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DS100BR111ASQ

Texas Instruments

DS100BR111ASQ by Texas Instruments

DS100BR111ASQ by Texas Instruments is a 24-terminal telecom IC with a nominal voltage of 2.5V. It operates in industrial temperature range (-40 to 85 °C) and has a square package style (4x4mm). Ideal for telecom circuits, it features no-lead terminals and quad terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,727 parts In-Stock

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5,727

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Digiode

USA . 331 parts In-Stock

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331

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Distributors (Availability)

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Native Components

USA . 723 parts In-Stock

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$1.762

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723

$1.762

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Northwest PG Solutions

USA . 1,309 parts In-Stock

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$1.938

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1,309

$1.938

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Parana Technologies

USA . 1,568 parts In-Stock

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$11.504

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$11.916

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1,568

$11.504

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$11.916

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AZTECH Wire

Italy . 703 parts In-Stock

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$12.554

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703

$12.554

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DigiPath Technology Company

USA . 56 parts In-Stock

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$12.667

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56

$12.667

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ChromeModa Solutions

Germany . 1,749 parts In-Stock

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$12.926

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$10.599

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1,749

$12.926

$10.599

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IDEA Electronic Components Group

UK . 369 parts In-Stock

1+ parts

$12.926

100+ parts

$12.280

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$11.633

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369

$12.926

$12.280

$11.633

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One Stop Electronics

USA . 1,596 parts In-Stock

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$121.000

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Corphita

USA . 3,376 parts In-Stock

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Overview

Experience seamless and reliable telecom connectivity with the DS100BR111ASQ by Texas Instruments. Renowned for their high-quality products, Texas Instruments delivers a cutting-edge solution in the form of this telecom interface IC. Whether you're looking to enhance data transmission efficiency or improve signal integrity, this product is designed to meet your needs. With its surface mount capability and industrial temperature grade, the DS100BR111ASQ offers unparalleled performance and durability. Elevate your telecommunication projects with this versatile and innovative component, providing unmatched value and benefits to customers seeking top-tier solutions in the telecom industry.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and space in the manufacturing process.

Package Shape: SQUARE

Square package shape helps in efficient use of board space and also provides better mechanical stability compared to irregular shapes.

No. of Terminals: 24

With 24 terminals, this product can support a variety of input and output connections, making it versatile for different telecom interface applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability of the product even under harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the product to function effectively in cold environments without risk of damage.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles indicate efficient heat dissipation, compact design, and enhanced thermal management.

Terminal Position: QUAD

Quad terminal positioning provides a stable and reliable connection, ensuring proper signal transmission in telecom applications.

Width: 4 mm

Compact width of 4mm allows for efficient use of space on the PCB, especially in applications with limited board real estate.

Length: 4 mm

Similarly, the length of 4mm contributes to the overall compact footprint of the product, making it suitable for small form factor designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can withstand a wide range of temperature fluctuations commonly encountered in industrial environments, enhancing its reliability.

Nominal Supply Voltage: 2.5 V

Stable and commonly used nominal supply voltage of 2.5V simplifies integration with existing systems and ensures compatibility with standard power sources.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting on the PCB, enabling more functionality in a limited space and facilitating miniaturization of devices.

Technical Specifications

Other Function Telecom Interface ICs DS100BR111ASQ attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N24

Length:

4 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

DS100BR111ASQ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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