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RF430CL330HIRGTR

Texas Instruments

RF430CL330HIRGTR by Texas Instruments

RF430CL330HIRGTR by Texas Instruments is a telecom IC with 16 terminals in a square chip carrier package. It operates b/w -40 to 85°C, has a data rate of 0.848 Mbps, and requires a nominal voltage of 3.3V. Ideal for industrial applications requiring high-speed communication in compact spaces.

Median Price

$1.420

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 257,185 parts In-Stock

1+ parts

$0.995

100+ parts

$0.821

1k+ parts

$0.444

10k+ parts

-

257,185

$0.995

$0.821

$0.444

-

Mouser Electronics

USA . 4,593 parts In-Stock

1+ parts

$1.420

100+ parts

$1.060

1k+ parts

$0.787

10k+ parts

$0.698

4,593

$1.420

$1.060

$0.787

$0.698

DigiKey

USA . 3,133 parts In-Stock

1+ parts

$1.420

100+ parts

$1.056

1k+ parts

$0.921

10k+ parts

$0.814

3,133

$1.420

$1.056

$0.921

$0.814

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,676 parts In-Stock

1+ parts

$0.945

100+ parts

-

1k+ parts

-

10k+ parts

-

2,676

$0.945

-

-

-

Vyrian

USA . 2,523 parts In-Stock

1+ parts

$0.995

100+ parts

-

1k+ parts

-

10k+ parts

-

2,523

$0.995

-

-

-

Bristol Electronics

USA . 1,199 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,199

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,362 parts In-Stock

1+ parts

$0.896

100+ parts

-

1k+ parts

-

10k+ parts

-

2,362

$0.896

-

-

-

Parana Technologies

USA . 1,374 parts In-Stock

1+ parts

$8.137

100+ parts

-

1k+ parts

$8.734

10k+ parts

-

1,374

$8.137

-

$8.734

-

DigiPath Technology Company

USA . 2,214 parts In-Stock

1+ parts

$8.960

100+ parts

-

1k+ parts

-

10k+ parts

-

2,214

$8.960

-

-

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ChromeModa Solutions

Germany . 1,838 parts In-Stock

1+ parts

$9.143

100+ parts

$7.497

1k+ parts

-

10k+ parts

-

1,838

$9.143

$7.497

-

-

IDEA Electronic Components Group

UK . 557 parts In-Stock

1+ parts

$9.143

100+ parts

$8.686

1k+ parts

$8.229

10k+ parts

-

557

$9.143

$8.686

$8.229

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Lixinc

USA . 9,548 parts In-Stock

1+ parts

-

100+ parts

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9,548

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A-Z Elektronik GmbH

Germany . 4,656 parts In-Stock

1+ parts

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100+ parts

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4,656

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-

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Kepictronics

USA . 456 parts In-Stock

1+ parts

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100+ parts

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456

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Overview

Unleash the power of seamless connectivity with the RF430CL330HIRGTR by Texas Instruments. Crafted with precision and expertise, this telecom interface IC promises unparalleled quality and reliability. Whether you're in industrial automation, telecommunications, or IoT applications, this versatile chip carrier offers a wide range of benefits. With a nominal supply voltage of 3.3V and a data rate of 0.848 Mbps, this product guarantees efficient performance and superior functionality. Elevate your projects to new heights with the RF430CL330HIRGTR and experience the difference Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving time and costs in production.

Package Shape: SQUARE

The square package shape provides a compact form factor, saving space on the PCB and enabling denser designs.

No. of Terminals: 16

With 16 terminals, this product offers a sufficient number of connection points for versatile connectivity options.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a slim profile and efficient use of space in compact electronic devices.

Width: 3 mm

The narrow width of 3 mm enables the product to be integrated into tight spaces or small electronic assemblies.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds helps prevent overheating and ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering and creates strong, reliable connections on the PCB.

Length: 3 mm

The compact length of 3 mm further contributes to the product's small form factor and ease of integration into electronic designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade designates this product as suitable for use in harsh industrial environments where reliability is critical.

Terminal Form: NO LEAD

The no-lead terminal form complies with environmental regulations and reduces the risk of harmful substances in electronic products.

Telecom IC Type: TELECOM CIRCUIT

Being a telecom circuit IC, this product is specifically designed to meet the communication requirements of telecom applications, ensuring reliable performance.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage provides compatibility with common power sources and allows for easy integration into existing systems.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables high-density packaging on the PCB, making this product suitable for applications with limited board space.

Data Rate: 0.848 Mbps

With a data rate of 0.848 Mbps, this product is capable of handling moderate-speed data transmission, making it suitable for telecom applications.

Moisture Sensitivity Level (MSL): 2

The moisture sensitivity level of 2 indicates that this product can withstand moderate exposure to moisture during storage or handling.

Technical Specifications

Other Function Telecom Interface ICs RF430CL330HIRGTR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

.848 Mbps

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

RF430CL330HIRGTR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8523.59.00.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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