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TELECOM CIRCUIT Other Function Telecom Interface ICs 1,221

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Applications Battery Feed Battery Supply (V) Carrier Type-1 Carrier Type-2 Carrier Type-3 Companding Law Data Rate Filter Maximum Gain Tolerance Hybrid ISDN Access Rate Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Minimum Output High Voltage Maximum Output Low Current Maximum Output Low Voltage Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Reference Point Resolution (um) Screening Level Maximum Seated Height Standard Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
CC1121RHBT by Texas Instruments

CC1121RHBT

Texas Instruments

CC1121RHBT by Texas Instruments is a telecom IC with 32 terminals in a square chip carrier package. Operating at -40 to 85°C, it has a supply voltage of 3V and data rate of 0.2 Mbps. Ideal for telecom circuits, this IC is surface mountable and suitable for industrial applications.

.2 Mbps

S-PQCC-N32

e4

5 mm

3

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

1 mm

Other Telecom ICs

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD SILVER

NO LEAD

.5 mm

QUAD

30

5 mm

BQ51013BYFPT by Texas Instruments

BQ51013BYFPT

Texas Instruments

BQ51013BYFPT by Texas Instruments is a RECTANGULAR GRID ARRAY IC with 28 terminals, suitable for AUTOMOTIVE applications. It operates b/w -40 to 125 °C and has a supply voltage of 5 V. With a data rate of 0.002 Mbps, it is ideal for TELECOM CIRCUITS requiring fine pitch and very thin profile packaging.

.002 Mbps

R-XBGA-B28

e1

3 mm

1

1

28

125 Cel

-40 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.5 mm

5 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.4 mm

BOTTOM

30

1.88 mm

SKY16406-381LF by Skyworks Solutions

SKY16406-381LF

Skyworks Solutions

SKY16406-381LF by Skyworks Solutions is a telecom IC with 6 terminals in a small outline package. Operating temperature ranges from -55°C to 105°C, making it suitable for telecom circuit applications. The package body material is plastic/epoxy, and it has a terminal pitch of 0.5mm.

R-PDSO-N6

2 mm

1

6

105 Cel

-55 Cel

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.8 mm

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.5 mm

DUAL

NOT SPECIFIED

1.5 mm

LMV1099TLX/NOPB by Texas Instruments

LMV1099TLX/NOPB

Texas Instruments

LMV1099TLX/NOPB by Texas Instruments is a telecom interface IC with 25 terminals in a square grid array package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 3.6V, it features very thin profile and fine pitch terminals ideal for telecom circuit applications.

S-XBGA-B25

e1

2.764 mm

1

1

25

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

2.64 mm

DS100BR111ASQ/NOPB by Texas Instruments

DS100BR111ASQ/NOPB

Texas Instruments

DS100BR111ASQ/NOPB by Texas Instruments is a telecom IC with 2 channels, operating at 10300 Mbps data rate. It has a package style of CHIP CARRIER and can withstand industrial temperature range from -40 to 85 °C. Suitable for telecom circuits requiring high-speed data transmission in compact form factor.

10300 Mbps

S-PQCC-N24

e3

4 mm

3

2

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

2.5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

DS100BR111ASQE/NOPB by Texas Instruments

DS100BR111ASQE/NOPB

Texas Instruments

DS100BR111ASQE/NOPB by Texas Instruments is a telecom IC with 2 channels, operating at 10300 Mbps data rate. It has a package style of CHIP CARRIER and operates in industrial temperature range from -40 to 85 °C. Suitable for telecom circuits requiring high-speed data transmission.

10300 Mbps

S-PQCC-N24

e3

4 mm

3

2

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

2.5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADP5586ACBZ-01-R7 by Analog Devices

ADP5586ACBZ-01-R7

Analog Devices

ADP5586ACBZ-01-R7 by Analog Devices is a 16-terminal IC with a package style of grid array, very thin profile, and fine pitch. It operates in industrial temperature range from -40 to 85°C and has a nominal voltage of 1.8V. This telecom circuit IC is designed for telecom interface applications.

