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BALL Other Function Interface ICs 55

Other Function Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Built-in Protections Maximum Delay Display Mode Driver No. of Bits Interface IC Type Interface Standard JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Backplanes No. of Bits No. of Channels No. of Digits/Characters No. of Functions No. of Segments No. of Terminals Maximum Operating Temperature Minimum Operating Temperature Output Characteristics Maximum Output Current Output Latch/Register Nominal Output Peak Current Limit Output Polarity Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Maximum Receive Delay Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Maximum Supply Voltage-1 Minimum Supply Voltage-1 Nominal Supply Voltage-1 Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
MAX3374EEBL by Maxim Integrated

MAX3374EEBL

Maxim Integrated

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 8; Package Code: FBGA; Package Shape: SQUARE;

INTERFACE CIRCUIT

S-PBGA-B8

e0

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA8,3X3,20

SQUARE

GRID ARRAY, FINE PITCH

1.8/5

Not Qualified

Other Interface ICs

YES

BICMOS

INDUSTRIAL

TIN LEAD

BALL

.5 mm

BOTTOM

MAX3376EEBL by Maxim Integrated

MAX3376EEBL

Maxim Integrated

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 8; Package Code: FBGA; Package Shape: SQUARE;

INTERFACE CIRCUIT

S-PBGA-B8

e0

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA8,3X3,20

SQUARE

GRID ARRAY, FINE PITCH

1.8/5

Not Qualified

Other Interface ICs

YES

BICMOS

INDUSTRIAL

TIN LEAD

BALL

.5 mm

BOTTOM

IP4853CX24/P,135 by NXP Semiconductors

IP4853CX24/P,135

NXP Semiconductors

IP4853CX24/P,135 from NXP Semiconductors is a compact interface IC designed for surface mount applications. It operates at a nominal voltage of 1.8V and features a fine pitch grid array with 24 terminals. This device functions effectively in environments ranging from -30 °C to 85 °C.

S-PBGA-B24

24

85 Cel

-30 Cel

PLASTIC/EPOXY

FBGA

BGA24,5X5,16

SQUARE

GRID ARRAY, FINE PITCH

1.8

Not Qualified

Other Interface ICs

1.8 V

YES

OTHER

BALL

.4 mm

BOTTOM

NTS0104UK-Q100Z by NXP Semiconductors

NTS0104UK-Q100Z

NXP Semiconductors

The NXP Semiconductors NTS0104UK-Q100Z is an AEC-Q100 compliant interface IC with 12 terminals in a grid array package. Operating temperature range from -40 to 125°C, suitable for automotive applications. Features include power supplies of 1.8/3.3V and 2.5/5V, surface mount compatibility, and a rectangular package shape.

INTERFACE CIRCUIT

R-PBGA-B12

12

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA12,3X4,16

RECTANGULAR

GRID ARRAY, FINE PITCH

1.8/3.3,2.5/5

Not Qualified

AEC-Q100

Other Interface ICs

YES

AUTOMOTIVE

BALL

.4 mm

BOTTOM

NTB0104UK-Q100Z by NXP Semiconductors

NTB0104UK-Q100Z

NXP Semiconductors

NTB0104UK-Q100Z by NXP Semiconductors is an automotive-grade interface IC with a 12-terminal grid array design. It operates b/w -40 °C to 125 °C and supports power supplies of 1.2/3.6V and 1.8/5V, ideal for automotive applications requiring reliability. Its AEC-Q100 screening ensures high performance in demanding environments.

INTERFACE CIRCUIT

R-PBGA-B12

12

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA12,3X4,16

RECTANGULAR

GRID ARRAY, FINE PITCH

1.2/3.6,1.8/5

Not Qualified

AEC-Q100

Other Interface ICs

YES

AUTOMOTIVE

BALL

.4 mm

BOTTOM

NLSX0102FCT1G by Onsemi

NLSX0102FCT1G

Onsemi

NLSX0102FCT1G by Onsemi is an Interface IC with 2 functions, operating at -40 to 85 °C. It has a supply voltage range of 1.5V to 5.5V and comes in a compact grid array package style. Ideal for industrial applications requiring precise interface circuitry in a small form factor.

