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RF430CL330HPW

Texas Instruments

RF430CL330HPW by Texas Instruments

RF430CL330HPW by Texas Instruments is a telecom IC with 14 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.3V and a terminal pitch of 0.65mm. This industrial-grade IC in a small outline package is ideal for telecom circuit applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,928 parts In-Stock

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3,928

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Vyrian

USA . 3,163 parts In-Stock

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3,163

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Parana Technologies

USA . 908 parts In-Stock

1+ parts

$11.639

100+ parts

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$12.033

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908

$11.639

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$12.033

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DigiPath Technology Company

USA . 1,203 parts In-Stock

1+ parts

$12.816

100+ parts

$11.791

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1,203

$12.816

$11.791

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ChromeModa Solutions

Germany . 4,290 parts In-Stock

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$13.078

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$10.724

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4,290

$13.078

$10.724

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IDEA Electronic Components Group

UK . 2,192 parts In-Stock

1+ parts

$13.078

100+ parts

$12.424

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$11.770

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2,192

$13.078

$12.424

$11.770

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AZTECH Wire

Italy . 451 parts In-Stock

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$14.340

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451

$14.340

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One Stop Electronics

USA . 878 parts In-Stock

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$160.000

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878

$160.000

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Semicontronic

India . 1,634 parts In-Stock

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$537.000

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$523.575

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$520.890

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1,634

$537.000

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$520.890

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Ampacity Inc.

Singapore . 676 parts In-Stock

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$941.000

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$941.000

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Corphita

USA . 4,238 parts In-Stock

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Corohmni

South Africa . 158 parts In-Stock

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Overview

Elevate your telecom projects with the RF430CL330HPW by Texas Instruments. Designed with quality and precision, this Telecom Interface IC offers unparalleled performance and reliability. From its small outline to its industrial temperature grade, this product is ideal for a wide range of applications in the telecom industry. With Texas Instruments' reputation for excellence, you can trust that the RF430CL330HPW will deliver exceptional value and benefits to your projects. Experience innovation and efficiency like never before with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good durability and reliability for the product.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly onto circuit boards.

Package Shape: RECTANGULAR

Rectangular shape is common and easy to handle for integration into circuit designs.

No. of Terminals: 14

Having 14 terminals provides flexibility in connecting various components in the circuit.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space on the circuit board and allows for dense packing of components.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the product to function in cold environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves signal integrity.

Maximum Seated Height: 1.2 mm

Low seated height helps in compact circuit board designs and reduces the overall profile of the product.

Width: 4.4 mm

Narrow width makes the product suitable for applications where space is limited.

Length: 5 mm

Compact length allows for efficient integration into circuit designs without taking up too much space.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering during assembly.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimal performance in telecommunications systems.

Nominal Supply Voltage: 3.3 V

Compatible with standard 3.3V power supply systems commonly used in telecom devices.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting on the circuit board and supports miniaturization of the overall product.

Technical Specifications

Other Function Telecom Interface ICs RF430CL330HPW attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G14

Length:

5 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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