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CC2564NSRVMR

Texas Instruments

CC2564NSRVMR by Texas Instruments

CC2564NSRVMR by Texas Instruments is a telecom IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3.6V. Ideal for telecom circuits, it features matte tin terminal finish and very thin profile design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,712 parts In-Stock

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Digiode

USA . 1,497 parts In-Stock

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1,497

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Distributors (Availability)

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Parana Technologies

USA . 1,459 parts In-Stock

1+ parts

$7.060

100+ parts

-

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$7.597

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1,459

$7.060

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$7.597

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ChromeModa Solutions

Germany . 6,706 parts In-Stock

1+ parts

$7.933

100+ parts

$6.505

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6,706

$7.933

$6.505

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IDEA Electronic Components Group

UK . 1,193 parts In-Stock

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$7.933

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$7.140

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$7.933

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$7.140

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AZTECH Wire

Italy . 290 parts In-Stock

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$11.552

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290

$11.552

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$18.609

100+ parts

$16.934

1k+ parts

$15.259

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2,000

$18.609

$16.934

$15.259

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One Stop Electronics

USA . 392 parts In-Stock

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$1,000.000

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392

$1,000.000

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Kepictronics

USA . 2,000 parts In-Stock

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DigiPath Technology Company

USA . 1,173 parts In-Stock

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$7.152

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$7.152

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Northwest PG Solutions

USA . 975 parts In-Stock

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975

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Corphita

USA . 721 parts In-Stock

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Native Components

USA . 539 parts In-Stock

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539

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Overview

Unlock endless possibilities with the Texas Instruments CC2564NSRVMR. Known for its high-quality manufacturing and innovative solutions, Texas Instruments sets the standard in the telecom interface IC category. This versatile chip carrier offers a myriad of applications and features a very thin profile, making it ideal for compact designs. With a wide operating temperature range and a nominal supply voltage of 3.6V, this industrial-grade product ensures reliability and performance. Elevate your projects with the CC2564NSRVMR and experience seamless connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the telecom interface ICs.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Maximum Operating Temperature: 85 °C

Can operate effectively even in high temperature environments.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures without affecting performance.

Nominal Supply Voltage: 3.6 V

Efficiently operates at a nominal voltage of 3.6V.

Technical Specifications

Other Function Telecom Interface ICs CC2564NSRVMR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.6 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

CC2564NSRVMR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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