INTERFACE CIRCUIT

R-PBGA-B8

e1

1.9 mm

1

2

8

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.5 mm

5.5 V

1.5 V

3.3 V

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

.9 mm

TX517IZCQ by Texas Instruments

TX517IZCQ

Texas Instruments

TX517IZCQ by Texas Instruments is a 144-terminal interface IC with a square package. It operates b/w -5V to +5V, has a max supply voltage of 5.25V, and can withstand temperatures from 0°C to 85°C. Ideal for applications requiring precise interface circuitry in compact spaces.

INTERFACE CIRCUIT

S-PBGA-B144

13 mm

3

-5 V

1

144

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA144(UNSPEC)

SQUARE

GRID ARRAY

260

+-5,2.5

Not Qualified

Other Interface ICs

5.25 V

2.38 V

2.5 V

5.25 V

4.75 V

5 V

YES

OTHER

BALL

BOTTOM

30

13 mm

LM8335TLE/NOPB by Texas Instruments

LM8335TLE/NOPB

Texas Instruments

LM8335TLE/NOPB by Texas Instruments is a 16-terminal IC with a supply voltage range of 1.65V to 3.6V, operating b/w 0°C to 85°C. It features a grid array package style with very thin profile and fine pitch, suitable for interface circuit applications requiring precise signal processing in compact spaces.

INTERFACE CIRCUIT

S-PBGA-B16

e1

1.96 mm

1

1

16

85 Cel

0 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

3.6 V

1.65 V

1.8 V

YES

OTHER

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

1.96 mm

DRV2604YZFT by Texas Instruments

DRV2604YZFT

Texas Instruments

DRV2604YZFT by Texas Instruments is a square-shaped interface IC with 9 terminals. It operates b/w -40 to 85°C, with a supply voltage range of 2.5V to 5.5V. This industrial-grade IC is ideal for applications requiring precise haptic feedback control in compact electronic devices.

INTERFACE CIRCUIT

S-XBGA-B9

e1

1.44 mm

1

1

9

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.625 mm

5.5 V

2.5 V

3.6 V

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

1.44 mm

HPA02270YZPR by Texas Instruments

HPA02270YZPR

Texas Instruments

The Texas Instruments HPA02270YZPR is an 8-terminal interface IC with a supply voltage range of 1.65V to 3.6V, suitable for industrial applications. Featuring a rectangular package style with very thin profile and fine pitch grid array, it operates b/w -40°C to 85°C. With terminal finish in tin silver copper and ball form, this IC has a compact size of 1.888mm x 0.888mm and peak reflow temperature of 260°C for quick assembly processes.

ALSO REQUIRED VCCB = 2.3V TO 5.5V SUPPLY

INTERFACE CIRCUIT

R-XBGA-B8

e1

1.888 mm

1

1

8

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.5 mm

3.6 V

1.65 V

1.8 V

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

.888 mm

DRV2604LYZFR by Texas Instruments

DRV2604LYZFR

Texas Instruments

Texas Instruments DRV2604LYZFR is a 9-terminal IC with max supply voltage of 5.2V and min of 2V. With a temp range of -40 to 85°C, it's ideal for industrial applications requiring precise interface circuitry in compact square package.

INTERFACE CIRCUIT

S-XBGA-B9

e1

1.44 mm

1

1

9

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.625 mm

5.2 V

2 V

3.6 V

YES

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.5 mm

BOTTOM

30

1.44 mm

DRV2604LYZFT by Texas Instruments

DRV2604LYZFT

Texas Instruments

Texas Instruments DRV2604LYZFT is a 9-terminal IC with 2-5.2V supply voltage range, -40 to 85°C operating temp, and 0.5mm terminal pitch. Ideal for industrial applications requiring interface circuitry in a compact square package with very thin profile and fine pitch grid array design.

INTERFACE CIRCUIT

S-XBGA-B9

e1

1.44 mm

1

1

9

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.625 mm

5.2 V

2 V

3.6 V

YES

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.5 mm

BOTTOM

30

1.44 mm

LC898119XC-MH by Onsemi

LC898119XC-MH

Onsemi

LC898119XC-MH by Onsemi is a CMOS interface IC with 25 terminals in a grid array package. It operates at supply voltages ranging from 2.6V to 3.6V and has a peak reflow temperature of 260 °C. This IC is suitable for applications requiring a very thin profile and fine pitch design, such as consumer electronics and communication devices.

