’s largest producers of integrated circuits due to its innovative solutions that solve customers’ toughest design challenges. Maxim's broad portfolio includes products such as power management solutions, high-voltage solutions, motor driver solutions, amplifiers and comparators, data converters and interface ICs. For over 35 years, Maxim has continued to push the boundaries of analog integration by providing innovative integrated circuit products that offer the industry’s highest performance and best quality. The company’s commitment to delivering cutting-edge technology enables customers to stay current with changing demands in the market. From automotive check engine lights to fitness trackers worn on the wrist – Maxim enables customers across multiple industries to create groundbreaking products through their advanced IC designs. Maxim Integrated is now officially part of Analog Devices.

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Management team

President & CEO

Tunc Doluca

Senior VP & CFO

Brian C. White

Senior VP, Technology & Manufacturing Group

Vivek Jain

Manufacturer fab locations 3

Fab name Location Fab Initiation Wafer Capacity

-

Fabrication

Fab Initiation

-

Philippines

Cavite

Wafer Capacity

489,000

-

489,000

-

Fabrication

Fab Initiation

-

USA

Beaverton

Wafer Capacity

312,000

-

312,000

-

Fabrication

Fab Initiation

-

Thailand

Chon Buri

Wafer Capacity

194,000

-

194,000

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