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BQ500211ARGZT

Texas Instruments

BQ500211ARGZT by Texas Instruments

BQ500211ARGZT by Texas Instruments is a telecom interface IC with 1 function. It has a package style of chip carrier, heat sink/slug, and very thin profile. With a max operating temperature of 110°C and a min operating temperature of -40°C, it is suitable for industrial applications in the telecommunications field.

Median Price

$7.888

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 457 parts In-Stock

1+ parts

$12.610

100+ parts

$8.482

1k+ parts

-

10k+ parts

-

457

$12.610

$8.482

-

-

Rochester

USA . 2,080 parts In-Stock

1+ parts

-

100+ parts

$6.310

1k+ parts

$5.640

10k+ parts

$5.310

2,080

-

$6.310

$5.640

$5.310

Verical

USA . 2,080 parts In-Stock

1+ parts

-

100+ parts

$7.888

1k+ parts

$7.050

10k+ parts

$6.638

2,080

-

$7.888

$7.050

$6.638

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 51 parts In-Stock

1+ parts

$5.274

100+ parts

-

1k+ parts

-

10k+ parts

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51

$5.274

-

-

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Digiode

USA . 3,206 parts In-Stock

1+ parts

$5.766

100+ parts

-

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-

10k+ parts

-

3,206

$5.766

-

-

-

Bristol Electronics

USA . 30 parts In-Stock

1+ parts

$9.120

100+ parts

$4.560

1k+ parts

-

10k+ parts

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30

$9.120

$4.560

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-

DigiKey Marketplace

USA . 2,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,080

-

-

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Prism Electronics

USA . 1,500 parts In-Stock

1+ parts

-

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1,500

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-

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Vyrian

USA . 1,202 parts In-Stock

1+ parts

-

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1,202

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-

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VNN

France . 1,000 parts In-Stock

1+ parts

-

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1,000

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Microfarads

USA . 29 parts In-Stock

1+ parts

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-

1k+ parts

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29

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,236 parts In-Stock

1+ parts

$0.264

100+ parts

-

1k+ parts

-

10k+ parts

-

1,236

$0.264

-

-

-

Corphita

USA . 894 parts In-Stock

1+ parts

$5.463

100+ parts

-

1k+ parts

-

10k+ parts

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894

$5.463

-

-

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Parana Technologies

USA . 1,344 parts In-Stock

1+ parts

$15.709

100+ parts

-

1k+ parts

$16.074

10k+ parts

-

1,344

$15.709

-

$16.074

-

DigiPath Technology Company

USA . 2,301 parts In-Stock

1+ parts

$17.298

100+ parts

$15.914

1k+ parts

-

10k+ parts

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2,301

$17.298

$15.914

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IDEA Electronic Components Group

UK . 1,937 parts In-Stock

1+ parts

$17.651

100+ parts

$16.768

1k+ parts

$15.886

10k+ parts

-

1,937

$17.651

$16.768

$15.886

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ChromeModa Solutions

Germany . 1,557 parts In-Stock

1+ parts

$17.651

100+ parts

$14.474

1k+ parts

-

10k+ parts

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1,557

$17.651

$14.474

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-

Microchip USA

USA . 304 parts In-Stock

1+ parts

$21.000

100+ parts

$20.700

1k+ parts

$20.550

10k+ parts

$20.400

304

$21.000

$20.700

$20.550

$20.400

Lixinc

USA . 18,186 parts In-Stock

1+ parts

-

100+ parts

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18,186

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-

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A-Z Elektronik GmbH

Germany . 4,850 parts In-Stock

1+ parts

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4,850

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-

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Alle Elektronik GmbH

Germany . 3,233 parts In-Stock

1+ parts

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100+ parts

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3,233

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Kepictronics

USA . 1,670 parts In-Stock

1+ parts

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1k+ parts

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1,670

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Perfect Parts

USA . 578 parts In-Stock

1+ parts

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578

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Robosynatics

Brazil . 350 parts In-Stock

1+ parts

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100+ parts

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350

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Lucentia Tech

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$13.061

1k+ parts

$12.094

10k+ parts

$12.094

350

-

$13.061

$12.094

$12.094

Bastille Electronics

Australia . 27 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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27

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-

Overview

Experience the future of telecom interface technology with the BQ500211ARGZT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments has developed this innovative product to provide unparalleled quality and performance. With its compact design and versatile functionality, this telecom IC is perfect for a wide range of applications. Whether you're looking to enhance your telecommunications system or improve connectivity in your devices, the BQ500211ARGZT offers exceptional value, benefits, and advantages. Stay ahead of the curve and unlock new possibilities with this cutting-edge solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and protection for the telecom interface ICs, making it a reliable choice for various applications.

Surface Mount

YES - The surface mount capability allows for easy and efficient installation of the ICs, saving time and effort.

No. of Functions

1 - With a single function, this telecom interface IC has a focused purpose, simplifying its integration into different devices or systems.

Package Shape

SQUARE - The square shape of the package provides efficient use of space, making it suitable for compact designs or when space is limited.

No. of Terminals

48 - The large number of terminals enables multiple connections and functionality, making it versatile for complex telecom requirements.

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - This package style offers efficient heat dissipation, ensuring optimal performance and reliability while maintaining a compact form factor.

Maximum Operating Temperature

110 °C - With a high maximum operating temperature, this telecom interface IC can withstand demanding environmental conditions and thermal loads.

Minimum Operating Temperature

40 °C - The low minimum operating temperature allows the IC to operate reliably in a wide range of temperature conditions, making it suitable for various environments.

Terminal Finish

NICKEL PALLADIUM GOLD - The use of nickel, palladium, and gold terminal finish enhances conductivity, corrosion resistance, and durability, ensuring long-term stability and performance.

Terminal Position

QUAD - The quad terminal position provides multiple connection points, facilitating efficient and secure circuit integration.

Maximum Seated Height

1 mm - With a low maximum seated height, this telecom interface IC can be easily integrated into compact designs or other space-constrained applications.

Width

7 mm - The narrow width of the IC allows flexibility in terms of placement and installation, making it suitable for various form factors and designs.

Maximum Time At Peak Reflow Temperature (s)

30 - This telecom interface IC can sustain high-temperature reflow processes for up to 30 seconds, ensuring proper soldering and compatibility with standard manufacturing processes.

Peak Reflow Temperature °C

260 - The high peak reflow temperature capability ensures reliable solder connections, contributing to the overall durability and performance of the IC.

Length

7 mm - The compact length of the IC facilitates easy integration into space-constrained designs, optimizing layout options and flexibility.

Temperature Grade

INDUSTRIAL - The industrial temperature grade rating ensures reliable operation and performance across a wide range of temperature variations, making it suitable for harsh industrial environments.

Terminal Form

NO LEAD - The no lead terminal form provides compatibility with lead-free soldering processes, meeting environmental regulations and delivering a reliable and eco-friendly solution.

Telecom IC Type

TELECOM CIRCUIT - Designed specifically for telecom applications, this IC type delivers optimized performance and integration within telecommunication systems.

Nominal Supply Voltage

3.3 V - The nominal supply voltage of 3.3 V provides compatibility with standard power systems, making it easier to integrate into existing circuits and systems.

Terminal Pitch

0.5 mm - The small terminal pitch allows for high-density interconnection, increasing the functionality and compactness of the telecom interface IC.

Moisture Sensitivity Level (MSL)

3 - With a moisture sensitivity level of 3, this IC can withstand moderate moisture exposure without compromising its electrical performance, providing reliability and longevity.

Technical Specifications

Other Function Telecom Interface ICs BQ500211ARGZT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

BQ500211ARGZT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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