INTERFACE CIRCUIT

S-PBGA-B25

e1

2 mm

1

1

25

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

3.6 V

2.6 V

3 V

3.6 V

2.6 V

YES

CMOS

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

2 mm

IP4855CX25/P,135 by NXP Semiconductors

IP4855CX25/P,135

NXP Semiconductors

NXP Semiconductors' IP4855CX25/P,135 is a 25-terminal interface IC with a supply voltage range of 2.5V to 5.5V. It features a square package style with grid array and fine pitch, suitable for industrial applications with an operating temperature range of -40°C to 85°C. The IC is designed for surface mount assembly and has a very thin profile at just 0.5mm seated height.

INTERFACE CIRCUIT

S-PBGA-B25

2.04 mm

1

25

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA25,5X5,16

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

3/5

Not Qualified

.5 mm

Level Translators

5.5 V

2.5 V

4 V

YES

INDUSTRIAL

BALL

.4 mm

BOTTOM

2.04 mm

NVT4556AUKZ by NXP Semiconductors

NVT4556AUKZ

NXP Semiconductors

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 12; Package Code: VFBGA; Package Shape: RECTANGULAR;

INTERFACE CIRCUIT

R-PBGA-B12

1.605 mm

1

12

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.412 mm

3.6 V

1.55 V

1.8 V

YES

INDUSTRIAL

BALL

.4 mm

BOTTOM

NOT SPECIFIED

1.205 mm

ADG3308BCBZ-1-REEL by Analog Devices

ADG3308BCBZ-1-REEL

Analog Devices

ADG3308BCBZ-1-REEL by Analog Devices is a 20-terminal IC with max supply voltage of 5.5V, suitable for industrial applications. It features a rectangular package shape, very thin profile, and fine pitch style. With operating temperatures ranging from -40 to 85°C, it is ideal for interface circuit applications requiring precise voltage control.

INTERFACE CIRCUIT

R-PBGA-B20

e1

2.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA20,4X5,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1.2/5,1.8/5

Not Qualified

.65 mm

Other Interface ICs

5.5 V

1.15 V

1.8 V

5.5 V

1.65 V

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

2 mm

MAX13005EEBE-T by Maxim Integrated

MAX13005EEBE-T

Maxim Integrated

MAX13005EEBE-T by Maxim Integrated is a 16-terminal IC with 6 functions, operating b/w -40 to 85 °C. It has a supply voltage range of 1.5-3.6 V and uses BICMOS technology. Ideal for industrial applications requiring interface circuitry in compact spaces due to its thin profile and fine pitch package style.

INTERFACE CIRCUIT

S-PBGA-B16

e0

2.02 mm

1

6

16

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA16,4X4,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

245

1.8/3.3

Not Qualified

.67 mm

Other Interface ICs

3.6 V

1.5 V

1.65 V

YES

BICMOS

INDUSTRIAL

TIN LEAD

BALL

.5 mm

BOTTOM

2.02 mm

TXS0104EZXUR by Texas Instruments

TXS0104EZXUR

Texas Instruments

TXS0104EZXUR by Texas Instruments is a 4-bit interface IC with 3-STATE output. It operates b/w -40 to 85°C, with supply voltage ranging from 1.65V to 5.5V. Suitable for industrial applications, it features a grid array package style and very thin profile design.

INTERFACE CIRCUIT

R-PBGA-B12

e1

2.5 mm

1

4

1

12

85 Cel

-40 Cel

3-STATE

PLASTIC/EPOXY

VFBGA

BGA12,3X4,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1.8/3.3,2.5/5

Not Qualified

.61 mm

Other Interface ICs

.01 mA

3.6 V

1.65 V

1.8 V

5.5 V

2.3 V

3.3 V

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

2 mm

ST6G3237TBR by STMicroelectronics

ST6G3237TBR

STMicroelectronics

ST6G3237TBR by STMicroelectronics is a 25-terminal interface IC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.4V to 3.6V. Designed for industrial applications, it features a thin profile grid array package suitable for surface mount assembly.