S-PBGA-B16

e1

1.59 mm

1

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.545 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

1.59 mm

AD6677BCPZRL7 by Analog Devices

AD6677BCPZRL7

Analog Devices

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N32

e3

5 mm

3

1

32

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8

Not Qualified

.8 mm

Other Telecom ICs

.163 mA

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

5 mm

TCP-3012H-QT by Onsemi

TCP-3012H-QT

Onsemi

TCP-3012H-QT by Onsemi is a small outline, very thin profile telecom IC with 6 terminals. It operates b/w -30 °C to 85°C and has a terminal pitch of 0.5mm. Ideal for telecom circuit applications due to its compact size and surface mount capability.

R-XDSO-N6

1.6 mm

1

6

85 Cel

-30 Cel

UNSPECIFIED

VSON

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

NOT SPECIFIED

1 mm

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.5 mm

DUAL

NOT SPECIFIED

1.2 mm

TCP-3027H-QT by Onsemi

TCP-3027H-QT

Onsemi

TCP-3027H-QT by Onsemi is a surface mount telecom IC with 6 terminals in a chip carrier package. It operates b/w -30 °C to 85°C, with a compact size of 1.2mm width and 1.6mm length. Ideal for telecom circuit applications due to its very thin profile and quad terminal position.

R-XQCC-N6

1.6 mm

1

6

85 Cel

-30 Cel

UNSPECIFIED

VQCCN

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE

NOT SPECIFIED

1 mm

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

1.2 mm

TCP-3082H-QT by Onsemi

TCP-3082H-QT

Onsemi

TCP-3082H-QT by Onsemi is a surface mount telecom IC with 6 terminals in a chip carrier package. It operates b/w -30 °C to 85°C, with a compact size of 1.2mm width and 1.6mm length. Ideal for telecom circuit applications due to its very thin profile and quad terminal position.

R-XQCC-N6

1.6 mm

1

6

85 Cel

-30 Cel

UNSPECIFIED

VQCCN

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE

NOT SPECIFIED

1 mm

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

1.2 mm

SX8651ICSTRT by Semtech

SX8651ICSTRT

Semtech

Semtech's SX8651ICSTRT is a 12-terminal IC with nickel palladium gold finish. It operates b/w -40 to 85°C, ideal for industrial telecom circuits at 1.8V supply voltage. The package style is grid array, very thin profile, fine pitch, suitable for surface mount applications.

R-PBGA-B12

e4

2 mm

1

1

12

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.625 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

BALL

.5 mm

BOTTOM

1.5 mm

SX8651IWLTRT by Semtech

SX8651IWLTRT

Semtech

Semtech's SX8651IWLTRT is a telecom IC with 12 terminals, operating b/w -40 to 85°C. It has a small outline package style and nominal voltage of 1.8V, suitable for telecom circuit applications. The IC is surface mountable, with a terminal pitch of 0.45mm and moisture sensitivity level of 2.

S-PDSO-N12

e3

3 mm

2

1

12

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN

NO LEAD

.45 mm

DUAL

3 mm

RF430CL330HTB by Texas Instruments

RF430CL330HTB

Texas Instruments

Texas Instruments RF430CL330HTB is a CMOS telecom IC with 14 terminals, operating at 0-70°C. It has a supply voltage of 3.3V and is surface mountable in a small outline package. Ideal for telecom circuits, it offers dual terminal position and commercial temperature grade suitability.

R-PDSO-G14

1

14

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

3.3 V

YES

CMOS

TELECOM CIRCUIT

COMMERCIAL

GULL WING

DUAL

TCP-3033H-QT by Onsemi

TCP-3033H-QT

Onsemi

The Onsemi TCP-3033H-QT is a surface mount telecom IC with 6 terminals in a chip carrier package. It operates b/w -30 °C to 85°C, with a compact size of 1.2mm width and 1.6mm length. Ideal for telecom circuit applications due to its very thin profile and quad terminal position.

R-XQCC-N6

1.6 mm

1

6

85 Cel

-30 Cel

UNSPECIFIED

VQCCN

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE

NOT SPECIFIED

1 mm

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

1.2 mm

TCP-3068H-QT by Onsemi

TCP-3068H-QT

Onsemi

The Onsemi TCP-3068H-QT is a surface mount telecom IC with 6 terminals in a chip carrier package. It operates b/w -30 °C to 85°C, with a compact size of 1.2mm width and 1.6mm length. Ideal for telecom circuit applications due to its very thin profile and quad terminal position.

