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RF430CL330HTPWRQ1

Texas Instruments

RF430CL330HTPWRQ1 by Texas Instruments

RF430CL330HTPWRQ1 by Texas Instruments is a telecom IC with 14 terminals, operating b/w -40 to 105°C. It has a supply voltage of 3.3V and AEC-Q100 screening for industrial use. The package style is small outline, suitable for surface mount applications in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,008 parts In-Stock

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Digiode

USA . 1,110 parts In-Stock

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1,110

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Distributors (Availability)

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AZTECH Wire

Italy . 378 parts In-Stock

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$8.953

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378

$8.953

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Parana Technologies

USA . 1,526 parts In-Stock

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$10.261

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$10.795

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1,526

$10.261

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$10.795

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ChromeModa Solutions

Germany . 5,439 parts In-Stock

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$11.529

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$9.454

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$11.529

$9.454

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IDEA Electronic Components Group

UK . 2,216 parts In-Stock

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$11.529

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$10.953

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$10.376

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2,216

$11.529

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$10.376

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One Stop Electronics

USA . 804 parts In-Stock

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$477.000

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804

$477.000

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Ampacity Inc.

Singapore . 785 parts In-Stock

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$559.000

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785

$559.000

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Semicontronic

India . 816 parts In-Stock

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$900.000

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$877.500

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$873.000

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816

$900.000

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$873.000

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DigiPath Technology Company

USA . 2,140 parts In-Stock

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$10.395

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$10.395

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Corphita

USA . 1,836 parts In-Stock

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Corohmni

South Africa . 85 parts In-Stock

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Overview

Unlock a world of possibilities with the RF430CL330HTPWRQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability. This versatile Telecom Interface IC is perfect for a wide range of applications, offering seamless connectivity and superior performance. Experience the value and benefits of this cutting-edge product, designed to enhance your projects and exceed your expectations. Trust Texas Instruments to provide innovative solutions that elevate your work to the next level.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact and efficient placement on a PCB, saving valuable space and reducing assembly time.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards suitable for automotive applications, making this product a durable choice.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration and placement within electronic devices, optimizing use of available space.

No. of Terminals: 14

Having 14 terminals provides sufficient connectivity options for various telecom interfaces and circuits, increasing versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style further contributes to saving space on the PCB and allows for streamlined design layouts.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this product can withstand challenging operating conditions, ensuring reliability in diverse environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range enables this product to function effectively even in cold environments, enhancing its versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term performance and stability.

Terminal Position: DUAL

Dual terminal positions provide redundancy and improve signal integrity, making this product a reliable choice for critical telecom applications.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow temperature allows for efficient soldering processes during assembly, saving time and reducing production costs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures secure solder joints and reliable connections, adding to the overall durability of the product.

Temperature Grade: INDUSTRIAL

Being rated as industrial grade means this product can operate in harsh industrial environments with high reliability and performance, making it suitable for demanding applications.

Terminal Form: GULL WING

The gull-wing terminal form offers mechanical stability and ease of soldering, enhancing the overall robustness and reliability of the product.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this product provides optimized functionality and performance in telecom applications, ensuring compatibility and efficiency.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3V, this product is compatible with standard voltage levels in telecom systems, ensuring seamless integration and operation.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates that this product has moderate sensitivity to moisture, making it suitable for a wide range of environments while still requiring standard handling precautions.

Technical Specifications

Other Function Telecom Interface ICs RF430CL330HTPWRQ1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDSO-G14

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

RF430CL330HTPWRQ1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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