INTERFACE CIRCUIT

S-PBGA-B25

3 mm

1

25

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

Not Qualified

1.16 mm

3.6 V

1.4 V

1.8 V

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

NOT SPECIFIED

3 mm

ST6G3238ETBR by STMicroelectronics

ST6G3238ETBR

STMicroelectronics

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 25; Package Code: TFBGA; Package Shape: SQUARE;

INTERFACE CIRCUIT

S-XBGA-B25

e1

3 mm

3

1

25

85 Cel

-40 Cel

UNSPECIFIED

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

Not Qualified

1.16 mm

3.6 V

1.4 V

3 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.5 mm

BOTTOM

30

3 mm

MAX3005EBP by Maxim Integrated

MAX3005EBP

Maxim Integrated

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 20; Package Code: VFBGA; Package Shape: RECTANGULAR;

INTERFACE CIRCUIT

R-XBGA-B20

e0

1

8

20

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

BGA20,4X5,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.8/5

Not Qualified

.67 mm

Other Interface ICs

5.5 V

1.2 V

YES

BICMOS

INDUSTRIAL

TIN LEAD

BALL

.5 mm

BOTTOM

ST6G3238BETBR by STMicroelectronics

ST6G3238BETBR

STMicroelectronics

ST6G3238BETBR by STMicroelectronics is a 25-terminal interface IC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.4V to 3.6V. Ideal for industrial applications requiring thin profile and fine pitch grid array package style.

INTERFACE CIRCUIT

S-PBGA-B25

e4

3 mm

3

1

25

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

Not Qualified

1.16 mm

3.6 V

1.4 V

3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD

BALL

.5 mm

BOTTOM

30

3 mm

TXS0108EZXYR by Texas Instruments

TXS0108EZXYR

Texas Instruments

TXS0108EZXYR by Texas Instruments is an 8-bit interface IC with a supply voltage range of 1.2-3.6V, ideal for industrial applications. It features a 3-state output and operates b/w -40 to 85°C, making it suitable for various electronic devices. This IC comes in a compact grid array package with very thin profile and fine pitch terminals for easy surface mounting.

ALSO OPERATES WITH 1.65 TO 5.5 VOLT

INTERFACE CIRCUIT

R-PBGA-B20

e1

3 mm

1

8

1

20

85 Cel

-40 Cel

3-STATE

PLASTIC/EPOXY

VFBGA

BGA20,4X5,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1.2/3.6,1.8/5

Not Qualified

.61 mm

Other Interface ICs

.008 mA

3.6 V

1.2 V

2.5 V

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

2.5 mm

ST6G3237BTBR by STMicroelectronics

ST6G3237BTBR

STMicroelectronics

ST6G3237BTBR from STMicroelectronics is a CMOS interface IC designed for industrial applications. It operates b/w 1.4V and 3.6V, with a max temp of 85 °C and features a compact 25-terminal grid array package. Ideal for space-constrained environments, it ensures reliable performance in harsh conditions.

INTERFACE CIRCUIT

S-PBGA-B25

3 mm

1

25

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

Not Qualified

1.16 mm

3.6 V

1.4 V

1.8 V

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

NOT SPECIFIED

3 mm

ST1G3234BBJR by STMicroelectronics

ST1G3234BBJR

STMicroelectronics

ST1G3234BBJR by STMicroelectronics is a CMOS interface IC designed for industrial applications. It operates b/w 1.4V and 3.6V, with a max temp of 85 °C and features a very thin profile (0.714mm height). Ideal for compact electronic designs requiring reliable performance.

INTERFACE CIRCUIT

R-PBGA-B5

1.36 mm

1

5

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA5,3X3,17/10

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.5/3.3

Not Qualified

.714 mm

Other Interface ICs

3.6 V

1.4 V

3 V

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

1.02 mm

ST6G3240TBR by STMicroelectronics

ST6G3240TBR

STMicroelectronics

ST6G3240TBR from STMicroelectronics is a CMOS interface IC designed for industrial applications. It operates b/w 1.4V and 3.6V, with a max temp of 85 °C and features a compact 36-terminal grid array package. Ideal for space-constrained environments, it ensures reliable performance in demanding conditions.

INTERFACE CIRCUIT

S-PBGA-B36

3.6 mm

1

36

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

Not Qualified

1.16 mm

3.6 V

1.4 V

1.8 V

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

NOT SPECIFIED

3.6 mm

MAX3378EEBC-T by Maxim Integrated

MAX3378EEBC-T

Maxim Integrated

MAX3378EEBC-T by Maxim Integrated is a 4-function interface IC with a supply voltage range of 1.2V to 5.5V, suitable for industrial applications. It features a grid array package style with very thin profile and fine pitch, making it ideal for surface mount assembly. With operating temperatures from -40°C to 85°C, this BICMOS technology IC offers reliable performance in various environments.

