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DS100BR111SQ/NOPB

Texas Instruments

DS100BR111SQ/NOPB by Texas Instruments

DS100BR111SQ/NOPB by Texas Instruments is a 24-terminal telecom IC with 2 channels, operating at 10300 Mbps data rate. It features a square package style, -40 to 85 °C temperature range, and matte tin terminal finish. Ideal for industrial applications requiring high-speed communication in compact spaces.

Median Price

$8.906

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 32,604 parts In-Stock

1+ parts

$8.906

100+ parts

$7.260

1k+ parts

$4.840

10k+ parts

-

32,604

$8.906

$7.260

$4.840

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Mouser Electronics

USA . 708 parts In-Stock

1+ parts

$13.060

100+ parts

-

1k+ parts

$7.580

10k+ parts

-

708

$13.060

-

$7.580

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Avnet

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$7.218

10k+ parts

$6.240

1,000

-

-

$7.218

$6.240

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 421 parts In-Stock

1+ parts

$8.461

100+ parts

-

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421

$8.461

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Vyrian

USA . 2,485 parts In-Stock

1+ parts

$8.906

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2,485

$8.906

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Chip Stock

USA . 27,480 parts In-Stock

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27,480

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Lantek

USA . 931 parts In-Stock

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931

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Bristol Electronics

USA . 91 parts In-Stock

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91

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,792 parts In-Stock

1+ parts

$8.015

100+ parts

-

1k+ parts

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4,792

$8.015

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-

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Parana Technologies

USA . 1,152 parts In-Stock

1+ parts

$11.465

100+ parts

-

1k+ parts

$11.880

10k+ parts

-

1,152

$11.465

-

$11.880

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ChromeModa Solutions

Germany . 2,650 parts In-Stock

1+ parts

$12.882

100+ parts

$10.563

1k+ parts

-

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2,650

$12.882

$10.563

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IDEA Electronic Components Group

UK . 1,556 parts In-Stock

1+ parts

$12.882

100+ parts

$12.238

1k+ parts

$11.594

10k+ parts

-

1,556

$12.882

$12.238

$11.594

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Native Components

USA . 64 parts In-Stock

1+ parts

$12.980

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64

$12.980

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Northwest PG Solutions

USA . 579 parts In-Stock

1+ parts

$14.278

100+ parts

$12.850

1k+ parts

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579

$14.278

$12.850

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A-Z Elektronik GmbH

Germany . 5,340 parts In-Stock

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5,340

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Alle Elektronik GmbH

Germany . 3,560 parts In-Stock

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3,560

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DigiPath Technology Company

USA . 1,634 parts In-Stock

1+ parts

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100+ parts

$11.614

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1,634

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$11.614

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GreenTree Electronics

Israel . 931 parts In-Stock

1+ parts

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931

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Kepictronics

USA . 292 parts In-Stock

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292

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Lixinc

USA . 285 parts In-Stock

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285

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Overview

Unlock the potential of your telecom applications with the DS100BR111SQ/NOPB by Texas Instruments. Known for their high-quality products, Texas Instruments delivers cutting-edge solutions that meet and exceed industry standards. This telecom interface IC offers unmatched reliability and performance, making it ideal for a wide range of applications. Experience seamless data transmission at impressive speeds with the DS100BR111SQ/NOPB, providing value and benefits that will elevate your projects to the next level. Choose Texas Instruments for superior quality and innovation in every product.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient assembly onto surface mount technology (SMT) PCBs, saving space and reducing manufacturing costs.

Package Shape: SQUARE

Square shape provides good symmetry and uniformity in layout, aiding in easy placement on PCBs and efficient use of space.

No. of Terminals: 24

Sufficient number of terminals for connecting various components and interfaces, enhancing functionality and connectivity.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in a wide range of environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can withstand cold temperatures without any performance issues.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and electrical conductivity, ensuring secure connections and reliable performance.

Terminal Position: QUAD

Quad terminal position enables easy and efficient placement on the PCB, facilitating faster assembly and production processes.

Maximum Seated Height: 0.8 mm

Low maximum seated height allows for a compact design, ideal for applications where space is limited.

Width: 4 mm

Compact width makes the product suitable for applications where size constraints are a concern, allowing for versatile integration.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and assembly processes, resulting in reliable connections and performance.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent and reliable operation of the product within specified voltage range.

Data Rate: 10300 Mbps

High data rate capability enables fast and efficient data transmission, making it suitable for high-speed telecom applications.

Technical Specifications

Other Function Telecom Interface ICs DS100BR111SQ/NOPB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

10300 Mbps

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

DS100BR111SQ/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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