R-XQCC-N6

1.6 mm

1

6

85 Cel

-30 Cel

UNSPECIFIED

VQCCN

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE

NOT SPECIFIED

1 mm

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

1.2 mm

TDA5210XUMA1 by Infineon Technologies

TDA5210XUMA1

Infineon Technologies

TDA5210XUMA1 by Infineon is a telecom IC with 28 terminals, operating from -40 to 105°C. It features a small outline package style, tin terminal finish, and 5V supply voltage. Ideal for telecom circuits, it has a rectangular shape and thin profile suitable for industrial applications.

R-PDSO-G28

e3

9.7 mm

3

1

28

105 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.2 mm

5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN

GULL WING

.65 mm

DUAL

4.4 mm

TDA5102XUMA1 by Infineon Technologies

TDA5102XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G16

5 mm

3

1

16

85 Cel

-25 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.2 mm

3 V

YES

TELECOM CIRCUIT

OTHER

GULL WING

.65 mm

DUAL

4.4 mm

TDA5100XUMA1 by Infineon Technologies

TDA5100XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G16

5 mm

3

1

16

85 Cel

-25 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.2 mm

3 V

YES

TELECOM CIRCUIT

OTHER

GULL WING

.65 mm

DUAL

4.4 mm

TDA5101XUMA1 by Infineon Technologies

TDA5101XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G16

5 mm

3

1

16

85 Cel

-25 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.2 mm

3 V

YES

TELECOM CIRCUIT

OTHER

GULL WING

.65 mm

DUAL

4.4 mm

TDA5103AHTMA1 by Infineon Technologies

TDA5103AHTMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;

S-PDSO-G10

e3

3 mm

1

1

10

85 Cel

-25 Cel

PLASTIC/EPOXY

TSSOP

TSSOP10,.19,20

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3

Not Qualified

1.1 mm

Other Telecom ICs

.0095 mA

3 V

YES

BIPOLAR

TELECOM CIRCUIT

OTHER

TIN

GULL WING

.5 mm

DUAL

3 mm

TDK5111XUMA1 by Infineon Technologies

TDK5111XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G16

5 mm

3

1

16

125 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.1/4

Not Qualified

1.2 mm

Other Telecom ICs

.0195 mA

3 V

YES

BIPOLAR

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

.65 mm

DUAL

4.4 mm

TDA5250XUMA1 by Infineon Technologies

TDA5250XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 38; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G38

9.7 mm

3

1

38

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.2 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.5 mm

DUAL

4.4 mm

TDK5110XUMA1 by Infineon Technologies

TDK5110XUMA1

Infineon Technologies

Infineon's TDK5110XUMA1 is a telecom IC with 16 terminals, operating from -40 to 125°C. It has a small outline package, 0.65mm terminal pitch, and Gull Wing terminals. Ideal for automotive applications requiring a 3V supply voltage in a compact design.

R-PDSO-G16

5 mm

3

1

16

125 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.2 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

.65 mm

DUAL

4.4 mm

TDK5101XUMA1 by Infineon Technologies

TDK5101XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G16

5 mm

3

1

16

125 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.2 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

.65 mm

DUAL

4.4 mm

TDK5110FHTMA1 by Infineon Technologies

TDK5110FHTMA1

Infineon Technologies

Infineon's TDK5110FHTMA1 is a telecom IC with 10 terminals, operating at -40 to 125°C. It has a supply voltage of 3V and consumes 0.021mA current. This small outline IC in plastic package is ideal for automotive telecom applications.

S-PDSO-G10

e3

3 mm

1

1

10

125 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP10,.19,20

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.1/4

Not Qualified

1.1 mm

Other Telecom ICs

.021 mA

3 V

YES

BIPOLAR

TELECOM CIRCUIT

AUTOMOTIVE

MATTE TIN

GULL WING

.5 mm

DUAL

3 mm

TDK5116FHTMA1 by Infineon Technologies

TDK5116FHTMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;

S-PDSO-G10

e3

3 mm

1

1

10

125 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.1 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

MATTE TIN

GULL WING

.5 mm

DUAL

3 mm

TDA5212XUMA1 by Infineon Technologies

TDA5212XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G28

9.7 mm

3

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.2 mm

5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

4.4 mm

TDA7100HTMA1 by Infineon Technologies

TDA7100HTMA1

Infineon Technologies

TDA7100HTMA1 by Infineon Technologies is a telecom interface IC with 10 terminals in a small outline package. Operating temperature range from -20 to 70°C, suitable for telecom circuits with a nominal voltage of 3V. Features matte tin finish, gull wing terminal form, and shrink pitch package style.