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

INTERFACE CIRCUIT

R-PBGA-B12

e0

2.02 mm

1

4

12

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA12,3X4,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.8/5

Not Qualified

.67 mm

Other Interface ICs

5.5 V

1.2 V

3.3 V

5.5 V

1.65 V

3.3 V

YES

BICMOS

INDUSTRIAL

TIN LEAD

BALL

.5 mm

BOTTOM

1.54 mm

MAX13013EBT-T by Maxim Integrated

MAX13013EBT-T

Maxim Integrated

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR;

INTERFACE CIRCUIT

R-PBGA-B6

e0

1.98 mm

1

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA6,2X3,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

245

1.8/3.3

Not Qualified

.67 mm

Other Interface ICs

3.6 V

1.65 V

2.5 V

3.2 V

1.2 V

1.8 V

YES

BICMOS

INDUSTRIAL

TIN LEAD

BALL

.5 mm

BOTTOM

1.75 mm

ADG3304BCBZ-REEL by Analog Devices

ADG3304BCBZ-REEL

Analog Devices

ADG3304BCBZ-REEL by Analog Devices is a CMOS interface IC with 12 terminals, operating b/w -25 to 85 °C. It has a supply voltage range of 1.15V to 5.5V and features a grid array package style for surface mount applications. Ideal for various electronic devices requiring precise signal interfacing at low power consumption levels.

INTERFACE CIRCUIT

R-PBGA-B12

e1

2.01 mm

1

1

12

85 Cel

-25 Cel

PLASTIC/EPOXY

VFBGA

BGA12,3X4,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1.8/5

Not Qualified

.65 mm

Other Interface ICs

5.5 V

1.65 V

1.8 V

5.5 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

1.61 mm

ST1G3234BJR by STMicroelectronics

ST1G3234BJR

STMicroelectronics

ST1G3234BJR by STMicroelectronics is a CMOS interface IC designed for industrial applications, operating b/w -40 °C and 85 °C. It supports a supply voltage range of 1.4V to 3.6V with a very thin profile package (1.36mm x 1.02mm). This surface-mount device features 5 terminals and is ideal for compact electronic designs.

INTERFACE CIRCUIT

R-PBGA-B5

e1

1.36 mm

1

5

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA5,3X3,20/10

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.5/3.3

Not Qualified

.715 mm

Other Interface ICs

3.6 V

1.4 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

1.02 mm

ST4G3234BJR by STMicroelectronics

ST4G3234BJR

STMicroelectronics

ST4G3234BJR by STMicroelectronics is a CMOS interface IC designed for industrial applications. It operates b/w 1.4V and 3.6V, with a max temp of 85 °C and features an ultra-thin profile in a 11-terminal grid array package. Ideal for space-constrained designs.

INTERFACE CIRCUIT

R-PBGA-B11

2.04 mm

1

11

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA11,3X7,17/10

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

1.5/3.3

Not Qualified

.715 mm

Other Interface ICs

3.6 V

1.4 V

1.65 V

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

NOT SPECIFIED

1.41 mm

DS150DF1610FBE/NOPB by Texas Instruments

DS150DF1610FBE/NOPB

Texas Instruments

DS150DF1610FBE/NOPB by Texas Instruments is a 16-channel interface IC with a supply voltage range of 2.375V to 2.625V. It features a grid array package style, operates b/w -10°C to 85°C, and has a terminal pitch of 1mm. Ideal for applications requiring high-speed data transmission in compact electronic devices.

INTERFACE CIRCUIT

S-PBGA-B196

e1

15.05 mm

4

16

1

196

85 Cel

-10 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

2.94 mm

2.625 V

2.375 V

2.5 V

YES

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

15.05 mm

DS250DF210ABMT by Texas Instruments

DS250DF210ABMT

Texas Instruments

DS250DF210ABMT by Texas Instruments is a 2-channel interface IC with a package style of grid array, thin profile, and fine pitch. It operates in industrial temperature range (-40 to 85°C) and features surface mount capability. Ideal for applications requiring high-speed data transmission in compact electronic devices.

