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RF430CL331HIRGTR

Texas Instruments

RF430CL331HIRGTR by Texas Instruments

RF430CL331HIRGTR by Texas Instruments is a telecom IC with 16 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, with data rate of 0.848 Mbps. Ideal for telecom circuits requiring 3.3V supply voltage and surface mount installation in industrial applications.

Median Price

$1.420

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 85,164 parts In-Stock

1+ parts

$1.149

100+ parts

$0.949

1k+ parts

$0.513

10k+ parts

-

85,164

$1.149

$0.949

$0.513

-

DigiKey

USA . 2,175 parts In-Stock

1+ parts

$1.420

100+ parts

$1.060

1k+ parts

$0.924

10k+ parts

$0.739

2,175

$1.420

$1.060

$0.924

$0.739

Mouser Electronics

USA . 2,770 parts In-Stock

1+ parts

$1.530

100+ parts

$1.050

1k+ parts

$0.751

10k+ parts

$0.647

2,770

$1.530

$1.050

$0.751

$0.647

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$0.770

100+ parts

-

1k+ parts

-

10k+ parts

-

900

$0.770

-

-

-

Digiode

USA . 4,190 parts In-Stock

1+ parts

$1.092

100+ parts

-

1k+ parts

-

10k+ parts

-

4,190

$1.092

-

-

-

Vyrian

USA . 29,953 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

29,953

-

-

-

-

Bristol Electronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,803 parts In-Stock

1+ parts

$0.770

100+ parts

-

1k+ parts

-

10k+ parts

$0.754

4,803

$0.770

-

-

$0.754

Argo Parts USA

USA . 3,230 parts In-Stock

1+ parts

$0.770

100+ parts

-

1k+ parts

-

10k+ parts

-

3,230

$0.770

-

-

-

Bastille Electronics

Australia . 88 parts In-Stock

1+ parts

$0.770

100+ parts

$0.732

1k+ parts

$0.695

10k+ parts

$0.685

88

$0.770

$0.732

$0.695

$0.685

Corphita

USA . 81 parts In-Stock

1+ parts

$1.034

100+ parts

-

1k+ parts

-

10k+ parts

-

81

$1.034

-

-

-

Ampacity Inc.

Singapore . 29,797 parts In-Stock

1+ parts

$2.130

100+ parts

-

1k+ parts

-

10k+ parts

-

29,797

$2.130

-

-

-

Parana Technologies

USA . 876 parts In-Stock

1+ parts

$8.920

100+ parts

-

1k+ parts

$9.592

10k+ parts

-

876

$8.920

-

$9.592

-

DigiPath Technology Company

USA . 1,883 parts In-Stock

1+ parts

$9.823

100+ parts

$9.037

1k+ parts

-

10k+ parts

-

1,883

$9.823

$9.037

-

-

ChromeModa Solutions

Germany . 2,031 parts In-Stock

1+ parts

$10.023

100+ parts

$8.219

1k+ parts

-

10k+ parts

-

2,031

$10.023

$8.219

-

-

IDEA Electronic Components Group

UK . 1,516 parts In-Stock

1+ parts

$10.023

100+ parts

$9.522

1k+ parts

$9.021

10k+ parts

-

1,516

$10.023

$9.522

$9.021

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

-

-

-

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Lixinc

USA . 4,566 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,566

-

-

-

-

Overview

Unlock a world of seamless connectivity and communication with the RF430CL331HIRGTR by Texas Instruments. Crafted with precision and expertise, this innovative product offers unparalleled reliability and performance in the realm of telecom interface ICs. From its durable plastic/epoxy package body material to its advanced nickel palladium gold terminal finish, every detail of this chip carrier is designed to exceed expectations. With applications ranging from industrial automation to telecommunications, this versatile device is a game-changer in the industry. Experience the value and benefits of high-quality technology with the RF430CL331HIRGTR - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy, this product is lightweight yet durable, making it easy to handle and resistant to damage.

Surface Mount: YES

The surface mount feature allows for easy installation and soldering onto PCBs, saving time and effort during assembly.

No. of Terminals: 16

With 16 terminals, this product can accommodate multiple connections and functions, making it versatile and suitable for various applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions, increasing the product's overall durability.

Nominal Supply Voltage: 3.3 V

The 3.3 V supply voltage provides stable power to the product, ensuring consistent performance and preventing any potential voltage-related issues.

Technical Specifications

Other Function Telecom Interface ICs RF430CL331HIRGTR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

.848 Mbps

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

RF430CL331HIRGTR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8523.59.00.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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