S-PDSO-G10

e3

3 mm

1

1

10

70 Cel

-20 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.1 mm

3 V

YES

TELECOM CIRCUIT

OTHER

MATTE TIN

GULL WING

.5 mm

DUAL

3 mm

TDK5111FHTMA1 by Infineon Technologies

TDK5111FHTMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;

S-PDSO-G10

e3

3 mm

1

1

10

125 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.1 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

MATTE TIN

GULL WING

.5 mm

DUAL

3 mm

TDK5100FHTMA1 by Infineon Technologies

TDK5100FHTMA1

Infineon Technologies

Infineon's TDK5100FHTMA1 is a telecom IC with 10 terminals, operating from -40 to 125°C. Its small outline package is surface-mountable and has a matte tin finish. Ideal for automotive applications, this IC operates at 3V and features a square shape with a 3x3mm footprint.

S-PDSO-G10

e3

3 mm

1

1

10

125 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.1 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

MATTE TIN

GULL WING

.5 mm

DUAL

3 mm

TDK5101FHTMA1 by Infineon Technologies

TDK5101FHTMA1

Infineon Technologies

Infineon's TDK5101FHTMA1 is a telecom IC with 10 terminals in a small outline, thin profile package. Operating b/w -40°C to 125°C, it has matte tin finish and dual terminal position suitable for automotive applications. With a nominal voltage of 3V, it is designed for telecom circuits requiring precise temperature control.

S-PDSO-G10

e3

3 mm

1

1

10

125 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.1 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

MATTE TIN

GULL WING

.5 mm

DUAL

3 mm

TDA5220XUMA1 by Infineon Technologies

TDA5220XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G28

9.7 mm

3

1

28

105 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.2 mm

5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

4.4 mm

TDA5150HTMA1 by Infineon Technologies

TDA5150HTMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;

S-PDSO-G10

e3

3 mm

1

1

10

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.05 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN

GULL WING

.5 mm

DUAL

3 mm

TDA7116FHTMA1 by Infineon Technologies

TDA7116FHTMA1

Infineon Technologies

TDA7116FHTMA1 by Infineon is a telecom IC with 10 terminals, operating from -40 to 85°C. It has a small outline package style, matte tin finish, and dual terminal position. This IC is suitable for telecom circuits requiring a nominal voltage of 3V in industrial temperature environments.

S-PDSO-G10

e3

3 mm

1

1

10

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.1 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

GULL WING

.5 mm

DUAL

3 mm

TDA5200XUMA1 by Infineon Technologies

TDA5200XUMA1

Infineon Technologies

TDA5200XUMA1 by Infineon is a telecom IC with 28 terminals, operating from -40 to 85°C. It has a small outline package style, Gull Wing terminal form, and 5V supply voltage. Ideal for telecom circuits, it is surface mountable and has a moisture sensitivity level of 3.

R-PDSO-G28

e3

9.7 mm

3

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.2 mm

5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN

GULL WING

.65 mm

DUAL

4.4 mm

TDA5201XUMA1 by Infineon Technologies

TDA5201XUMA1

Infineon Technologies

TDA5201XUMA1 by Infineon is a telecom IC with 28 terminals, operating from -40 to 85°C. It has a small outline package style, Gull Wing terminals, and 5V supply voltage. Ideal for telecom circuits in industrial applications due to its compact size and high temperature range.

R-PDSO-G28

e3

9.7 mm

3

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.2 mm

5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN

GULL WING

.65 mm

DUAL

4.4 mm

TDK5100XUMA1 by Infineon Technologies

TDK5100XUMA1

Infineon Technologies

Infineon's TDK5100XUMA1 is a telecom IC with 16 terminals, operating at -40 to 125°C. It has a supply voltage of 3V and low current draw of 0.0095mA. This small outline package is ideal for automotive applications due to its bipolar technology and moisture sensitivity level of 3.

R-PDSO-G16

5 mm

3

1

16

125 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.1/4

Not Qualified

1.2 mm

Other Telecom ICs

.0095 mA

3 V

YES

BIPOLAR

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

.65 mm

DUAL

4.4 mm

MLX90109CDC-AAA-000-RE by Melexis N V

MLX90109CDC-AAA-000-RE

Melexis N V

MLX90109CDC-AAA-000-RE by Melexis N V is a telecom IC with 8 terminals, operating at -40 to 70°C. It has a small outline package style, matte tin finish, and gull wing terminal form. Ideal for telecom circuits, it requires a nominal 5V supply voltage and features a rectangular shape measuring 4.9mm x 3.9mm.