INTERFACE CIRCUIT

S-PBGA-B101

e1

6 mm

3

2

1

101

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.03 mm

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

6 mm

LC898123XC-VH by Onsemi

LC898123XC-VH

Onsemi

LC898123XC-VH by Onsemi is a 35-terminal IC with CMOS technology. It operates b/w -30 to 85 °C, with supply voltage range of 2.6V to 3.6V. Suitable for interface circuits, it comes in a very thin profile grid array package shape.

IT ALSO OPERATES AT 3V

INTERFACE CIRCUIT

R-PBGA-B35

e1

3.39 mm

1

1

35

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.45 mm

3.6 V

2.6 V

3 V

3.6 V

2.6 V

2.8 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

2.3 mm

TPS65982ABZQZR by Texas Instruments

TPS65982ABZQZR

Texas Instruments

TPS65982ABZQZR by Texas Instruments is a 96-terminal interface IC with a supply voltage range of 2.85V to 3.45V. Its package style is grid array, very thin profile, fine pitch, making it suitable for applications requiring precise power management in compact spaces at temperatures ranging from -10°C to 85°C.

INTERFACE CIRCUIT

S-PBGA-B96

e1

6 mm

3

1

96

85 Cel

-10 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

3.45 V

2.85 V

3.3 V

YES

OTHER

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

6 mm

TPS65986ABZQZR by Texas Instruments

TPS65986ABZQZR

Texas Instruments

TPS65986ABZQZR by Texas Instruments is a 96-terminal IC with supply voltage range of 2.85-3.45V, operating temp -10 to 85°C. It features grid array package style, suitable for interface circuits in compact electronic devices due to its thin profile and fine pitch design.

INTERFACE CIRCUIT

S-PBGA-B96

e1

6 mm

3

1

96

85 Cel

-10 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

3.45 V

2.85 V

3.3 V

YES

OTHER

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

6 mm

NVT4857UKZ by NXP Semiconductors

NVT4857UKZ

NXP Semiconductors

NXP Semiconductors' NVT4857UKZ is a 20-terminal interface IC with a supply voltage range of 2.9V to 3.6V, suitable for industrial applications. It features a very thin profile package style and operates b/w -40°C to 85°C. The IC is designed for surface mount assembly and has a rectangular shape with a grid array package body material made of plastic/epoxy.

INTERFACE CIRCUIT

R-PBGA-B20

2.1 mm

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.53 mm

3.6 V

2.9 V

3 V

YES

INDUSTRIAL

BALL

.4 mm

BOTTOM

1.7 mm

DS250DF810ABVR by Texas Instruments

DS250DF810ABVR

Texas Instruments

DS250DF810ABVR by Texas Instruments is an 8-channel interface IC with a max operating temperature of 85°C. It features a grid array package style, surface mount capability, and tin silver copper terminal finish. Ideal for applications requiring high-speed data transmission in various electronic devices.

INTERFACE CIRCUIT

R-PBGA-B135

e1

3

8

1

135

85 Cel

-10 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

260

YES

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

IP4856CX25/CZ by Nexperia

IP4856CX25/CZ

Nexperia

IP4856CX25/CZ by Nexperia is a 25-terminal interface IC with a supply voltage range of 1.7V to 3.6V. It features a very thin profile, fine pitch grid array package and operates in industrial temperature range (-40°C to 85°C). Ideal for applications requiring precise interface circuitry in compact spaces.

VSUPPLY VOLTAGE IS FROM 2.8 TO 3.6

INTERFACE CIRCUIT

S-PBGA-B25

2.05 mm

1

1

25

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.55 mm

3.6 V

1.7 V

1.8 V

YES

INDUSTRIAL

BALL

.4 mm

BOTTOM

30

2.05 mm

IP4855CX25/CAZ by Nexperia

IP4855CX25/CAZ

Nexperia

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 25; Package Code: VFBGA; Package Shape: SQUARE;

VSUPPLY VOLTAGE IS FROM 2.5 TO 5.5

INTERFACE CIRCUIT

S-PBGA-B25

2.04 mm

1

25

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.5 mm

3.6 V

1.1 V

1.8 V

YES

INDUSTRIAL

BALL

.4 mm

BOTTOM

NOT SPECIFIED

2.04 mm

IP4855CX25Z by Nexperia

IP4855CX25Z

Nexperia

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 25; Package Code: VFBGA; Package Shape: SQUARE;

