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RF430CL330HTB

Texas Instruments

RF430CL330HTB by Texas Instruments

Texas Instruments RF430CL330HTB is a CMOS telecom IC with 14 terminals, operating at 0-70°C. It has a supply voltage of 3.3V and is surface mountable in a small outline package. Ideal for telecom circuits, it offers dual terminal position and commercial temperature grade suitability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,777 parts In-Stock

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3,777

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Digiode

USA . 734 parts In-Stock

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734

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Ashlea Components Ltd

UK . 7 parts In-Stock

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7

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Distributors (Availability)

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AZTECH Wire

Italy . 324 parts In-Stock

1+ parts

$7.964

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324

$7.964

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Parana Technologies

USA . 1,643 parts In-Stock

1+ parts

$11.635

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$12.030

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1,643

$11.635

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$12.030

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DigiPath Technology Company

USA . 1,361 parts In-Stock

1+ parts

$12.812

100+ parts

$11.787

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1,361

$12.812

$11.787

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ChromeModa Solutions

Germany . 386 parts In-Stock

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$13.073

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$10.720

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386

$13.073

$10.720

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IDEA Electronic Components Group

UK . 93 parts In-Stock

1+ parts

$13.073

100+ parts

$12.419

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$11.766

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93

$13.073

$12.419

$11.766

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One Stop Electronics

USA . 1,046 parts In-Stock

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$946.000

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1,046

$946.000

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Corphita

USA . 1,914 parts In-Stock

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Perfect Parts

USA . 64 parts In-Stock

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Overview

Discover the RF430CL330HTB by Texas Instruments, a top-quality telecom interface IC designed to meet your connectivity needs. Manufactured by industry leader Texas Instruments, this product offers unmatched reliability and performance in a compact package. Ideal for a wide range of applications, this versatile IC provides seamless communication solutions. With its advanced technology and commercial-grade temperature tolerance, the RF430CL330HTB ensures optimal functionality in any environment. Experience the value and benefits of Texas Instruments' cutting-edge technology with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package of this product durable and resistant to environmental factors, ensuring a longer product lifespan.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient integration onto circuit boards, facilitating streamlined production processes.

No. of Terminals: 14

Having 14 terminals provides ample connectivity options, allowing for versatile usage and compatibility with various systems.

Technology: CMOS

The CMOS technology employed in this product ensures low power consumption and high noise immunity, making it efficient and reliable.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is common and widely compatible, making it easy to integrate this product into existing systems without the need for additional power requirements.

Technical Specifications

Other Function Telecom Interface ICs RF430CL330HTB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G14

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

RF430CL330HTB Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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