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DS100BR111ASQ/NOPB

Texas Instruments

DS100BR111ASQ/NOPB by Texas Instruments

DS100BR111ASQ/NOPB by Texas Instruments is a telecom IC with 2 channels, operating at 10300 Mbps data rate. It has a package style of CHIP CARRIER and can withstand industrial temperature range from -40 to 85 °C. Suitable for telecom circuits requiring high-speed data transmission in compact form factor.

Median Price

$7.837

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,318 parts In-Stock

1+ parts

$7.837

100+ parts

$6.389

1k+ parts

$4.259

10k+ parts

-

8,318

$7.837

$6.389

$4.259

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,164 parts In-Stock

1+ parts

$7.445

100+ parts

-

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-

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2,164

$7.445

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Vyrian

USA . 6,328 parts In-Stock

1+ parts

-

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-

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6,328

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 8,185 parts In-Stock

1+ parts

$6.660

100+ parts

$6.494

1k+ parts

$6.460

10k+ parts

-

8,185

$6.660

$6.494

$6.460

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Corphita

USA . 2,566 parts In-Stock

1+ parts

$7.053

100+ parts

-

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-

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2,566

$7.053

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Corohmni

South Africa . 70 parts In-Stock

1+ parts

$7.837

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70

$7.837

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Parana Technologies

USA . 865 parts In-Stock

1+ parts

$8.476

100+ parts

-

1k+ parts

$9.126

10k+ parts

-

865

$8.476

-

$9.126

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AZTECH Wire

Italy . 1,152 parts In-Stock

1+ parts

$9.180

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-

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1,152

$9.180

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DigiPath Technology Company

USA . 1,433 parts In-Stock

1+ parts

$9.334

100+ parts

$8.587

1k+ parts

-

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-

1,433

$9.334

$8.587

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ChromeModa Solutions

Germany . 5,112 parts In-Stock

1+ parts

$9.524

100+ parts

$7.810

1k+ parts

-

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5,112

$9.524

$7.810

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IDEA Electronic Components Group

UK . 322 parts In-Stock

1+ parts

$9.524

100+ parts

$9.048

1k+ parts

$8.572

10k+ parts

-

322

$9.524

$9.048

$8.572

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Native Components

USA . 262 parts In-Stock

1+ parts

$12.683

100+ parts

-

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262

$12.683

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Northwest PG Solutions

USA . 515 parts In-Stock

1+ parts

$13.951

100+ parts

$12.556

1k+ parts

-

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515

$13.951

$12.556

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Ampacity Inc.

Singapore . 7,987 parts In-Stock

1+ parts

$14.500

100+ parts

-

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7,987

$14.500

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Overview

Texas Instruments presents the DS100BR111ASQ/NOPB, a cutting-edge telecom interface IC designed to provide seamless communication solutions. With a reputation for excellence in manufacturing, Texas Instruments delivers high-quality products that guarantee optimal performance and reliability. This versatile chip carrier package is ideal for a wide range of applications, offering customers the value of fast data rates and industrial-grade temperature tolerance. Experience the benefits of advanced technology with the DS100BR111ASQ/NOPB, your go-to solution for telecom circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY is a durable and lightweight material, making the product suitable for various telecom applications.

Surface Mount: YES

Surface mount packaging allows for easy assembly onto circuit boards, saving time and effort during manufacturing.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions without compromising performance.

Terminal Finish: MATTE TIN

MATTE TIN finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.

Data Rate: 10300 Mbps

High data rate of 10300 Mbps enables fast and efficient transmission of telecom signals, making the product suitable for high-speed communication networks.

Technical Specifications

Other Function Telecom Interface ICs DS100BR111ASQ/NOPB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

10300 Mbps

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

DS100BR111ASQ/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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