VSUPPLY VOLTAGE IS FROM 2.5 TO 5.5

INTERFACE CIRCUIT

S-PBGA-B25

2.04 mm

1

25

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.5 mm

3.6 V

1.1 V

1.8 V

YES

INDUSTRIAL

BALL

.4 mm

BOTTOM

NOT SPECIFIED

2.04 mm

DS250DF410ABMR by Texas Instruments

DS250DF410ABMR

Texas Instruments

DS250DF410ABMR by Texas Instruments is a 4-channel interface IC with a package style of grid array, thin profile, and fine pitch. It operates in industrial temperature range (-40 to 85°C) and has bottom terminal position with tin silver copper finish. Ideal for applications requiring high-speed data transmission in compact electronic devices.

INTERFACE CIRCUIT

S-PBGA-B101

e1

6 mm

3

4

1

101

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.03 mm

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

6 mm

DS250DF410ABMT by Texas Instruments

DS250DF410ABMT

Texas Instruments

DS250DF410ABMT by Texas Instruments is a 4-channel interface IC with a package style of grid array, thin profile, and fine pitch. It operates in industrial temperature range (-40 to 85°C) with peak reflow temperature of 260°C. Suitable for applications requiring high-speed data transmission in compact electronic devices.

INTERFACE CIRCUIT

S-PBGA-B101

e1

6 mm

3

4

1

101

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.03 mm

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

6 mm

PI2EQX6814NJEX by Diodes Incorporated

PI2EQX6814NJEX

Diodes Incorporated

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE;

INTERFACE CIRCUIT

S-PBGA-B100

11 mm

1

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LBGA

BGA100,10X10,40

SQUARE

GRID ARRAY, LOW PROFILE

1.7 mm

1.26 V

1.14 V

1.2 V

YES

INDUSTRIAL

BALL

1 mm

BOTTOM

11 mm

PI2EQX6814NJE by Diodes Incorporated

PI2EQX6814NJE

Diodes Incorporated

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE;

INTERFACE CIRCUIT

S-PBGA-B100

11 mm

1

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LBGA

BGA100,10X10,40

SQUARE

GRID ARRAY, LOW PROFILE

1.7 mm

1.26 V

1.14 V

1.2 V

YES

INDUSTRIAL

BALL

1 mm

BOTTOM

11 mm

TDA8026ET/C3K by NXP Semiconductors

TDA8026ET/C3K

NXP Semiconductors

INTERFACE CIRCUIT; Terminal Form: BALL; No. of Terminals: 64; Package Code: TFBGA; Package Shape: SQUARE; Package Equivalence Code: BGA64,8X8,32;

INTERFACE CIRCUIT

S-PBGA-B64

7 mm

2

1

64

85 Cel

-25 Cel

PLASTIC/EPOXY

TFBGA

BGA64,8X8,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.2 mm

5.5 V

2.7 V

3.3 V

YES

BALL

.8 mm

BOTTOM

7 mm

DS150DF1610FB/NOPB by Texas Instruments

DS150DF1610FB/NOPB

Texas Instruments

DS150DF1610FB/NOPB by Texas Instruments is a 16-channel interface IC with a supply voltage range of 2.375V to 2.625V. It features a grid array package style, operates b/w -10°C to 85°C, and has a peak reflow temperature of 245°C. This IC is suitable for applications requiring high-speed data transmission in electronic systems.

INTERFACE CIRCUIT

S-PBGA-B196

e1

15.05 mm

4

16

1

196

85 Cel

-10 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

2.94 mm

2.625 V

2.375 V

2.5 V

YES

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

15.05 mm

DS250DF210ABMR by Texas Instruments

DS250DF210ABMR

Texas Instruments

DS250DF210ABMR by Texas Instruments is a 2-channel interface IC with a temperature range of -40 to 85°C. It features a grid array package style, 0.5mm terminal pitch, and TSC terminal finish. Ideal for industrial applications requiring high-speed data transmission in compact spaces.

INTERFACE CIRCUIT

S-PBGA-B101

e1

6 mm

3

2

1

101

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.03 mm

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

6 mm