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BQ500212ARGZT

Texas Instruments

BQ500212ARGZT by Texas Instruments

Texas Instruments BQ500212ARGZT is a telecom interface IC with 48 terminals in a square chip carrier package. Operating b/w -40 to 110°C, it has a nominal voltage of 3.3V and terminal pitch of 0.5mm. Ideal for industrial applications requiring no-lead terminal form and MSL level 3 moisture sensitivity.

Median Price

$8.560

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 307 parts In-Stock

1+ parts

$8.560

100+ parts

$5.625

1k+ parts

-

10k+ parts

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307

$8.560

$5.625

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$4.255

100+ parts

-

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10k+ parts

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600

$4.255

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-

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Digiode

USA . 2,710 parts In-Stock

1+ parts

$5.871

100+ parts

-

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2,710

$5.871

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Vyrian

USA . 5,800 parts In-Stock

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5,800

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VNN

France . 5,640 parts In-Stock

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5,640

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Chip Stock

USA . 653 parts In-Stock

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653

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Speed Components Ltd

Israel . 180 parts In-Stock

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180

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Greenchips

USA . 5 parts In-Stock

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5

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SIE Connect GmbH - GreenChips

Germany . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,696 parts In-Stock

1+ parts

$4.255

100+ parts

-

1k+ parts

-

10k+ parts

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4,696

$4.255

-

-

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Continental Prestige Electronics

USA . 2,688 parts In-Stock

1+ parts

$4.255

100+ parts

-

1k+ parts

-

10k+ parts

$4.170

2,688

$4.255

-

-

$4.170

Netroflash

USA . 500 parts In-Stock

1+ parts

$4.255

100+ parts

-

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500

$4.255

-

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Ampacity Inc.

Singapore . 246 parts In-Stock

1+ parts

$5.250

100+ parts

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246

$5.250

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Semicontronic

India . 77 parts In-Stock

1+ parts

$5.250

100+ parts

$5.119

1k+ parts

$5.092

10k+ parts

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77

$5.250

$5.119

$5.092

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Corphita

USA . 4,786 parts In-Stock

1+ parts

$5.562

100+ parts

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4,786

$5.562

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Parana Technologies

USA . 1,235 parts In-Stock

1+ parts

$7.806

100+ parts

-

1k+ parts

$8.356

10k+ parts

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1,235

$7.806

-

$8.356

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DigiPath Technology Company

USA . 646 parts In-Stock

1+ parts

$8.596

100+ parts

$7.908

1k+ parts

-

10k+ parts

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646

$8.596

$7.908

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ChromeModa Solutions

Germany . 5,100 parts In-Stock

1+ parts

$8.771

100+ parts

$7.192

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5,100

$8.771

$7.192

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IDEA Electronic Components Group

UK . 878 parts In-Stock

1+ parts

$8.771

100+ parts

$8.332

1k+ parts

$7.894

10k+ parts

-

878

$8.771

$8.332

$7.894

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Corohmni

South Africa . 113 parts In-Stock

1+ parts

$16.646

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113

$16.646

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AZTECH Wire

Italy . 680 parts In-Stock

1+ parts

$18.470

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680

$18.470

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Microchip USA

USA . 184 parts In-Stock

1+ parts

$29.620

100+ parts

$29.520

1k+ parts

$29.520

10k+ parts

$29.430

184

$29.620

$29.520

$29.520

$29.430

Lixinc

USA . 13,931 parts In-Stock

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13,931

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Authorized Procurement Solutions

USA . 9,000 parts In-Stock

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9,000

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A-Z Elektronik GmbH

Germany . 4,583 parts In-Stock

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4,583

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Alle Elektronik GmbH

Germany . 3,055 parts In-Stock

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3,055

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Kepictronics

USA . 425 parts In-Stock

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425

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Overview

Unleash the power of cutting-edge technology with the BQ500212ARGZT by Texas Instruments. As a leader in the industry, Texas Instruments guarantees top-notch quality and reliability. This telecom interface IC is perfect for a wide range of applications, offering unparalleled performance and precision. With its advanced features and sleek design, this product provides exceptional value and benefits to customers looking for seamless communication solutions. Experience the difference with Texas Instruments and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material that provides good protection for the IC, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and simplifying assembly.

Package Shape: SQUARE

Square shape is compact and space-efficient, ideal for applications where board space is limited.

No. of Terminals: 48

Sufficient number of terminals for connecting the IC to other components in the circuit.

Maximum Operating Temperature: 110 °C

High maximum operating temperature allows for reliable performance in demanding environments.

Nominal Supply Voltage: 3.3 V

Compatible with common supply voltages, making it easy to integrate into existing systems.

Terminal Pitch: 0.5 mm

Small terminal pitch allows for densely packed connections, ideal for high-density PCB layouts.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the IC is not sensitive to moisture, ensuring long-term reliability in various conditions.

Technical Specifications

Other Function Telecom Interface ICs BQ500212ARGZT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

BQ500212ARGZT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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