R-PDSO-G8

e3

4.9 mm

1

1

8

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

260

1.72 mm

5 V

YES

TELECOM CIRCUIT

COMMERCIAL

MATTE TIN

GULL WING

1.27 mm

DUAL

3.9 mm

MLX90109EDC-AAA-000-TU by Melexis N V

MLX90109EDC-AAA-000-TU

Melexis N V

MLX90109EDC-AAA-000-TU by Melexis N V is an 8-terminal telecom IC with a supply voltage of 5V. It operates in industrial temperature range (-40 to 85°C) and has a small outline package style. Ideal for telecom circuits, it features matte tin terminal finish and gull wing terminal form.

R-PDSO-G8

e3

4.9 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

260

1.72 mm

5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

GULL WING

1.27 mm

DUAL

3.9 mm

ENW89829A2KF by Panasonic

ENW89829A2KF

Panasonic

The Panasonic ENW89829A2KF is a telecom interface IC with 24 terminals, operating b/w -40°C to 85°C. It has a data rate of 2.178 Mbps and operates at a nominal voltage of 3.3V. This surface-mount IC is ideal for industrial applications requiring high-speed telecom circuit functionality in compact microelectronic assemblies.

2.178 Mbps

R-XXMA-N24

9.5 mm

1

24

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

250

2 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UNSPECIFIED

50

9 mm

CC2564NSRVMR by Texas Instruments

CC2564NSRVMR

Texas Instruments

CC2564NSRVMR by Texas Instruments is a telecom IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3.6V. Ideal for telecom circuits, it features matte tin terminal finish and very thin profile design.

S-PQCC-N40

e3

8 mm

3

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.6 mm

QUAD

30

8 mm

CC2564NSYFVR by Texas Instruments

CC2564NSYFVR

Texas Instruments

The Texas Instruments CC2564NSYFVR is a telecom IC with 54 terminals in a grid array package. It operates b/w -40°C to 85°C, with peak reflow temperature of 260°C. Suitable for industrial applications, it has a nominal voltage of 3.6V and features tin silver copper terminal finish.

R-PBGA-B54

e1

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

260

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

CC2564NYFVR by Texas Instruments

CC2564NYFVR

Texas Instruments

Texas Instruments CC2564NYFVR is a 54-terminal IC with industrial temperature grade. It operates at -40 to 85°C, with a peak reflow temp of 260°C. Ideal for telecom circuits, it has a nominal voltage of 3.6V and features surface mount packaging in plastic/epoxy material.

R-PBGA-B54

e1

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

260

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

CC2564YFVR by Texas Instruments

CC2564YFVR

Texas Instruments

Texas Instruments CC2564YFVR is a telecom IC with 54 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.6V and peak reflow temperature of 260°C. Ideal for industrial applications requiring reliable telecom circuit interfaces in a surface-mount grid array package.

R-PBGA-B54

e1

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

260

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

CC2564YFVT by Texas Instruments

CC2564YFVT

Texas Instruments

The Texas Instruments CC2564YFVT is a telecom IC with 54 terminals, operating from -40 to 85°C. It has a supply voltage of 3.6V and peak reflow temperature of 260°C. This rectangular grid array package is ideal for industrial telecom applications.

R-PBGA-B54

e1

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

260

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PGA5807RGCR by Texas Instruments

PGA5807RGCR

Texas Instruments

PGA5807RGCR by Texas Instruments is a 64-terminal telecom IC with a 3.3V supply voltage, operating from -40 to 85°C. It features a nickel palladium gold finish, no-lead terminal form, and quad position for industrial applications requiring very thin profile chip carriers in surface-mount packages.

S-PQCC-N64

e4

9 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

9 mm

PGA5807RGCT by Texas Instruments

PGA5807RGCT

Texas Instruments

PGA5807RGCT by Texas Instruments is a 64-terminal telecom IC with a 3.3V supply voltage, operating b/w -40 to 85°C. It features a square chip carrier package style, nickel palladium gold terminal finish, and no-lead terminal form. Ideal for industrial applications requiring very thin profile packages in surface mount configurations.

S-PQCC-N64

e4

9 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

9 mm